• Title/Summary/Keyword: Fused quartz

Search Result 30, Processing Time 0.025 seconds

Optimization of Fused Quartz Cantilever DRIE Process and Study on Q-factors (비정질 수정 캔틸레버의 식각 공정 최적화 및 Q-factor 연구)

  • Song, Eun-Seok;Kim, Yong-Kweon;Baek, Chang-Wook
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.60 no.2
    • /
    • pp.362-369
    • /
    • 2011
  • In this paper, optimal deep reactive ion etching (DRIE) process conditions for fused quartz were experimentally determined by Taguchi method, and fused quartz-based micro cantilevers were fabricated. In addition, comparative study on Q-factors of fused quartz and silicon micro cantilevers was performed. Using a silicon layer as an etch mask for fused quartz DRIE process, different 9 flow rate conditions of $C_4F_8$, $O_2$ and He gases were tested and the optimum combination of these factors was estimated. Micro cantilevers based on fused quartz were fabricated from this optimal DRIE condition. Through conventional silicon DRIE process, single-crystalline silicon micro cantilevers whose dimensions were similar to those of quartz cantilevers were also fabricated. Mechanical Q-factors were calculated to compare intrinsic damping properties of those two materials. Resonant frequencies and Q-factors were measured for the cantilevers having fixed widths and thicknesses and different lengths. The Q-factors were in a range of 64,000 - 108,000 for fused quartz cantilevers and 31,000 - 35,000 for silicon cantilevers. The experimental results supported that fused quartz had a good intrinsic damping property compared to that of single crystalline silicon.

Optimization for Fused Quartz DRIE using Taguchi Method (다구치 방법을 이용한 비정질 수정 건식 식각 최적화)

  • Song, Eun-Seok;Jung, Hyung-Kyun;Hwang, Young-Seok;Hyun, Ik-Jae;Kim, Yong-Kwon;Beak, Chang-Wook
    • Proceedings of the KIEE Conference
    • /
    • 2008.10a
    • /
    • pp.129-130
    • /
    • 2008
  • In this paper, optimal DRIE process conditions for fused quartz are experimentally determined by Taguchi method to develop high-performance inertial sensors based on the fused quartz material, which is known to have high Q-factors. Using Si layer as an etch mask, which was formed by previously developed bonding process of the fused quartz and Si wafer, fused quartz DRIE process was performed. Different 9 flow rate conditions of $C_4F_8$, $O_2$, He gas have been tested and the optimum combination of these factors was estimated. By this work, the ability to fabricate high aspect ratio fused quartz structure was confirmed.

  • PDF

Effect of The Fused Siliceous Materials on Rice Plant (수도(水稻)에 대(對)한 합성규산물질(合成珪酸物質)의 효과(效果))

  • Lee, Y.H.;Han, K.H.;Lim, S.U.
    • Applied Biological Chemistry
    • /
    • v.14 no.3
    • /
    • pp.183-189
    • /
    • 1971
  • The studies reported herein were conducted to inquire the effect of fused siliceous materials which mixed with sand and quartz added calcium fertilzer on rice grown on low available silica content soil. The applied nitrogen level were examined for the two plots, nitrogen 10kg and 20kg per 10 a., and the siliceous materials(Wollastonite, Fused sand and Fused quartz) were applied as levels to 100kg, 300kg and 500kg per 10a. in the pots. The results are summerized as follows; 1. The available silica content solved in N/2 HCl solution of fused sand was more than of fused quartz but the silica solubility in 2% citric acid of fused quartz were higher than other. 2. The absorbed silica content by plant grown on the fused quartz plot was the highest among other siliceous materials and of fused sand and natural wollastonite were at almost equal. The ratio of absorbed silica of natural wollastonite was highest among them and in fused materials, the quartz was higher than sand. 3. The productivity of rice was increased by percentage of filled grain, weights of 1000 grains, and number of spikelets on account of the large quantity of the silica absorbed by plant Especially fused quartz showed the highest productive effect among siliceous materials and natural wollastonite and fused sand were similar effect. 4. From the above results. the fused quartz was selected as expelled siliceous fertilizer on rice plant among them and the fused sand was equal effect to natural wollastonite.

  • PDF

A comparative study on Q-factors of fused quartz and silicon micro cantilevers (비정질 수정과 실리콘 마이크로 캔틸레버 구조물의 Q-factor 비교 연구)

  • Song, Eun-Seok;Kim, Yong-Kweon;Baek, Chang-Wook
    • Proceedings of the KIEE Conference
    • /
    • 2009.07a
    • /
    • pp.1505_1506
    • /
    • 2009
  • In this paper, micro cantilevers which are made of two different materials - fused quartz and single crystalline silicon - and have similar dimensions were fabricated and their mechanical Q-factors were evaluated to compare intrinsic damping properties of those two materials. Resonant frequencies and Q-factors were measured for the cantilevers having fixed widths and thicknesses, and different lengths. The measured Q-values are in a range of 64,000 - 108,000 for fused quartz cantilevers, and 31,000 - 35,000 for silicon cantilevers, respectively. Experimental results support high Q-factors of fused quartz compared to single crystalline silicon due to its good intrinsic damping properties.

  • PDF

Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching (KrF 엑시머 레이저를 이용한 용융실리카의 미세 습식 식각가공)

  • 백병선;이종길;전병희;김헌영
    • Transactions of Materials Processing
    • /
    • v.11 no.7
    • /
    • pp.601-607
    • /
    • 2002
  • Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.

Study on Recycling of Scraps from Process of Silicon-single-crystal for Semiconductor

  • Lee, Sang-Hoon;Lee, Kwan-Hee;Hiroshi Okamoto
    • Proceedings of the IEEK Conference
    • /
    • 2001.10a
    • /
    • pp.705-710
    • /
    • 2001
  • So for the quartz-glassy crucible wastes which was used for pulling up silicon-single-crystal ingot have simply reused for refractory raw-materials, or exhausted. This study is concerned on the advanced recycling-technology that is obtained by the proper micro-particle preparation process in order to fabricate fine amorphous silica filler for EMC (Epoxy Molding Compound). Therefore, this paper will deal with the physical, chemical and thermal pre-treatment process for efficient impurity removal and with the proper micro-particle process for producing the amorphous silicafiller. In view of the results, if the chemical, physical and thermal pre-treatment process for efficient elimination of impurity was passed, the purity of wasted fused glassy crucible is almost equal to the its of first anhydrous quartz glass. Thus, it was understood that this wasted fused glassy crucible was sufficient value of recycling, though it was damaged. When the ingot was fabricated, Phase transformation of crystallization by heat treatment (heat hysteresis phenomenon) was not changed. So, it was understood that as fused silica in the amorphous state, as It is, recycling possibility was very high

  • PDF

Single-Crystal Silicon Thin-Film Transistor on Transparent Substrates

  • Wong, Man;Shi, Xuejie
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2005.07b
    • /
    • pp.1103-1107
    • /
    • 2005
  • Single-crystal silicon thin films on glass (SOG) and on fused-quartz (SOQ) were prepared using wafer bonding and hydrogen-induced layer transfer. Thinfilm transistors (TFTs) were subsequently fabricated. The high-temperature processed SOQ TFTs show better device performance than the low-temperature processed SOG TFTs. Tensile and compressive strain was measured respectively on SOQ and SOG. Consistent with the tensile strain, enhanced electron effective mobility was measured on the SOQ TFTs.

  • PDF

Characterization of Thin Film Materials by Nanoindentation and Scanning Probe Microscopy (나노인덴테이션과 주사탐침현미경을 이용한 박막 재료의 특성평가)

  • Kim, Bong-seob;Yun, Jon-do;Kim, Jong-kuk
    • Korean Journal of Materials Research
    • /
    • v.13 no.9
    • /
    • pp.606-612
    • /
    • 2003
  • Surface and mechanical properties of thin films with submicron thickness was characterized by nanoindentation with Berkovich and Vickers tips, and scanning probe microscopy. Nanoindention was made in a depth range of 15 to 200 nm from the surface by applying tiny force in a range from 150 to $9,000 \mu$N. Stiffness, contact area, hardness, and elastic modulus were determined from the force-displacement curve obtained. Reliability was first tested by using fused quartz, a standard sample. Elastic modulus and hardness values of fused quartz measured were the same as those reported in the literature within two percent of error. Mechanical properties of ITO thin film were characterized in a depth range of 15∼200nm. As indentation depth increased, elastic modulus and hardness decreased by substrate effect. Ion beam deposited DLC thin films were indented in a depth range of 40∼50 nm. The results showed that the DLC thin film using benzene and bias voltage 0∼-50 V has elastic modulus and hardness value of 132 and 18 GPa respectively. Pure DLC thin films showed roughnesses lower than 0.25 nm, but silicon-added DLC thin films showed much higher roughness values, and the wavy surface morphology.

Avoidance of Internal Resonances in Hemispherical Resonator Assemblies from Fused Quartz Connected by Indium Solder

  • Sarapuloff, Sergii A.;Rhee, Huinam;Park, Sang-Jin
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
    • /
    • 2013.04a
    • /
    • pp.835-841
    • /
    • 2013
  • Modern solid-state gyroscopes (HRG) with hemispherical resonators from high-purity quartz glass and special surface superfinishing and ultrathin gold coating become the best instruments for precise-grade inertial reference units (IRU) targeting long-term space missions. Designing of these sensors could be a notable contribution into development of Korea as a space nation. In participial, 40mm diameter thin-shell resonator from high-purity fused quartz, fabricated as a single-piece with its supporting stem has been designed, machined, etched, tuned, tested, and delivered by STM Co. (ATS of Ukraine) several years ago; an extremely-high Q-factor (upto 10~20 millions) has been shown. Understanding of the best way how to match such a unique sensor with inner glass assembly of the gyro means how to use the high potential in a maximal extent; and this has become the urgent task. Inner quartz glass assembly has a very thin indium (In) layer soldered the resonator and its silica base (case), but effects of internal resonances between operational modal pair of the shell-cup and its side (parasitic) modes can notable degrade the potential of the sensor as a whole, instead of so low level of resonator's intrinsic losses. Unfortunately, there are special combinations of dimensions of the parts (so-called, "resonant sizes"), when intensive losses of energy occurs. The authors proposed to use the length of stem's fixture as an additional design parameter to avoid such cases. So-called, a cyclic scheme of finite element method (FEM) and ANSYS software were employed to estimate different combinations of gyro assembly parameters. This variant has no mismatches of numerical origin due to FEM's discrete mesh. The optimum length and dangerous "resonant lengths" have been found. The special attention has been paid to analyses of 3D effects in a cup-stem transient zone, including determination of a difference between the positions of geometrical Pole of the resonant hemisphere and of its "dynamical Pole", i.e., its real zone of oscillation node. Boundary effects between the shell (cup) and 3D short "beams" (inner and outer stems) have been ranged. The results of the numerical experiments have been compared with the classic model of a quasi-hemispherical shell band with inextensional midsurface, and the solution using Rayleigh's functions of the $1^{st}$ and $2^{nd}$ kinds. To guarantee the truth of the recommended sizes to a designer of the real device, the analytical and FEM results have been compared with experimental data for a party of real resonators. The consistency of the results obtained by different means has been shown with errors less than 5%. The results notably differ from the data published earlier by different researchers.

  • PDF

LSAW Velocity Measurement by Using a PVDF Line-Focus Ultrasonic Transducer (PVDF 직선집속 초음파 트랜스듀서에 의한 누설탄성표면파 속도 측정)

  • 윤혁준;하강열;김무준;윤종락
    • The Journal of the Acoustical Society of Korea
    • /
    • v.20 no.1
    • /
    • pp.62-67
    • /
    • 2001
  • Velocities of leaky surface acoustic waves (LSAW/sub s/) were measured by using a line-focus polyvinylidene fluoride (PVDF) transducer and compared with theoretically calculated ones. Isotropic materials of Cu, Al, fused quartz, and anisotropic one of Z-cut α-quartz crystal were used as specimens. The velocities were obtained by the separation time between wave components reflected directly from the surface of specimen and LSAW components according to the defocusing distance. The measured velocities well agree with the theoretical results within 1% error, and it was shown that the leaky pseudo-surface acoustic wave (LPSAW) as well as the LSAW propagates with the typical 6-fold anisotropy on the (0,0,1) surface of α-quartz.

  • PDF