• 한국수소및신에너지학회논문집
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• 제30권3호
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• pp.227-236
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• 2019

In this work, preparation and characterizations of hybrid membranes containing sulfonated poly(arylene ether sulfone) (SPES) and sulfonated poly(vinylidene fluoride-co-hexafluoropropylene) (SPVdF-co-HFP) (20, 30 or 40 wt%) were carried out. The structure of hybrid membranes was confirmed using X-ray diffraction (XRD) analysis and the Fourier transform infrared (FT-IR) spectroscopy. The prepared SPAES/SPVdF-30 membrane exhibits higher ionic conductivity of 68.9 mS/cm at $90^{\circ}C$ and 100% RH. Besides, the other studies showed that the hybrid membrane has good oxidation stability, thermal stability, and mechanical stability. Thus, we believe that the prepared hybrid membrane is suitable for the development of membranes for fuel cell applications.

• 열처리공학회지
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• 제36권4호
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• pp.206-214
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• 2023

Tungsten carbide has many industrial applications due to its high electrical and thermal conductivity, high melting temperature, high hardness and good chemical stability. Because tungsten carbide is difficult to sinter, it is sintered with nickel or cobalt as a binder and is currently used in nozzles, cutting tools, and molds. Alumina is reported to be a viable binder for tungsten carbide due to its higher oxidation resistance and lower cost than nickel and cobalt. The ultrafine tungsten carbide-graphene-alumina composites were rapidly sintered in a high frequency induction heating active sintering unit. The microstructure and mechanical properties (fracture toughness and hardness) of the composites were investigated and analyzed by Vickers hardness tester and electron microscope. Since the high-frequency induction heating sintering method enables high-speed sintering, ultrafine composites can be prepared by preventing grain growth. In the tungsten carbide-graphene-alumina composites, the grain size of tungsten carbide increased with the amount of alumina participation. The hardness and fracture toughness of the tungsten carbide-5% graphene- x% alumina (x = 0, 5, 10,15) composites were 5.1, 8.6, 8.6, and 8.4 MPa-m^1/2 and 2384, 2168, 2165, and 2102 kg/mm², respectively. The fracture toughness increased without a significant decrease in hardness. Sinterability was improved by adding alumina to tungsten carbide-graphene.

• 한국군사과학기술학회지
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• 제7권3호
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• pp.129-139
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• 2004

DXD-19 is a flexible sheet explosive, which is a new polymer-bonded explosives(PBX's). DXD-19 is relatively insensitive and can be extruded into various configurations to be applied to munitions. A typical application includes multi-point initiation for the warhead, cutting/severance devices and transfer lines. The DXD-19 composition employs a binder system derived from the thermoplastic elastomer(HyTemp 4454) containing $5\%$ OH terminated with isocyanate curable for increasing mechanical properties. The use of an elastomer CAB increases its mechanical properties and the use of an energetic plasticizer BDNPF/BDNPA(F/A) improves the process ability as well as energy contents. The composition of the extruded DXD-19 formulation is formed $\%$ weight of $PETN/HyTemp/ATEC/(F/A)/CAB=72\~73/12\~13/6\~7/6\~7/1\~2$. Our safety tests of DXD-19 shows Insensitivity to an impact test and friction test, good thermal stability and excellent mechanical properties.

• 대한전기학회논문지
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• 제37권10호
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• pp.683-693
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• 1988

For the economical and reasonable operation of electric power system according to continual increase of electric power demand and decrease of load factor, the potential application of superconducting magnertic energy storage [SMES] with high efficiency and fast response in the electric utility is receiving attractive attension. In the light of this background, to confirm the basic principle of SMES, theoretical study, design technique and fabrication procedure for superconducting coil, current lead, cryostat, measuring and protection system of SMES are described in detail. Especially, a new design technique for superconducting coil and current lead is porposed and it was proved experimentally by the performance test of SMES which is developed for the first time in our country. At the peak operating current 200A, the maximum magnetic field amd stored energy of the coil are 3.52T and 2500J, espectively. The thermal and mechanical stability of 2500J SMES is also confirmed experimetally by its characteristics test, AC loss, protection system, charge and discharge test. The experimetal results show good characteristics of energy storage system.

• 한국응용과학기술학회지
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• 제23권3호
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• pp.238-242
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• 2006

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, the electric conduction mechanism of PI Ultra-Thin Films was investigated at room temperature. At low electric field, ohmic conduction $(I{\propto}V)$ was observed and the calculated electrical conductivity was about $4.23{\times}10^{-15}{\sim}9.81{\times}10^{-15}\;S/cm$. At high electric field, nonohmic conduction $(I{\propto}V^2)$ was observed and the conduction mechanism was explained by space charge limited region effect. The dielectric constant of PI Ultra-Thin Films was about 7.0.

• 한국응용과학기술학회지
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• 제17권4호
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• pp.226-232
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• 2000

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, we have synthesized a polyamic acid(PAA), which is a precursor of the polyimide. To obtain the optimum conditions of polyamic acid alkylamine salt(PAAS) Langmuir-Blodgett(LB) film deposition, the ${\pi}-A$ isotherms were examined by varying subphase temperature, barrier moving speed and spreading amount of solution. Film formation was verified by measuring transfer ratio, absorption of UV/vis spectra and scanning electron microscope(SEM) images.

• 소성∙가공
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• 제24권2호
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.480-483
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• 2000

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, the electrical properties of PI LB films were investigated at room temperature. At low electric field, ohmic conduction(I∝V) was observed and the calculated electrical conductivity was about 9.7$\times$10$^{-15}$ S/cm. At high electric field, conduction(I∝V$^2$) was observed and the conduction mechanism was explained by space charge limited region effect. The dielectric constant of LB film was about 7.5.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.114-114
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• 2011

We report a high-performance and air-stable flexible and invisible semiconductor which can be substitute for the n-type organic semiconductors. N-type organic-inorganic nanohybrid superlattices were developed for active semiconducting channel layers of thin film transistors at low temperature of $150^{\circ}C$ by using molecular layer deposition with atomic layer deposition. In these nanohybrid superlattices, self-assembled organic layers (SAOLs) offer structural flexibility, whereas ZnO inorganic layers provide the potential for semiconducting properties, and thermal and mechanical stability. The prepared SAOLs-ZnO nanohybrid thin films exhibited good flexibility, transparent in the visible range, and excellent field effect mobility (> 7cm2/$V{\cdot}s$) under low voltage operation (from -1 to 3V). The nanohybrid semiconductor is also compatible with pentacene in p-n junction diodes.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.