• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.3-3
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• 2009

• ETRI Journal
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• 제31권5호
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• pp.601-603
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• 2009

This letter presents a high performance 2.4 GHz two-stage power amplifier (PA) operating in the temperature range from $-30^{\circ}C$ to $+85^{\circ}C$ for IEEE 802.11g, wireless local area network application. It is implemented in InGaP/GaAs hetero-junction bipolar transistor technology and has a bias circuit employing a temperature compensation technique for error vector magnitude (EVM) performance. The technique uses a resistor made with a base layer of HBT. The design improves EVM performance in cold temperatures by increasing current. The implemented PA has a dynamic EVM of less than 4%, a gain of over 26 dB, and a current less than 130 mA below the output power of 19 dBm across the temperature range from $-30^{\circ}C$ to $+85^{\circ}C$.

• ETRI Journal
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• 제26권1호
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• pp.61-64
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• 2004

We have explored the fabrication of an InP/InGaAs single heterojunction bipolar transistor (HBT) and a wave guide p-i-n photodiode (PD) on two kinds of double stacked layers for the implementation of an optoelectronic millimeter-wave monolithic integrated circuit (OEMMIC). We applied a photosensitive polyimide for passivation and integration to overcome the large difference between the HBT and PD layers of around $3{\mu}m$. Our experiment showed that the RF characteristics of the HBT were dependent on the location of the PD layer, while the dc performances of the HBTs and PDs were independent of the type of stacked layer used. The $F_t$ and $F_{max}$ of the HBTs on the HBT/PD stacked layer were 10% lower than those of the HBTs on the PD/HBT stacked layer.

• ETRI Journal
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• 제27권1호
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• pp.75-80
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• 2005

This paper addresses a fully-integrated low phase noise X-band oscillator fabricated using a carbon-doped InGaP heterojunction bipolar transistor (HBT) GaAs process with a cutoff frequency of 53.2 GHz and maximum oscillation frequency of 70 GHz. The oscillator circuit consists of a negative resistance generating circuit with a base inductor, a resonating emitter circuit with a microstrip line, and a buffering resistive collector circuit with a tuning diode. The oscillator exhibits 4.33 dBm output power and achieves -127.8 dBc/Hz phase noise at 100 kHz away from a 10.39 GHz oscillating frequency, which benchmarks the lowest reported phase noise achieved for a monolithic X-band oscillator. The oscillator draws a 36 mA current from a 6.19 V supply with 47.1 MHz of frequency tuning range using a 4 V change. It occupies a $0.8mm{\times}0.8mm$ die area.

• 한국전자파학회지:전자파기술
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• 제11권2호
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• pp.2-11
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• 2000

밀리미터파 회로 제작에 필수적인 능동소자인 고 속 Transistor기술은 반도체 설계 및 공정기술의 발 전으로 급격히 발달하고 있다. 주로 GaAs계나 InP 계 III-V 화합물 반도체를 이용한 고주파 transistor 는 FET기반의 MODFET과 BJT기반의 HBT가 밀 리미터파 대역에서 응용된다. 전통적인 III-V족 반 도체 이외에 SiGe와 GaN 소자 기술 역시 급속한 발전을 이루고 있다. 본 논문에서는 밀리미터파 transistor 기술에 대한 기본적인 내용과 응용 예를 소개한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.229-232
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• 2000

InP/lnGaAs HPT's were fabricated by employing Indium Tin Oxide(ITO) transparent emitter contact. The device showed the current gaing 70 was obtained but the emitter series resistance was significantly increased. the electrical charateristics of the device were similar to HBT's. However Vceoff was shifted the positive direction. Such a shift ma be resulted from the formation of the shottky barrier rather than the ohmic contact between ITO and n+ InP emitter.

• 전자공학회논문지A
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• 제32A권11호
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• pp.79-85
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• 1995

In this paper, an epi layer and a device structure for InP/InGaAs p-i-n/HBT OEIC is designed for a receiving frontend of high speed optical communications. A 3 stage transimpedance circuit using the p-i-n/HBT device is also designed by SPICE simulations for a high sensitivity including ISI noises at a given bit rate. Our simulations show that the Personick's assumption which is not commonly satisfied have estimated a photoreceiver sensitivity too high, so thus we have to also consider ISI noises in OCIC receiver designs.

• 한국전자파학회논문지
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• 제18권9호
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• pp.1064-1069
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• 2007

본 논문에서는 MMIC 응용을 위한 초소형화된 능동형 $90^{\circ} 전력 결합기를 제안한다. 기존의 수동형 $90^{\circ} 전력 결합기는 매우 큰 크기 때문에 MMIC 상에 집적되어질 수가 없다. 따라서 초소형화된 $90^{\circ} 전력 결합기는 고집적된 MMIC의 개발을 위해 요구되어진다. 본 논문을 위해서 InGaP/GaAs HBT를 이용한 초소형화된 능동형 $90^{\circ} 전력 결합기는 고집적된 MMIC 응용을 위해 GaAs 기판 상에 제작하였다. 제작된 능동형 $90^{\circ} 전력 결합기의 크기는 $2.42{\times}1.05$ mm이며, 이는 기존의 수동형 $90^{\circ} 전력 결합기의 약 2.2 % 정도의 크기였다. 제작된 능동형 $90^{\circ} 전력 결합기는 2.4 GHz에서 기존의 수동형 $90^{\circ} 전력 결합기보다 약 10 dB의 이득 특성과 $-92.6^{\circ}의 양호한 위상차 결합 특성을 보였다. 초소형화된 능동형 $90^{\circ} 전력 결합기는 기존의 수동형 $90^{\circ} 전력 결합기들에 비해서 좋은 RF 성능을 나타내었다. 본 논문은 능동형 $90^{\circ} 전력 결합기에 대한 최초의 보고이다.

• 한국통신학회:학술대회논문집
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• 한국통신학회 2006년도 하계종합학술발표회 논문 초록집
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• pp.715-715
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• 2006