• Title/Summary/Keyword: Gold Plating

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Wastewater Recycling from Electroless Printed Circuit Board Plating Process Using Membranes (분리막을 이용한 무전해 PCB 도금 폐수의 재활용)

  • 이동훈;김래현;정건용
    • Membrane Journal
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    • v.13 no.1
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    • pp.9-19
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    • 2003
  • Membrane process was investigated to recover process water and valuable gold from washing water of electroless PCB plating processes. The filtration experiments were carried out using not only a RO membrane test cell to determine suitable membrane for washing water but also spiral wound membrane modules of nanofiltration and reverse osmosis for scale-up. At first, RO-TL(tap water, low pressure), RO-BL(brackish water, low pressure) and RO-normal(for water purifier) sheet membranes made by Saehan Co. were tested, and the performance of RO-TL membrane showed most suitable f3r recovery of soft etching, catalyst and Ni washing waters. As a result of RO test cell, the experiments for scale-up were carried out using RO-TL modules far water purifier at 7bar and $25^{\circ}C $The permeate flux fur Au washing water was about 30 LMH, but Au rejection was less than 80%. The permeate fluxes for Pd, Ni and soft etching washing water were about 22, 17 and 10 LMH, respectively. The Pd, Ni and Cu rejections showed more than 85, 97 and 98% respectively. The nanofiltration module for water purifier was introduced to recover Au selectively from Au, Ni and Cu ions in Au washing water. Most of Ni and Cu ions in the feed washing water were removed, and only Au ion was existed 81.9% in the permeate. Furthermore, Au ion in the permeate was concentrated and recovered by RO-TL membrane module. Finally, Au was also able to recover effectively by using 4 inch diameter spiral wound modules of NF and RO-TL membranes, in series.

A Study on Terminology of Metal Handles in Traditional Korean Furniture - Focusing on Korean and Western Furniture - (한국전통가구의 금속 손잡이 영문표기 연구 - 한국 및 서구를 중심으로 -)

  • Moon, Sun-Ok
    • Journal of the Korea Furniture Society
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    • v.23 no.4
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    • pp.449-459
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    • 2012
  • The article aims to making a comparison between traditional Korean and Western furniture metal handles to give the detail information of the handle terms by analyzing the related literature including internet and interviews. In terms of that, the Korean and Western metal handles are compared in the types, components, materials, methods, and terms affecting the development made by the craftsmen before the Industrial Revolution about the mid or late 18th century. As a result, first, ring and drop pull handles were mostly and wooden knobs were a little used to open the furniture doors and drawers. The Korean drop pulls, Deulswae, came out after the ring pulls, Gori, while the Western drops called loop or bail handles as well, came out before the ring pulls. Second, the components were composed by ring, Gori, loop or bail, Deulswae, Post, Baemok, washer, Baemokbatchim, and backplate, Deulswaebatchim. Most of the Western handles were fastened by the bolt and nut, while the post of two strips, Baemok, fastened the Korean metal handles. Third, the metal handles were created of brass and iron mostly, gilded gold and silver. Forth, the method were largely used by casting, engraving, forging, plating, and hammering in the Korean handles, and by casting, molding, engraving, and stamped in the Western handles. Finally, the terms such as "knobs, pulls, drops, ring and drop pulls, loop or bail handles, posts, washers, backplate, casting, molding, engraving, forging, plating, and stamped" were clarified by the two comparison in Korean and English.

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A Study on the Yukyanggwan of Chung In-hak(1839-1919) (대사헌정인학(大司憲鄭寅學)(1839-1919)의 육량관소고(六梁冠小考))

  • Park, Sung-Sil
    • Journal of the Korean Home Economics Association
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    • v.44 no.1 s.215
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    • pp.131-138
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    • 2006
  • The yanggwan is a striped headpiece for civil and military officials worn with jebok, a costume for the royal ancestral worship ceremony, or jobok, a ceremonial costume for the courtier. It was called a jegwan when it was worn with a jebok. The geumgwan and jegwan are of the same style but the geumgwan has a gilded band and backside and the jegwan is mostly lacquered. The yanggwan was worn first with the jebok by the officials, both of which were received from the Chinese Ming dynasty in the 19th year of the King Gongmin's reign during the Goryeo period. The royal crown and court clothing system was two grades lower than the standard clothing code of the Ming dynasty of China. In the Joseon dynasty, the oyanggwan worn by the highest grade officials had five-stripes but was later replaced during the Daehan Empire by the seven-striped chilyanggwan used by Ming dynasty officials. Oyanggwans make up the majority of the surviving examples of these headpieces, with the exception of the six-striped yukyanggwan of Chung In-hak (1839-1919), the Minister of Justice, which originated in the Daehan Empire and whose owner is definitively known. The gilt portion of this yukyanggwan is finely engraved in relief with a bird, flower and tendril motif. The yukyanggwan is topped by a decorative bird ornament, called a jeongkkot. EDSS spectrum analysis of the gold plating reveals a composition of 51.32% gold and 10.34% silver. The yanggwan is composed of bamboo, mulberry paper and silk crepe. The black portions are lacquered. The individual yang is made with twisted mulberry paper.

Study of Material Features of Baekje Gilt-bronze Crowns (비파괴 분석법에 의한 백제 금동관 재질 특성 연구)

  • Kim, Seonggon
    • Conservation Science in Museum
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    • v.23
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    • pp.91-108
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    • 2020
  • This study conducted non-destructive analyses of the material features of seven gilt-bronze crowns of Baekje Kingdom that were excavated in the Cheonan, Gongju, Seosan, Iksan, Naju, and Hapcheon areas. A typical Baekje gilt-bronze crown has a conical inner crown and an outer crown embellished with vertical ornaments on the front and the back, a tube topped with a hemispherical ornament, and other ornamentation. Diverse designs (e.g., dragon, bonghwang, flowers, and plants) were applied using a range of techniques, including repoussé, chasing, openwork, and engraving. Formal features differ among the crowns according to their period of production and site of excavation. The substrate metal of the crowns is either pure copper or mixed copper with a small amount of lead. The crowns were amalgam-plated on the surface with pure gold or gold with a small amount of silver. The crown from Okjeon Tomb No. 23 in Hapcheon in the ancient Gaya region has a high silver content, which appears to be a regional feature. In addition, this crown from Okjeon Tomb No. 23, which can be categorized as Baekje-style gilt-bronze crown, seems to be plated at most three times, while the gilt-bronze crowns found within Baekje Kingdom territory were plated once or twice.

Comparative Study of Interfacial Reaction and Drop Reliability of the Sn-3.0Ag-0.5Cu Solder Joints on Electroless Nickel Autocatalytic Gold (ENAG) (Electroless Nickel Autocatalytic Gold (ENAG) 표면처리와 Sn-Ag-Cu솔더 간 접합부의 계면반응 및 취성파괴 신뢰성 비교 연구)

  • Jun, So-Yeon;Kwon, Sang-Hyun;Lee, Tae-Young;Han, Deog-Gon;Kim, Min-Su;Bang, Jung-Hwan;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.3
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    • pp.63-71
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    • 2022
  • In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.

Gilt-bronze Standing Avalokiteshvara from Gyuam-ri, Buyeo: The Structure and Production Technique (부여 규암리 출토 금동관음보살 입상의 형상과 제작기법)

  • Shin, Yongbi;Kim, Jiho
    • Conservation Science in Museum
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    • v.23
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    • pp.1-16
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    • 2020
  • In this paper, Gilt-bronze Standing Avaolkiteshvara (National Treasure No. 293, M355) excavated at Gyuam-ri in Buyeo was observed with a microscope to identify the production technique applied to it. It was also analyzed with XRF and hard X-ray to identify the composition and the surface treatment techniques and casting method applied. In this statue, Avalokiteshvara is standing upright on a lotus pedestal. The lotus designs on the pedestal and those on the shawl flowing down on both sides of the statue are characteristic of Buddhist statues from the seventh century or later. The use of supports to affix the outer and inner molds and traces of injected cast were observed in the interior of the pedestal. The blisters on the arms and pedestal created during the bronze casting indicate the use of lost-wax casting, which was popularly employed for the production of mid- or small-sized gilt-bronze Buddhist statues in ancient times. The composition analysis identified a copper-tin-lead ternary alloy in the interior of the statue that was conventional used in the sixth and seventh centuries. It is likely that this simple alloy was used to facilitate casting and produce clearer expressions of designs and ornaments on the statue. Mercury (Hg) was detected on the surface of the statue, indicating the use of amalgam-plating with gold (Au) dissolved in mercury. This plating method is a common surface treatment technique used for small gilt-bronze statutes in ancient Korea.

Sheathless electrospray ionization with integrated metal emitter on microfluidic device (전기 분무 이온화를 이용한 단백질 질량분석용 마이크로 유체 소자의 제작 및 실험)

  • Kim, Min-Su;Joo, Hwang-Soo;Lee, Kook-Nyung;Kim, Byung-Gee;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.2102-2104
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    • 2004
  • In this study, sheathless electrospray from PDMS/glass microchips with conducting metal emitter tip is described. A chip-based capillary electrophoresis/mass spectrometry (CE/MS) system has advantages of the CE separation and on-line electrospray detection of peptide solution. We have fabricated a new electrospray ionization(ESI) device composed of the metal emitter tip and CE separation channel monolithically in a glass microchip. The separation channel and metal emitter tip are fabricated using a glass wet etching and gold electro plating process, respectively. The fabricated micro electrospray chip was tested by spraying peptide sample for mass spectrometric analysis. Singlely-charged peak and doublely-charged peak of peptide were detected and further MS/MS fragmentation was performed in each peak. Direct comparisons with conventional glass or fused silica emitters showed very similar performance with respect to signal strength and stability.

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Development of 121 pins/mm2 High Density Probe Card using Micro-spring Architecture (마이크로 스프링 구조를 갖는 121 pins/mm2 고밀도 프로브 카드 제작기술)

  • Min, Chul-Hong;Kim, Tae-Seon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.9
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    • pp.749-755
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    • 2007
  • Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

Scientific Analysis of Baekje Earrings from Habjung-ri Site in Buyeo (부여 합정리 유적 출토 백제이식의 과학적 분석)

  • Cho, Hyunkyung;Jeon, Yuree;Eo, Jieun;Cho, Namchul
    • Conservation Science in Museum
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    • v.13
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    • pp.71-80
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    • 2012
  • So-hwan earring(small hoop earing) is orbicular earring that have only main hoop. In this study, So-hwan earring from Baekje tombs are analyzed scientifically and those is attempted to find the correlation between scientific results and historical constituent. Six earrings were excavated from Habjung-ri sites in Buyeo and formative features and material characteristics of them were analyzed by microscope and XRF. As a results, various toreutics about producing gold silver alloy, pressure welding and amalgam plating that existed in Baekje from Ungjin period to Sabi period.

Design and Fabrication of a Low-cost Wafer-level Packaging for RF Devices

  • Lim, Jae-Hwan;Ryu, Jee-Youl;Choi, Hyun-Jin;Choi, Woo-Chang
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.2
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    • pp.91-95
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    • 2014
  • This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.