• 한국전기전자재료학회논문지
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• 제15권6호
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• pp.486-491
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• 2002

We have fabricated $Bi_{3.25}La_{0.75}Ti_3O_12$ (BLT) thin films on the Pt/Ti/$SiO_2$/Si substrates using a metalorganic decomposition (MOD) method with annealing temperature from $550^{\circ}C$ to $750^{\circ}C$. The structural properties of BLT films examined by x-ray diffraction (XRD). From XRD analysis. BLT thin films show polycrystalline structure. The layered-perovskite phase was obtained by spin-on films at above $600^{\circ}C$ for 1h. Scanning electron microscopy (SEM) showed uniform surface composed of rodlike grains. The grain size of BLT films increased with increasing annealing temperature. The BLT film annealed at $650^{\circ}C$ was measured to have a dielectric constant of 279, dielectric loss of 1.85(%), remanent polarization of $25.66\mu C/\textrm{cm}^2$, and coercive field of 84.75 kV/cm. The BLT thin films showed little polarization fatigue test up to $3.5{\times}10^9$ bipolar cycling at 5 V and 100 kHz.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.420-423
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• 2003

[ $TiO_2$ ] thin films were fabricated by DC magnetron sputtering system at by controlling deposition times, ratios of $Ar:O_2$ partial presser ratio and substrate conditions. And the surface, cross-section morphology, microstructure, and composition ratio of the films were analyzed by FE-SEM, TEM and XPS. Besides, the optical absorption and transmittance of the $TiO_2$ films were measured by a UV-VIS-NIR Spectrophotometer, and photocatalytic properties were studied by G C Analyzer & Data Analysis system. As the result, when $TiO_2$ thin film was made at deposition time of 120[min] and $Ar:O_2$ ratio of 60:40, the best structural and optical properties among many thin films could be accepted. The best results of properties were as follows: thickness; $360{\sim}370[nm]$, grain size; 40[m], gap between two peak binding energy, $5.8{\pm}0.05[eV]$ ($2p_{3/2}$ peak and $2p_{1/2}$ peak of Ti was show at $458.3{\pm}0.05[eV]$ and $464.1{\pm}0.05[eV]$ respectively), binding energy; $530{\pm}0.05\;[eV]$, opticalenergy band gap; 3.4[eV].

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.154-157
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• 2003

$TiO_2$ thin films were fabricated by RF magnetron sputtering system at by controlling deposition times, ratios of $Ar:O_2$ partial presser ratio and substrate conditions. And the surface, cross-section morphology, microstructure, and composition ratio of the films were analyzed by FE-SEM, TEM and XPS. Besides, the optical absorption and transmittance of the $TiO_2$ films were measured by a UV-VIS-NIR Spectrophotometer, and photocatalytic properties were studied by G${\cdot}$C Analyzer & Data Analysis system. As the result, when $TiO_2$ thin film was made at deposition time of 120[min] and $Ar:O_2$ ratio of 60:40, the best structural and optical properties among many thin films could be accepted. The best results of properties were as follows: thickness; 360~370[nm), grain size; 40[nm], gap between two peak binding energy; $5.8{\pm}0.05[eV]$ ($2_{p3/2}$ peak and $2_{p1/2}$ peak of Ti was show at $458.3{\pm}0.05[eV]$ and $464.1{\pm}0.05[eV]$ respectively), binding energy; $530{\pm}0.05[eV]$, optical energy band gap; 3.4[eV].

• 한국재료학회지
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• 제9권4호
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• pp.386-391
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• 1999

The charge-discharge, the high-rate dischargeability, and the self discharge characteristics of the electrodes composed of rapidly solidified ZrV\ulcornerMn\ulcornerMo\ulcornerNi\ulcorneralloy, which has the form of partial substitution of Mn, Mo, Ni for V in $ZrV_2$ were studied. The alloys were prepared using Arc & RSP(Rapid Solidification Process) at the rotating roller speed of 2000 and 5000 rpm. Some of them were received heat treatment at$ 560 ^{\circ}C$ for 1 hour after the solidification to investigate the effect of the heat treatment. It was fond that cycle life was significantly improved by RSP, whereas discharge capacity, activation rte and high rate dischargeability were decreased compared with the conventional arc melting method. The capacity loss seems to be due to the loss of the crystallinity and the increase of the cycle life ascribed to the presence of the amporphous phase as well as the refined grain size of less than 0.2$\mu\textrm{m}$. Heat treatment of the alloy cooled at 2000 rpm improved the cycle life. In case of the alloys cooled at 5000 rpm, both the discharge capacity and the activation rate were significantly improved by the heat treatment.

• 한국진공학회지
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• 제8권3A호
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• pp.231-237
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• 1999

$SrBi_{22.4}Ta_2O_9$ (SBT) thin films of 70~150 nm thickness were prepared on platinized silicon substrates by Liquid Source Misted Chemical Deposition (LSMCD) process, and their microstructure, feroelectric and leakage current characteristics were investigated. By annealing at $800^{\circ}C$ for 1 hour in oxygen ambient, SBT films were fully crystallized to the Bi layered perovskite structure without preferred orientation. The grain size of the LSMCD- derived SBT films was about 100nm, and was not varied with the film thickness. $2P_r$ and $E_c$ of the SBT films increased with decreasing the film thickness, and the 70nm-thick SBT film exhibited $2P_r$ of 17.8 $\mu$C/$\textrm{cm}^2$ and $E_c$ of 74kV/cm at applied voltage of 5V. Within the film thickness range of 70~150nm, the relative dielectric permittivity of the LSMCD-derived SBT film decreased with decreasing the film thickness. Leakage current densities lower than $10^{-7}\textrm{A/cm}^2$ at 5V were observed in the SBT films thicker than 125nm.

• 열처리공학회지
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• 제16권4호
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• pp.191-196
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• 2003

For improvement of the wear performance of Ti alloy, vacuum-carburizing technique was tried for the first time using propane atmosphere. During the low pressure carburizing carbide was formed at the surface and carbon transfer was occurred from the carbide to the matrix. It was found that: (i) surface hardness increased with the reduction of operating pressure and time; (ii) optimum hardness distribution could be obtained with the proper choice of temperature and carbon flux control; and, (iii) case depth was largely influenced not by time but by temperature. The two steps process was recommended for obtaining thick case depth and high surface hardness of Ti alloy. For the low oxygen partial pressure, it was necessary to introduce additional CO gas to the atmosphere.Grain boundary oxidation and non-uniformity could be prevented.

• 한국재료학회지
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• 제9권1호
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• pp.86-91
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• 1999

(001) $\textrm{SrTiO}_3$(STO) 기판위에 고온초전도 $\textrm{YBa}_{2}\textrm{Cu}_{3}\textrm{O}_{7-x}$(YBCO)박막을 이용한 계단형 모서리 임계접합을 제조하였다. STO (100) 단결정 기판위에 계단형 모서리(step-edge)를 제작하기 위한 이온밀링 마스크로 plasma enhanced chemical vapor deposition방법으로 증착된 diamond-like carbon (DLC) 박막을 사용하였고, oxygen reactive ion etch 방법으로 건식식각하였다. 이렇게 제작된 계단형 모서리 기판위에 c-축 수직한 YBCO 박막과 STO박막을 pulsed laser deposition방법으로 에피텍셜하게 증착하였다. 계단의 상층과 하층에서 모두 임계가 형성되었으며 이 접합의 임계온도는 77 K 이상이었고 16K에서 $\textrm{I}_{c}\textrm{R}_{n}$products가 7.5mV, 77 K에서 0.3mV의 값을 나타내었다. 이들 전류-전압 특성은 two noisy resistively shunted Josephson junction 모델을 잘 만족하였다.

• 한국재료학회지
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• 제2권1호
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• pp.12-18
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• 1992

등온용량과도분광법(Isothermal Capacitance Transient spectroscopy)을 이용하여 ZnO 바리스터의 포획준위를 결정하였다. 여기서 등온용량과도분광기는 YHP 4192A 임피던스 Analyzer와 데이터해석을 위한 개인용 컴퓨터로 구성된다. 이 실험에서 우리는 $ZnO-Bi_2O_3$에 MnO 및 CoO를 첨가한계에서 $-40^{\circ}C~60^{\circ}C$ 온도범위에서 0.28, 0.48, 0.50, 0.94eV 등의 입계포획준위가 존재함을 볼 수 있었다. 또한, $ZnO-Bi_2O_3$계는 CoO를 첨가하면 hole에 의한 emission특성을 나타내고, MnO를 첨가하면 전자에 의한 emission특성을 나타냄을 알 수 있었다. 그리고 비 직선저항계수 $\alpha$는 도너농도의 감소에 직접적으로 비례하였으나, 포획준위의 밀도와는 별다른 비례관계를 발견할 수 없었다. 결론적으로 $ZnO-Bi_2O_3-MnO$계에 CoO를 첨가함에 따라 $\alpha$값이 증가하는 한편, 포획준위밀도는 CoO의 첨가로 감소함을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.375-378
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• 2004

ZnO varistor ceramics were fabricated with variation of addition of glass-frit amount and the sintering temperature was $1150^{\circ}C$. The average grain sizes were showed decreased from $8.6\;{\mu}m$ to $10\;{\mu}m$, and varistor voltages were decreased from 506 V to 460 V by added amount of glass-frit. Nonlinear coefficient ${\alpha}$, of all were with increasing the amount of glass-frit more than 60, in case of added on 0.03wt% glass-frit was 83. And leakage current were less than $1{\mu}A$ with applied at 82% of varistor voltage. The clamping voltage ratio of the specimes added 0.03wt% glass-frit was 1.41 at applied 25A $[8/20{\mu}s]$. In the specimen added 0.03wt% glass-frit, endurence of surge current and deviation of varistor voltage were $6200A/cm^2$, $\Delta-1.67%$, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.526-529
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• 2002

Various fluoride films on a glass substrate were prepared and characterized in order to determine the best seed layer for a microcrystalline silicon (${\mu}c$-Si) film growth. Among the various group-IIA-fluoride systems, the $CaF_2$films on glass substrates illustrated (220) preferential orientation and a lattice mismatch of less than 0.7% with Si. $CaF_2$ films exhibited a dielectric constant between $4.1{\sim}5.2$ and an interface trap density ($D_{it}$ as low as $1.8{\times}10^{11}\;cm^{-2}eV^1$. Using the $CaF_2$/glass structure, we were able to achieve an improved ${\mu}c$-Si film at a process temperature of 300 $^{\circ}C$. We have achieved the ${\mu}c$-Si films with a crystalline volume fraction of 65%, a grain size of 700 ${\AA}$, and an activation energy of 0.49 eV.