• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.695-698
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• 2010

본 논문은 High-speed signal에 대한 기본적인 설계 방법론, Differential signaling, Impedence matching, Decoupling Method 등에 대하여 논한 후 High-speed signal 의 전송 품질을 개선하기 위한 GND via 의 효과에 대하여 논하고자 한다. S-parameter simulation 및 실제 제품 적용 후 파형의 변화를 관찰하여 GND via 의 효용성을 살펴보아 High-speed signal Design 할 때 Design limitation 상황에 대해 적절한 방법론을 말하고자 한다.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.6
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• pp.665-670
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• 2015

In this paper, We proposed a broadband RF amplifier for Microwave band receiver. We also proposed a broadband RF amplifier, designed by using EM simulation for reliable amplification of the received signal. Connected to a source terminal to via, it minimizes those which are the active elements of source-side oscillation as the operating element in an ideal GND, and a constant gain characteristic in a broadband. The goal of this was to obtain stable amplification characteristics. For implementing this architecture, we designed the broadband(500 MHz ~ 7 GHz) RF amplifier by using commercial GaAs FET, which operate on 720 MHz, 4,595 MHz, and 6,035 MHz by impedance matching. The voltage gain is 10.635 dB ~ 14.407 dB(737.5 MHz ~ 6.0575 GHz), P1dB is 20 dBc of band(1st harmonic/2nd harmonic).

• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.25-32
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• 1997

대용량, 고속 정보처리가 요구되는 System의 모듈은 Data 처리의 고속성 및 회로의 고집적이 가능한 MCM의 형태로 구현되어 ATM, GPS 및 PCS 등의 분야에 광범위하게 응 용되고 있다. 위와 같은 High Speed 응용분야에서의 System 성능은 Interconnect Line의 전달지연, 임피던스 부정합에 의한 신호 반사 손실. 신호선 간의 Crosstalk, Ground Bounce 등의 현상에 대한 최적화 여부에 결정적인 영향을 받는다. 그러나 Interconnect의 특성상 정 형이 존재하지 않으므로 추상적인 Library를 구축하는 형식으로 접근할 수밖에 없으며 이를 위하여 여러기본 구조를 정의한후 각 Dimension을 변수로 두고 해석 결과를 합성하여 Database화하는 접근방식이다. 본 논문에서는 MCM-D 공정을 이용하여 Interconnect Line 특성을 분석하고 Database화 하기 위한 Test Pattern을 구현하고 Time Domain reflectometry(TDR)을 이용하여 그특성들을 측정 분석하였다. Test pattern 제작은 MCM-D 공정으로 최소선폭 27$\mu$m, Via Hole 75$\mu$m으로 형성하였고 2 Layer Signal과 GND로 총 3Layer를 구현하였다. 특성분석을 위해 TDR장비와 모데링 및 Simulation S/W인 IPA 510 을 사용하였다. 이를 통해 MCM-D를 이용한 공정에서 Interconcet Line의 고주파 특성을 측정하고 정량화하여 LIbrary를 제작할수 있었다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38B no.9
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• pp.744-750
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• 2013

In this paper, we proposed new type of an artificial magnetic conductor(AMC) structure, which has a high impedance surface for realizing the meta-material characteristics. The designed AMC structure set a goal of 3.2GHz, and the reflector, which consists of periodically arrayed AMCs is fabricated and measured. The high impedance improves the reflection coefficient, decreases the system size and interference, and increases the antenna performance. The structure has embodied the high impedance by the thickness and relative permitivity of the dielectric substrate and the design configuration without the metallic via hole which connects the AMC to the GND. The bandwidth is 150% broader than the similar AMC structures. Also, the distance between the antenna and the AMC reflector is decreased by ${\lambda}/10$ as working as the metal(PEC) reflectors. The antenna radiation characteristics are 3dB increased at 10mm away from reflector by measurement. The proposed reflector could be inserted in the portable mobile devices, and the antenna's performance has improved by the reflector. The specific absorption rate is dramatically decreased over 94% because the back radiation of the antenna is shielded.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.2 s.93
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• pp.154-160
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• 2005

Microwave Otters are essential device in modem wireless systems. A compact dimension BPF(Band-pass Filter) for IEEE 802.11a WLAN service is realized using LTCC multi-layer process. To extrude 2-stage band-pass equivalent circuit, band-pass and J-inverter transform applied to Chebyshev low-pass prototype filter. Because parallel L-C resonator is complicate and hard to control the inductor characteristics in high frequency, the shorted $\lambda/4$ stripline is selected for the resonator structure. The passive element is located in the different layers connected by conventional via structure and isolated by inner GND. The dimension of fabricated stacked band-pass filter which is composed of six layers, is $2.51\times2.27\times1.02\;mm^3$. The measured filter characteristics show the insertion loss of -2.25 dB, half-power bandwidth of 220 MHz, attenuation at 5.7 GHz of -32.25 dB and group delay of 0.9 ns at 5.25 GHz.