• Korean Journal of Materials Research
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• v.10 no.9
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• pp.612-618
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• 2000

The WC/WC grain boundary structure and intergranular segregation in WC-Co and WC-VC-Co cemented carbides were investigated by high-resolution transmission electron microscopy and energy dispersive X-ray spectroscopy in order to elucidate whether contiguous boundaries were present or not at the atomic level. Some grain boundaries were separated by liquid phase, while others were contiguous at the atomic level. Cobalt was found to be segregated to WC/WC grain boundaries in WC-Co. Cobalt and vanadium were co-segregated to grain boundaries in WC-VC-Co. The segregation width in both materials was about 6 nm. These results suggest that the vanadium present in contiguous boundaries acts as an effective barrier to the migration of boundaries during sintering and annealing. This could explain the grain growth inhibiting mechanism of VC added to WC-Co.

• Corrosion Science and Technology
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• v.14 no.6
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• pp.313-324
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• 2015

Austenitic stainless steels have been widely used in many engineering fields because of their high corrosion resistance and good mechanical properties. However, welding or aging treatment may induce intergranular corrosion, stress corrosion cracking, pitting, etc. Since these types of corrosion are closely related to the formation of chromium carbide in grain boundaries, the alloys are controlled using methods such as lowering the carbon content, solution heat treatment, alloying of stabilization elements, and grain boundary engineering. This work focused on the effects of aging and UNSM (Ultrasonic Nano-crystal Surface Modification) on the intergranular corrosion of commercial 316L stainless steel and the results are discussed on the basis of the sensitization by chromium carbide formation and carbon segregation, residual stress, grain refinement, and grain boundary engineering.

• Journal of the Korean Ceramic Society
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• v.39 no.9
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• pp.818-821
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• 2002

The grain boundary resistivity of a 1-mol%-$Al_2O_3$-dopedd CaO-Stabilized Zirconia(CSZ) specimen was determined by impedance spectroscopy using sub-millimeter-scale electrodes. At the initial stage of sintering, the grain-boundary resistivity of the specimen interior was observed to be higher than that of the surface. However, upon further sintering the boundary resistivity of the specimen interior became lower than that of the surface. The results were explained in terms of a redistribution of the intergranular liquid phase. The liquid phase was predicted to initially coagulate at the interior of the specimen then spread outward during sintering.

• 한국초전도학회:학술대회논문집
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• 2008.08a
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• pp.39-39
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• 2008

• Journal of the Korean Ceramic Society
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• v.36 no.4
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• pp.354-359
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• 1999

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1998.03a
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• pp.65-71
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• 1998

The superplastic deformation behaviors of 7075Al alloy have been characterized experimentally and analyzed by the internal variable theory of inelastic deformation. A simple rheological model including the grain boundary sliding has been used to interpret the superplastic deformation behaviors. A series of load relaxation and tensile tests have been carried out for 7075Al alloy at the various temperatures. The superplastic deformation of 7075Al alloy is confirmed to consist of the grain boundary sliding and accommodating grain matrix defprmation.

• Journal of the Korean Ceramic Society
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• v.25 no.4
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• pp.390-398
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• 1988

Effects of atmospheres and adidtives on the grain growth of TiO2 ceramics were investigated. In the range of 1300~140$0^{\circ}C$, grain growth was increased in CO2 as compared with O2 atmosphere and the grain boundary migration activation energy was lower than the diffusion activation energy of oxygen ion in TiO2. Also, in the case of addition of oxides, the grain growth was increased by oxides acting as a acceptor andinhibited by oxides acting as a donor. From the above results, when the oxygen vacancy concentration was increased, the intrinsic grain boundary mobility was increased and the pore drag force was decreased due to the rapid densification. Also it seems that the pore was migrated by the surface diffusion rather than lattice diffusion.

• Journal of Magnetics
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• v.8 no.4
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• pp.157-159
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• 2003

The strengths of the inter-grain exchange interaction were evaluated for nanocrystalline $Nd_{2.33}Fe_{14}B_{1.06}Si_{0.21}$ magnets of different grain size by comparing the $_{i}H_{c}$ calculated by micromagnetics with the experiments. With increase of the grain boundary thickness to that of the magnet of grain diameter 12.4, 24.8, 37.2 and 49.6 nm, the strengh of the interaction in reference to that without the grain boundary phase decreases to 83％, 69％, 54％ and 42％.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.348-349
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• 2006

The plastic deformation behavior of cemented carbides is related to the WC grain boundary strength. Ab initio calculations predict that Co and Mn segregate to WC/WC grain boundaries. To experimentally study the effect of Mn, a WC-Co-Mn material was manufactured and compared to a WC-Co material. The microstructure was studied using scanning electron microscopy (SEM), including electron backscatter diffraction (EBSD). Special attention was paid to the WC grain size and the frequency of special low-energy grain boundaries. Mn was found to have negligible effect on both the WC grain growth and the fraction of $\sum2$ WC/WC boundaries in the as-sintered material.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.303-310
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• 2014

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.