• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회A
• /
• pp.1337-1342
• /
• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
• /
• pp.1-5
• /
• 1999

The critical currents I$_c$ of the YBCO grain boundaries of 90-degree [100] symmetric tilt showed a hysteretic behavior depending on how the external magnetic fields were applied. Near 77K for fields less than ${\sim}$1 T, the field-cooled I$_c$ of grain boundaries was larger than the zero-field-cooled I$_c$. This result is consistent with the model in which the grain-boundary vortices can be pinned by neighboring Abrikosov vortices in the nearby grains.

• 한국원자력학회:학술대회논문집
• /
• 한국원자력학회 1997년도 춘계학술발표회논문집(2)
• /
• pp.123-128
• /
• 1997

The effects of heat treatment on fatigue crack growth rates (FCGRs) of Inconel 690 have been investigated in terms of carbide morphology and grain size. Cycling tests in air at room temperature have shown that FCGR in low stress intensity factor range (ΔK) region can be effectively reduced by increasing the grain boundary carbide precipitate size and grain size. Decrease in FCGR is attributed to the crack tip blunting at the precipitates of grain boundary chromium carbides.

• 한국결정성장학회지
• /
• 제10권2호
• /
• pp.122-127
• /
• 2000

불규칙 입자형성을 갖는 Ce-TZP와 알루미나가 분산된 Ce-TZP 세라믹스를 세라아 도핑조선과 열처리 조건을 변화시켜 제조한 다음, 미세구조를 관찰하였다. 제조된 시편들은 상대밀도가 99% 이상인 고밀도의 소결체였으며, 정방정 및 입방정상 지르코니아 입자로 구성되었다. 도핑하지 않거나 소결만 시킨 시편의 경우 직선적인 입계와 정상적인 입자형성을 나타낸데 비하여 세리아를 침적법으로 도핑한 후 고온으로 열처리한 시편에서는 확산구동 입계이동이 일어나 입계 및 입자형성이 불규칙하였으며. 이러한 Ce-TZP에서는 입자당 평균 입계같이 정상입자에 비하여 크게 증가하였다. 알루미나를 분산시켜 소결한 {{{{ { Al}_{2 }{ O}_{3 } }}}}/Ce- TZP 시편의 경우, 알루미나 입자에 의해서 입성장이 크게 억제되었고, 세리아를 도핑한 후 소결과 열처리를 행한 {{{{ { Al}_{2 }{ O}_{3 } }}}}/Ce-TZP에서는 불규칙 입자형상이 형성되면서도 입성장이 억제되어 입자크기에 비하여 입계면적이 크게 증가하였다. 분산된 알루미나 입자들은 소결과 열처리 과정 중 입자크기가 증가하였고, 열처리 동안 많은 입자들이 입계에서 입내로 위치가 변화하였다. 정상적인 입자형성을 갖은 시편에서는 균열진전시 입계파괴가 주로 일어났으나 불규칙 입자형성을 갖는 시편에서는 주로 입내파괴가 관찰되었다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 D
• /
• pp.1738-1740
• /
• 1999

This paper deals with a novel structure of poly-Si solar cell. A solar cell conversion efficiency was degraded by grain boundary effect in Polycrystalline silicon. To reduce grain boundary effect, we performed a preferential grain boundary etching, $POCl_3$ n-type emitter doping, and then ITO film growth on poly-Si. Among the various preferential etchants, Schimmel etch solution exhibited the best result having grain boundary etch depth about $10{\mu}m$. RF magnetron sputter grown ITO films showed a low resistivity of $10^{-4}\Omega-cm$ and high transmittance of 85%. With well fabricated poly-Si solar cells. we were able to achieve as high as 15% conversion efficiency at the input power of 20mW/$cm^2$.

• 한국세라믹학회지
• /
• 제49권4호
• /
• pp.301-307
• /
• 2012

SiAlON glasses are silicates or alumino-silicates, containing Mg, Ca, Y or rare earth (RE) ions as modifiers, in which nitrogen atoms substitute for oxygen atoms in the glass network. These glasses are found as intergranular films and at triple point junctions in silicon nitride ceramics and these grain boundary phases affect their fracture behaviour. This paper provides an overview of the preparation of M-SiAlON glasses and outlines the effects of composition on properties. As nitrogen substitutes for oxygen in SiAlON glasses, increases are observed in glass transition temperatures, viscosities, elastic moduli and microhardness. These property changes are compared with known effects of grain boundary glass chemistry in silicon nitride ceramics. Oxide sintering additives provide conditions for liquid phase sintering, reacting with surface silica on the $Si_3N_4$ particles and some of the nitride to form SiAlON liquid phases which on cooling remain as intergranular glasses. Thermal expansion mismatch between the grain boundary glass and the silicon nitride causes residual stresses in the material which can be determined from bulk SiAlON glass properties. The tensile residual stresses in the glass phase increase with increasing Y:Al ratio and this correlates with increasing fracture toughness as a result of easier debonding at the glass/${\beta}-Si_3N_4$ interface.

• 산업기술연구
• /
• 제7권
• /
• pp.49-58
• /
• 1987

To investigate the effect of the Retrogression and Reaging (RRA) treatment on the strength and the stress corrosion cracking in AA 7039 the measurement of hardness, tensile properties and the time to failure in a constant rate method were measured. Transmission electron microscope was used to examine the microstructural changes within graln and grain boundary. The results show that the RRA treatment of the T6 condition results in a significant increase in the time to failure without sacrifying the original T6 strength. It is believed that high density and even distribution of precipitates in RRA condition were observed within grain so that the RRA condition could have similar strength to the T6 condition. The presence of fine dispersion of semicohernt ${\eta}^{\prime}$ transition phase is also believed to contribute to that effect. Examination of the grain boundary microstructure shows that the RRA treatments increases significantly the average size of the grain boundary preciptates. It is suggested that the benificial effect of the RRA treatment on the susceptibility to SCC be due to the increase in the size of grain boundary precipitates obtained during the retrogression treatment.

• 한국세라믹학회지
• /
• 제22권5호
• /
• pp.54-60
• /
• 1985

This study is concerned with the mechanism of PTCR in $BaTiO_3$ ceramics doped by $Nb^{+5}$ Since the vacancy compensation layer at the grain boundary of n-type doped $BaTiO_3$ ceramics has been known as a major factor for surface state to give PTCR phenomena the dependence of PTCR on such vacancy compensation layer was attemped to be confirmed experimentally in this study. For the experiment quenching and annealing at various temperature after sintering were adopted to induce difference in the thickness of vacancycompensation layer so as to exihibit difference of PTCReffect eachother. The TEX>$Ba^{++}$ cocentration at the grain and grain boundary was measured by EDAX to confirm the formation of the vacancy compensation layer. It was found that i)either decrease in the temperature for quenching ii) or increase in the temperature for annealing improves the PTCR effect clearly iii)increase in TEX>$Ba^{++}$ concentration at the grain boundary results in the improvement of PTCR effect. It was concluded that all the experimental results gave the evidence for the dependence of PTCR effect on the vacancy compensation layer at the grain boundary which had been induced possibly by the $Ba^{++}$ diffusion by the heat treatment conducted.

• 한국세라믹학회지
• /
• 제53권6호
• /
• pp.682-688
• /
• 2016

In $TiO_2$-CuO systems, low-temperature sinterability was investigated by a conventional sintering method. Sintering temperatures were set at under $950^{\circ}C$, at which the volume diffusion is inactive. The temperatures are less than the melting point of Ag ($961^{\circ}C$), which is often used as an internal conductor in low-temperature co-fired ceramic technology. To optimize the amount of CuO dopant, various dopant contents were added. The optimum level for enhanced densification was 2 wt% CuO. Excess dopants were segregated to the grain boundaries. The segregated dopants supplied a high diffusion path, by which grain boundary diffusion improved. At lower temperatures in the solid state region, grain boundary diffusion was the principal mass transport mechanism for densification. The enhanced grain boundary diffusion, therefore, improved densification. In this regard, the results of this study prove that the sintering mechanism was the same as that of activated sintering.

• Corrosion Science and Technology
• /
• 제2권2호
• /
• pp.82-87
• /
• 2003

Stress corrosion cracking of Alloy 600 and Alloy 690 has been studied with a C-ring specimen in 1%, 10% and 40% NaOH at $315^{\circ}C$. SCC test was performed at 200 mV above corrosion potential. Initial stress on the apex of C-ring specimen was varied from 300 MPa to 565 MPa. Materials were heat treated at various temperatures. SCC resistance of Ni-$_\chi$Cr-10Fe alloy increased as the Cr content of the alloy increased if the density of an intergranular carbide were comparable. SCC resistance of Alloy 600 increased in caustic solution as the product of coverage of an intergranular carbide in grain boundary, intergranular carbide thickness and Cr concentration at grain boundary increased. Low temperature mill annealed Alloy 600 with small grain size and without intergranular carbide was most susceptible to SCC. TT Alloy 690 was most resistant to SCC due to the high value of the product of coverage of an intergranular carbide in grain boundary, intergranular carbide thickness and Cr concentration at grain boundary. Dependency of SCC rate on stress and NaOH concentration was obtained.