• Proceedings of the Korea Concrete Institute Conference
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• 2004.11a
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• pp.409-412
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• 2004

Over last decade extensive researches have been undertaken on the strength behaviour of Fiber Reinforced Concrete(FRC) structures. But the use of Ultra-High Strength Steel Fiber Cementitious Concrete Composites is in its infancy and there is a few experiments, analysis method and design criteria on the structural elements constructed with this new generation material which compressive strength is over 150 MPa and characteristic behaviour on the failure status is ductile. The objective of this paper is to investigate and analyze the behaviour of reinforced rectangular structural members constructed with ultra high performance cementitious composites (UHPCC). This material is known as reactive powder concrete (RPC) mixed with domestic materials and its compressive strength is over 150MP. The variables of test specimens were shear span ratio, reinforcement ratio and fiber quantity. Even if there were no shear stirrups in test specimens, most influential variable to determine the failure mode between shear and flexural action was proved to be shear span ratio. The characteristics of ultra high-strength concrete is basically brittle, but due to the steel fiber reinforcement behaviour of this structure member became ductile after the peak load. As a result of the test, the stress block of compressive zone could be defined. The proposed analytical calculation of internal force capacity based by plastic analysis gave a good prediction for the shear and flexural strength of specimens. The numerical verification of the finite element model which constitutive law developed for Mode I fracture of fiber reinforced concrete correctly captured the overall behaviour of the specimens tested.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2004.11a
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• pp.323-328
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• 2004

According as the quantity of goods transported by ship is increasing about $7\%$ per year, a port environment is rapidly changing. To meet this situation successfully, the development of the next generation port loading and unloading system (LMTT) is studied. A Frame of shuttle car for LMTT(Linear Motor-based Transfer Technology) consist of three parts which are outer beam inner beam and cross boom. Outer boom supports a container and inner boom is a framework and cross boom reinforces outer and inner boom. In this study, we carried out the finite element analysis for the effect of cross boom on the strength and stiffness qf the frame according to the number if cross beam leading position of container, the distance ratio if inner boom from center.

• Journal of Navigation and Port Research
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• v.29 no.1 s.97
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• pp.77-82
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• 2005

According as the quantity of goods transported by ship is increasing, a port environment is rapidly changing To meet this situation successfully, the development of the next generation port loading and unloading system(LMTT) is studied A Frame of shuttle car for LMTT(Linear Motor-based Transfer Technology) consists of three parts which are outer beam, inner beam and cross beam In this study, we carried out the finite element analysis for the effect of cross beam on the strength and stiffness of the frame according to the number of cross beam, loading position of container, the distance ratio of inner beam from center. The result is as follow ; When the load is applied on outer beam and inner beam concurrently and the number of cross beam is 5, that is the optimum condition in frame design.

• Journal of Korean Society of Environmental Engineers
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• v.35 no.9
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• pp.660-665
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• 2013

To find out the major cause of scale formation in digestion facility, a componential analysis of scale and a digestion experiment for food wastewater were conducted. The analysis indicated that grease in food wastewater was closely connected to the organic component of scale. It is also indicated that grease-removed food wastewater showed 58.9% level compared to unprocessed one in crystal generation quantity in this study. The experiment provided insight that grease is one of the important causes of scale formation. Additionally, pre-removal of grease from food wastewater did not show negative effect on digestion gas production, as 68.7 L-gas/kg-COD for grease-removed food wastewater and 67.7 L-gas/kg-COD for unprocessed one.

• Journal of the Korea Organic Resources Recycling Association
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• v.9 no.4
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• pp.125-134
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• 2001

The purpose of this study is to provide basic information for a future countermeasure municipal and to establish several wastes policy after investigating solid wastes from Sunchon City. In addition, this research can be supported to manage of recycling plant and to reuse plant of each wastes. Results are as bellows after checking up and analysis type of waste in Sunchon city Unit solid waste generation rate from single family is $0.50kg/person{\cdot}day$, and total solid wastes are 41.9ton/day. Unit solid waste generation rate from apartments is $0.45kg/person{\cdot}day$, and solid wastes generation is 55.5ton/day. Unit solid waste generation rate from agricultural is $0.22kg/person{\cdot}day$ and total solid wastes are 13.5ton/day. That show total amount of municipal solid wastes from residential are 110.9ton/day. Unit solid waste generation rate from traditional markets is $1.85kg/person{\cdot}day$, and solid waste total volume is 5,400kg/day. Unit solid waste generation rate from small store is $2.03kg/person{\cdot}day$, and solid waste total are 25,101kg/day. Therefore, this show that total wastes are 30.50kg from downtown and commercial area. Solid waste quantity from Industrial area (Factory region) is 8.5ton and in case of school and hospitals are 7.2kg/day and 3.0kg/day. Solid waste amount from Institutional is 6.6kg/day. Food wastes were eliminated from municipal solid wastes as standard 63.4ton/day, and combustible wastes were 126.9ton/day. If it schedule about 5 years (by 2006) as durable year for food wastes treatment plant, it is expected 42.5ton/day for treatment capacity. We can judge that it is effective to be set 2 lines equipment ${\times}25ton/day$ as treatment ability under considering unexpected working condition such as any repair, trouble and an electrical load. If it schedule about 10 years (by 2011) as durable year for food wastes treatment plant, it is expected 150 ton/day for treatment capacity. We can conclude that it is effective to be set 2 lines equipment ${\times}80ton/day$ as treatment ability under considering working condition such as low loaded operating and the repair for incineration.

• Journal of Korean Home Economics Education Association
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• v.20 no.2
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• pp.31-46
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• 2008

The purpose of this study is to analyze the contents of elderly housing in the unit "Family Life & Housing" in Technology & Home Economics 9th grade textbooks. The results of this study are as follows: First, the contents, illustrations, pictures, floor-plans, graphs and tables in current unit "Family Life & Housing" varied widely among textbooks and some didn't even contain these informations. Illustrations and pictures which are suit to the content and which contain positive image of space and living should be chosen. Second, most of the contents about elderly housing were concentrated on the life cycle, three-generation housing and universal design, discussed in chapter 'utility of living space.' The unification of overlapped contents and description which don't have stereotype about elderly housing are needed. Not only the interior environment but also the exterior environment of the elders and life-support service for them should be included in the contents. Contents that reflect the change of future population composition and the ratio of three-generation household are required. The elderly housing floor plan needs to be diversified in quantity such as ones which reflect the Korean characteristics or ones which enable person an independent life.

• The Journal of Engineering Geology
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• v.22 no.2
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• pp.233-241
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• 2012

The objectives of this study were to test geothermal conductivity (k), water velocity, water quantity, and pipe pressure from a ground heat exchanger in the field, and then to analyze these data in relation to the effectiveness and economical efficiency for application of geothermal energy. After installation of the apparatus required for field tests, geothermal conductivity values were obtained from three different cases (second, third, and fourth). The k values of the second case (506 m depth) and third case (151 m depth) are approximately 2.9 and 2.8, respectively. The k value of the fourth case (506 m depth, double pipe) is 2.5, which is similar to the second and third cases. This result indicates that hole depth is a critical factor for geothermal applications. Analysis of the field data (k, water velocity, water quantity, and pipe pressure) reveals that a single geothermal system at 506 m depth is more economically efficient than three geothermal systems at depths intervals of 151 m. Although it is more expensive to install a geothermal system at 506 m depth than at 151 m depth, test results showed that the geothermal system of the fourth case (506 m, double pipe) is more economically efficient than the system at 151 m depth. Considering the optional cost of maintenance, which is a non-operational expense, the geothermal system of the fourth case is economically efficient. Large cities and areas with high land prices should make greater use of geothermal energy.

• Journal of Bio-Environment Control
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• v.28 no.3
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• pp.243-254
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• 2019

With the recent accelerated policy-making and interests in new renewable energy, plans to develop and supply the new renewable energy have been devised across multiple regions in Korea. Solar energy, in particular, is being applied to small-scale power supply in provincial areas, as solar cells are used to convert solar energy into electric energy to produce electric power. Nonetheless, in the case of solar power plants, the need for a large stretch of land and considerable sum of financial support implies that the planning step should take into consideration the most suitable meteorological and geographical factors. In this study, the proxy variables of meteorological and geographical factors associated with solar energy were considered in analyzing the vulnerable areas regarding the photovoltaic power generation facility across the nation. GIS was used in the spatial analysis to develop a map for assessing the optimal location for photovoltaic power generation facility. The final vulnerability map developed in this study did not reveal any areas that exhibit vulnerability level 5 (very high) or 1 (very low). Jeollanam-do showed the largest value of vulnerability level 4 (high), while a large value of vulnerability level 3 (moderate) was shown by several administrative districts including Gwangju metropolitan city, Jeollabuk-do, Chungcheongbuk-do, and Gangwon-do. A value of vulnerability level 2 (low) was shown by the metropolitan cities including Daegu, Ulsan, and Incheon. When the 30 currently operating solar power plants were compared and reviewed, most were found to be in an area of vulnerability level 2 or 3, indicating that the locations were relatively suitable for solar energy. However, the limited data quantity for solar power plants, which is the limitation of this study, prevents the accuracy of the findings to be clearly established. Nevertheless, the significance of this study lies in that an attempt has been made to assess the vulnerability map for photovoltaic power generation facility targeting various regions across the nation, through the use of the GIS-based spatial analysis technique that takes into account the diverse meteorological and geographical factors. Furthermore, by presenting the data obtained for all regions across the nation, the findings of this study are likely to prove useful as the basic data in fields related to the photovoltaic power generation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.