• Title/Summary/Keyword: GaAs FET

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Realization of 1D-2DEG Composite Nanowire FET by Selective Area Molecular Beam Epitaxy (선택적 분자선 에픽택시 방법에 의한 1D-2DEG 혼성 나노선 FET의 구현)

  • Kim, Yun-Joo;Kim, Dong-Ho;Kim, Eun-Hong;Seo, Yoo-Jung;Roh, Cheong-Hyun;Hahn, Cheol-Koo;Ogura, Mutsuo;Kim, Tae-Geun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.11
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    • pp.1005-1009
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    • 2006
  • High quality three-dimensional (3D) heterostructures were constructed by selective area (SA) molecular beam epitaxy (MBE) using a specially patterned GaAs (001) substrate to improve the efficiency of tarrier transport. MBE growth parameters such as substrate temperature, V/III ratio, growth ratio, group V sources (As2, As4) were varied to calibrate the selective area growth conditions and the 3D GaAs-AlGaAs heterostructures were fabricated into the ridge type and the V-groove type. Scanning micro-photoluminescence $({\mu}-PL)$ measurements and the following analysis revealed that the gradually (adiabatically) coupled 1D-2DEG (electron gas) field effect transistor (FET) system was successfully realized. These 3D-heterostructures are expected to be useful for the realization of high-performance mesoscopic electronic devices and circuits since it makes it possible to form direct ohmic contact onto the (quasi) 1D electron channel.

A Study on the Fabrication of the Low Noise Amplifier Using a Series Feedback Method (직렬 피드백 기법을 이용한 저잡음 증폭기의 구현에 관한 연구)

  • 김동일;유치환;전중성;정세모
    • Journal of the Korean Institute of Navigation
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    • v.25 no.1
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    • pp.53-60
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    • 2001
  • This paper presents the fabrication of the LNA which is operating at 2.13 ~ 2.16 GHz for IMT-2000 front-end receiver using series feedback and resistive decoupling circuit. Series feedback added to the source lead of a GaAs FET keeps the low noise characteristics and drops the input reflection coefficient of a low noise amplifier simultaneously. Also, it increases the stability of the LNA. Resistive decoupling circuit is suitable for input stage matching because a signal at low frequency is dissipated by a resistor in the matching network. The amplifier consists of GaAs FET ATF-10136 for low noise stage and VNA-25 which is internally matched MMIC for high gain stage. The amplifier is fabricated with both the RF circuits and self bias circuit on the Teflon substrate with 3.5 permittivity. The measured results of the LNA which is fabricated using the above design technique are presented more than 30 dB in gain, PldB 17 dB and less than 0.7 dB in noise figure, 1.5 in inputㆍoutput SWR(Standing Wave Ratio).

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Epitaxial Growth for GaAs IC (GaAs 집적회로 제조를 위한 에피 성장 연구)

  • Kim, Moo-Sung;Eom, Kyung-Sook;Park, Young-Joo;Kim, Yong;Kim, Seong-Il;Cho, Hoon-Young;Min, Suk-Ki
    • Korean Journal of Materials Research
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    • v.3 no.6
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    • pp.645-651
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    • 1993
  • The growth of semi-insulating(SI) high resistant undoped GaAs epilayer has been studied to solve the problems ocurring when GaAs IC is fabricated by the widely used ion implantation directly into the SI GaAs substrate. The EPD ditribution of the SI substrates has been examined, and the suitability of the buffer layers grown by MOCVD and MBE, respectively, has been tested for IC fabrication through leakage current measurement. IJngated FET has been fabricated on the SI epilayer and leakage current through the buffer layer has been measured. In the case of MOCVD grown 1$\mu\textrm{m}$-thick buffer layer, the leakage current is as small as about 270nA/mm, and this value does not affect the pinch-off of FET. In this case, the epilayer quality is affected by the substrate defects because the leakage current distribution is coincided with the EPD distribution of the SI substrate. The 2$\mu\textrm{m}$-thick buffer layer grown by MBE, however, has the better quality, and shows the lower leakage current(40nA/mrn) and higher uniformity.

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Analysis of RP Power Amplifier Nonlinearity and BER Characteristics for Multi­Carrier Transmission System (다중반송 전송시스템을 위한 RF 전력증폭기의 비선형 특성과 BER관계 분석)

  • 신동환;이영철
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.7 no.8
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    • pp.1612-1620
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    • 2003
  • This papers describes a nonlinear transfer function modelling of designed GaAs FET power amplifier by measured and simulated values of designed PA amplifier for multi­carrier transmission system, With the results of PA nonlinearity characteristic, we can estimates AM­AM and AM­PM of designed PA. According to the estimated nonlinear characteristics, we can analysis the ACPR of PA for spectral regrowth, the error vector measurement(EVM) of constallation signals and bit error rate of QPSK and 64­QAM. The suggested nonlinear modelling results are used to get an accurate estimate of digital characteristics between PA amplifier and wireless multi­carrier transmission system using OFDM.

Quantum Simulation Study on Performance Optimization of GaSb/InAs nanowire Tunneling FET

  • Hur, Ji-Hyun;Jeon, Sanghun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.5
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    • pp.630-634
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    • 2016
  • We report the computer aided design results for a GaSb/InAs broken-gap gate all around nanowire tunneling FET (TFET). In designing, the semi-empirical tight-binding (TB) method using $sp3d5s^*$ is used as band structure model to produce the bulk properties. The calculated band structure is cooperated with open boundary conditions (OBCs) and a three-dimensional $Schr{\ddot{o}}dinger$-Poisson solver to execute quantum transport simulators. We find an device configuration for the operation voltage of 0.3 V which exhibit desired low sub-threshold swing (< 60 mV/dec) by adopting receded gate configuration while maintaining the high current characteristic ($I_{ON}$ > $100 {\mu}A/{\mu}m$) that broken-gap TFETs normally have.

Effects of Source and Load Impedance on the Linearity of GaAs MESFET (GaAs MESFET의 소오스 및 부하 임피던스가 선형성에 미치는 영향)

  • 안광호;이승학;정윤하
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.10 no.5
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    • pp.663-671
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    • 1999
  • The linearity of the GaAs FET power amplifier(PA) is greatly influenced by source and load impedance for the FETs. The third order intermodulation products, IM3, from the GaAs FET PA are investigated in relation with source and load impedance. From heuristic as well as analytic point of view, e.g., Volterra series analysis, is employed to analyze the effects of nonlinear circuit elements, gate-source capacitance, $C_{gs}$, and drain-source current, $I_{ds}$. The sweet spots where soure and load impedance produce the least intermodulation products are calculated and compared with the load and source pull data with good agreements. It also shows that source impedance has a greater effect on the intermodulation products than the load impedcnce.

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GaAs OEIC Unit Processes for chip-to-chip Interconnection II (LD structure ; integration) (칩상호 광접속용 GaAs 광전집적회로의 기본 공정 II (LD 구조 ; 집적화 연구))

  • 김창남
    • Proceedings of the Optical Society of Korea Conference
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    • 1989.02a
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    • pp.185-192
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    • 1989
  • It is shown that GaAs/GaAs stripe Roof-Top-Reflector LD is better than cleaved mirror LD by numerical analysis. And surface light emitting device is developed by LPE melt-back growth, which is of good controllability for OEIC. OEIC transmitter using RTR LD structured device and FET has been made and modulated, expected to show good modulation characteristics after solving process problem. Beam-Lead LD mounted on Si carrier has been made and shows low heat-resistance and so long life and good characteristics of LD.

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