• 제목/요약/키워드: GaN power semiconductor

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MgxZn1-xO를 활용한 Multi-layer 구조 LED 특성에 관한 연구 (The Characteristics of Multi-layer Structure LED with MgxZn1-xO Thin Films)

  • 손지훈;김상현;장낙원;김홍승
    • 한국전기전자재료학회논문지
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    • 제25권10호
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    • pp.811-816
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    • 2012
  • The effect of co-sputtering condition on the structural properties of $Mg_xZn_{1-x}O$ thin films grown by RF magnetron co-sputtering system was investigated for manufacturing ZnO/MgZnO structure LED. $Mg_xZn_{1-x}O$ thin films were grown with ZnO and MgO target varying RF power. Structural properties were investigated by X-ray diffraction (XRD) and Energy dispersive spectroscopy (EDS). The ZnO thin films have sufficient crystallinity on the high RF power. As RF power of ZnO target increased, the contents of MgO in the $Mg_xZn_{1-x}O$ film decreased. LED was manufactured using ZnO/MgZnO multi-layer on p-GaN/$Al_2O_3$ substrate. Threshold voltage of multi-layer LED was appeared at 8 V, and it was luminesced at wave length of 550 nm.

InGaP/GaAs 이중접합 기반의 고효율 플렉시블 태양전지 제조기술 연구 (Flexible InGaP/GaAs Double-Junction Solar Cells Transferred onto Thin Metal Film)

  • 문승필;김영조;김강호;김창주;정상현;신현범;박경호;박원규;안연식;강호관
    • Current Photovoltaic Research
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    • 제4권3호
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    • pp.108-113
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    • 2016
  • III-V compound semiconductor based thin film solar cells promise relatively higher power conversion efficiencies and better device reliability. In general, the thin film III-V solar cells are fabricated by an epitaxial lift-off process, which requires an $Al_xGa_{1-x}As$ ($x{\geq}0.8$) sacrificial layer and an inverted solar cell structure. However, the device performance of the inversely grown solar cell could be degraded due to the different internal diffusion conditions. In this study, InGaP/GaAs double-junction solar cells are inversely grown by MOCVD on GaAs (100) substrates. The thickness of the GaAs base layer is reduced to minimize the thermal budget during the growth. A wide band gap p-AlGaAs/n-InGaP tunnel junction structure is employed to connect the two subcells with minimal electrical loss. The solar cell structures are transferred on to thin metal films formed by Au electroplating. An AlAs layer with a thickness of 20 nm is used as a sacrificial layer, which is removed by a HF:Acetone (1:1) solution during the epitaxial lift-off process. As a result, the flexible InGaP/GaAs solar cell was fabricated successfully with an efficiency of 27.79% under AM1.5G illumination. The efficiency was kept at almost the same value after bending tests of 1,000 cycles with a radius of curvature of 10 mm.

High Performance Flexible Inorganic Electronic Systems

  • 박귀일;이건재
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.115-116
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    • 2012
  • The demand for flexible electronic systems such as wearable computers, E-paper, and flexible displays has increased due to their advantages of excellent portability, conformal contact with curved surfaces, light weight, and human friendly interfaces over present rigid electronic systems. This seminar introduces three recent progresses that can extend the application of high performance flexible inorganic electronics. The first part of this seminar will introduce a RRAM with a one transistor-one memristor (1T-1M) arrays on flexible substrates. Flexible memory is an essential part of electronics for data processing, storage, and radio frequency (RF) communication and thus a key element to realize such flexible electronic systems. Although several emerging memory technologies, including resistive switching memory, have been proposed, the cell-to-cell interference issue has to be overcome for flexible and high performance nonvolatile memory applications. The cell-to-cell interference between neighbouring memory cells occurs due to leakage current paths through adjacent low resistance state cells and induces not only unnecessary power consumption but also a misreading problem, a fatal obstacle in memory operation. To fabricate a fully functional flexible memory and prevent these unwanted effects, we integrated high performance flexible single crystal silicon transistors with an amorphous titanium oxide (a-TiO2) based memristor to control the logic state of memory. The $8{\times}8$ NOR type 1T-1M RRAM demonstrated the first random access memory operation on flexible substrates by controlling each memory unit cell independently. The second part of the seminar will discuss the flexible GaN LED on LCP substrates for implantable biosensor. Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness compared to conventional incandescent lamps and OLED. However, due to the brittle property of bulk inorganic semiconductor materials, III-V LED limits its applications in the field of high performance flexible electronics. This seminar introduces the first flexible and implantable GaN LED on plastic substrates that is transferred from bulk GaN on Si substrates. The superb properties of the flexible GaN thin film in terms of its wide band gap and high efficiency enable the dramatic extension of not only consumer electronic applications but also the biosensing scale. The flexible white LEDs are demonstrated for the feasibility of using a white light source for future flexible BLU devices. Finally a water-resist and a biocompatible PTFE-coated flexible LED biosensor can detect PSA at a detection limit of 1 ng/mL. These results show that the nitride-based flexible LED can be used as the future flexible display technology and a type of implantable LED biosensor for a therapy tool. The final part of this seminar will introduce a highly efficient and printable BaTiO3 thin film nanogenerator on plastic substrates. Energy harvesting technologies converting external biomechanical energy sources (such as heart beat, blood flow, muscle stretching and animal movements) into electrical energy is recently a highly demanding issue in the materials science community. Herein, we describe procedure suitable for generating and printing a lead-free microstructured BaTiO3 thin film nanogenerator on plastic substrates to overcome limitations appeared in conventional flexible ferroelectric devices. Flexible BaTiO3 thin film nanogenerator was fabricated and the piezoelectric properties and mechanically stability of ferroelectric devices were characterized. From the results, we demonstrate the highly efficient and stable performance of BaTiO3 thin film nanogenerator.

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Buried-Ridge Waveguide Laser Diode 제작 및 특성평가 (Fabrication and characterization of InGaAsP/InP multi-quantum well buried-ridge waveguide laser diodes)

  • 오수환;이지면;김기수;이철욱;고현성;박상기
    • 한국광학회지
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    • 제14권6호
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    • pp.669-673
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    • 2003
  • 본 연구에서는 기존의 ridge waveguide laser diode(RWG LD)보다 ridge폭에 따른 측방향 단일모드 특성이 우수하고 planar 화에 유리하며 측방향의 유효 굴절률차를 ridge 구조에 추가로 성장된 InGaAsP층의 두께로 조절이 가능한 Buried RWG LD를제작하였다. 본 연구에서는 Buried RWG LD를 CBE장치로 InGaAs/InGaAsP multiple quantum well(MQW) 에피 웨이퍼를 성장하고, LPE로 재성장하여 B-RWG LD를 제작하였다. 또한 ridge 폭을 5 $\mu\textrm{m}$와 7 $\mu\textrm{m}$로 하여 B-RWG LD를 제작하고 특성을 비교하여 보았다. 제작된 7 $\mu\textrm{m}$ B-RWG LD에서 광출력이 20㎽에 이를 때까지 고차모드 발진에 의한 kink현상이 일어나지 않았으며, 포화 광출력이 80 ㎽ 이상임을 확인하였다. 제작된 B-RWG LD가 측방향 단일모드로 동작함을 확인하기 위해 FFP을 측정한 결과, ridge 폭이 5 $\mu\textrm{m}$일 때는 2.7I$_{th}$ , ridge 폭이 7 $\mu\textrm{m}$일 때는 2.4I$_{th}$ 까지 단일모드로 동작함을 확인할 수 있다.

N2와 NH3 반응성가스를 사용하여 마그네트론 스퍼터링법으로 제작한 AlN박막의 특성 (Characteristics of AlN Thin Films by Magnetron Sputtering System Using Reactive Gases of N2 and NH3)

  • 한창석
    • 한국재료학회지
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    • 제25권3호
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    • pp.138-143
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    • 2015
  • Aluminum nitride, a compound semiconductor, has a Wurtzite structure; good material properties such as high thermal conductivity, great electric conductivity, high dielectric breakdown strength, a wide energy band gap (6.2eV), a fast elastic wave speed; and excellent in thermal and chemical stability. Furthermore, the thermal expansion coefficient of the aluminum nitride is similar to those of Si and GaAs. Due to these characteristics, aluminum nitride can be applied to electric packaging components, dielectric materials, SAW (surface acoustic wave) devices, and photoelectric devices. In this study, we surveyed the crystallization and preferred orientation of AlN thin films with an X-ray diffractometer. To fabricate the AlN thin film, we used the magnetron sputtering method with $N_2$, NH3 and Ar. According to an increase in the partial pressures of $N_2$ and $NH_3$, Al was nitrified and deposited onto a substrate in a molecular form. When AlN was fabricated with $N_2$, it showed a c-axis orientation and tended toward a high orientation with an increase in the temperature. On the other hand, when AlN was fabricated with $NH_3$, it showed a-axis orientation. This result is coincident with the proposed mechanism. We fabricated AlN thin films with an a-axis orientation by controlling the sputtering electric power, $NH_3$ pressure, deposition speed, and substrate temperature. According to the proposed mechanism, we also fabricated AlN thin films which demonstrated high a-axis and c-axis orientations.

나노크기 표면 요철을 이용한 GaN LED의 광추출효율 향상 (Enhancement of Light Extraction Efficiency of GaN Light Emitting Diodes Using Nanoscale Surface Corrugation)

  • 정재우;김사라;정준호;정종율
    • 한국재료학회지
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    • 제22권11호
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    • pp.636-641
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    • 2012
  • In this study, we have investigated highly efficient nanoscale surface corrugated light emitting diodes (LEDs) for the enhancement of light extraction efficiency (LEE) of nitride semiconductor LEDs. Nanoscale indium tin oxide (ITO) surface corrugations are fabricated by using the conformal nanoimprint technique; it was possible to observe an enhancement of LEE for the ITO surface corrugated LEDs. By incorporating this novel method, we determined that the total output power of the surface corrugated LEDs were enhanced by 45.6% for patterned sapphire substrate LEDs and by 41.9% for flat c-plane substrate LEDs. The enhancement of LEE through nanoscale surface corrugations was studied using 3-dimensional Finite Different Time Domain (FDTD) calculation. From the FDTD calculations, we were able to separate the light extraction from the top and bottom sides of device. This process revealed that light extraction from the top and bottom sides of a device strongly depends on the substrate and the surface corrugation. We found that enhanced LEE could be understood through the mechanism of enhanced light transmission due to refractive index matching and the increase of light scattering from the corrugated surface. LEE calculations for the encapsulated LEDs devices also revealed that low LEE enhancement is expected after encapsulation due to the reduction of the refractive index contrast.

EFG 법으로 성장시킨 β-Ga2O3 단결정의 다양한 결정면, off-angle에 따른 epitaxial layer의 특성 분석 (Characterization of epitaxial layers on beta-gallium oxide single crystals grown by EFG method as a function of different crystal faces and off-angle)

  • 채민지;서선영;장희연;신소민;김대욱;김윤진;박미선;정광희;강진기;이해용;이원재
    • 한국결정성장학회지
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    • 제34권4호
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    • pp.109-116
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    • 2024
  • β-Ga2O3는 4.9 eV의 넓은 밴드갭과 8 MV/cm의 높은 항복전압으로 전력 소자 응용 분야에서 많은 관심을 받고 있는 대표적인 UWBG(Ultra-wide Band-gap) 반도체이다. 또한 용액 성장이 가능하기 때문에 SiC, GaN에 비해 성장 속도가 빠르고 생산 비용이 저렴하다는 장점이 있다[1,2]. 본 연구에서는 EFG(Edge-defined Film-fed Growth) 법을 통해 Si 도핑 된 β-Ga2O3 단결정을 성장시키는 데에 성공하였다. 성장 방향과 성장 주 면은 각각 [010] / (001)로 설정하였으며 성장속도는 7~20 mm/h이다. 성장시킨 β-Ga2O3 단결정은 다양한 결정 면 방향(001, 100, ${\bar{2}}01$)과 off-angle(1o, 3o, 4o)에 따라 절단하여 표면 가공을 진행하였고, 가공 후 HVPE(Halide vapor phase epitaxy) 법을 이용해 epi-ready 기판 위에 homoepitaxial 층을 성장시켰다. 가공 후의 샘플과 epi-layer를 성장시킨 샘플을 XRD, AFM, OM, Etching 등의 분석을 통해 결정면과 off-angle에 따른 표면 특성을 비교하였다.

Optical transition dynamics in ZnO/ZnMgO multiple quantum well structures with different well widths grown on ZnO substrates

  • Li, Song-Mei;Kwon, Bong-Joon;Kwack, Ho-Sang;Jin, Li-Hua;Cho, Yong-Hoon;Park, Young-Sin;Han, Myung-Soo;Park, Young-Sik
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.121-121
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    • 2010
  • ZnO is a promising material for the application of high efficiency light emitting diodes with short wavelength region for its large bandgap energy of 3.37 eV which is similar to GaN (3.39 eV) at room temperature. The large exciton binding energy of 60 meV in ZnO provide provides higher efficiency of emission for optoelectronic device applications. Several ZnO/ZnMgO multiple quantum well (MQW) structures have been grown on various substrates such as sapphire, GaN, Si, and so on. However, the achievement of high quality ZnO/ZnMgO MQW structures has been somehow limited by the use of lattice-mismatched substrates. Therefore, we propose the optical properties of ZnO/ZnMgO multiple quantum well (MQW) structures with different well widths grown on lattice-matched ZnO substrates by molecular beam epitaxy. Photoluminescence (PL) spectra show MQW emissions at 3.387 and 3.369 eV for the ZnO/ZnMgO MQW samples with well widths of 2 and 5 nm, respectively, due to the quantum confinement effect. Time-resolved PL results show an efficient photo-generated carrier transfer from the barrier to the MQWs, which leads to an increased intensity ratio of the well to barrier emissions for the ZnO/ZnMgO MQW sample with the wider width. From the power-dependent PL spectra, we observed no PL peak shift of MQW emission in both samples, indicating a negligible built-in electric field effect in the ZnO/$Zn_{0.9}Mg_{0.1}O$ MQWs grown on lattice-matched ZnO substrates.

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중성빔 식각을 이용한 Metal Gate/High-k Dielectric CMOSFETs의 저 손상 식각공정 개발에 관한 연구

  • 민경석;오종식;김찬규;염근영
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.287-287
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    • 2011
  • ITRS(international technology roadmap for semiconductors)에 따르면 MOS (metal-oxide-semiconductor)의 CD(critical dimension)가 45 nm node이하로 줄어들면서 poly-Si/SiO2를 대체할 수 있는 poly-Si/metal gate/high-k dielectric이 대두되고 있다. 일반적으로 metal gate를 식각시 정확한 CD를 형성시키기 위해서 plasma를 이용한 RIE(reactive ion etching)를 사용하고 있지만 PIDs(plasma induced damages)의 하나인 PICD(plasma induced charging damage)의 발생이 문제가 되고 있다. PICD의 원인으로 plasma의 non-uniform으로 locally imbalanced한 ion과 electron이 PICC(plasma induced charging current)를 gate oxide에 발생시켜 gate oxide의 interface에 trap을 형성시키므로 그 결과 소자 특성 저하가 보고되고 있다. 그러므로 본 연구에서는 이에 차세대 MOS의 metal gate의 식각공정에 HDP(high density plasma)의 ICP(inductively coupled plasma) source를 이용한 중성빔 시스템을 사용하여 PICD를 줄일 수 있는 새로운 식각 공정에 대한 연구를 하였다. 식각공정조건으로 gas는 HBr 12 sccm (80%)와 Cl2 3 sccm (20%)와 power는 300 w를 사용하였고 200 eV의 에너지로 식각공정시 TEM(transmission electron microscopy)으로 TiN의 anisotropic한 형상을 볼 수 있었고 100 eV 이하의 에너지로 식각공정시 하부층인 HfO2와 높은 etch selectivity로 etch stop을 시킬 수 있었다. 실제 공정을 MOS의 metal gate에 적용시켜 metal gate/high-k dielectric CMOSFETs의 NCSU(North Carolina State University) CVC model로 effective electric field electron mobility를 구한 결과 electorn mobility의 증가를 볼 수 있었고 또한 mos parameter인 transconductance (Gm)의 증가를 볼 수 있었다. 그 원인으로 CP(Charge pumping) 1MHz로 gate oxide의 inteface의 분석 결과 이러한 결과가 gate oxide의 interface trap양의 감소로 개선으로 기인함을 확인할 수 있었다.

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