• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1772-1775
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• 2000

We have fabricated poly-Si TFTs by two-step crystallizaton. Poly-Si films have been prepared by furnace annealing(FA) and rapid thermal annealing(RTA) followed by subsequent the post-annealing, excimer laser annealing. The measured crystallinity of RTA and FA annealed poly-Si film is 77% and 68.5%, respectively. For two-step annealed poly-Si film, the crystallinity has been drastically to 87.7% and 86.3%. The RMS surface roughness from AFM results have been improved from 56.3${\AA}$ to 33.5${\AA}$ after post annealing. The measured transfer characteristics of the two-step annealed poly-Si TFTs have been improved significantly for the both FA-ELA and RTA-ELA. Leakage currents of two-step annealed poly-Si TFTs are lower than that of the devices by FA and RTA. From these results, we can describe the fact that the intra-grain defects has been cured drastically by the post-annealing.

• 한국표면공학회지
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• 제28권2호
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.

• Applied Science and Convergence Technology
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• 제26권2호
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• pp.30-33
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• 2017

ZnO thin films which were deposited by RF magnetron sputtering system were annealed by furnace and insitu heat treatment methods. We investigated the effect of heat treatment method on physical properties of ZnO thin films. The structural and optical properties of ZnO thin films were improved by heat treatment. Through the annealing treatment of ZnO film by furnace, the good crystallinity and ultraviolet emission were obtained. These results are attributed to the improved formation of Zn-O bond in ZnO thin film annealed at by furnace. We confirm that the formation of Zn-O bond plays an important role in obtaining the excellent structural and optical properties of ZnO thin films.

• 한국재료학회지
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• 제14권5호
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• pp.315-321
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• 2004

The void evolution in direct bonding process of $Si/Si_3$$N_4$ ∥ $SiO_2$/Si silicon wafer pairs has been investigated with an infrared camera. The voids that formed in the premating process grew in the conventional furnace annealing process at a temperature of $600^{\circ}C$. The voids are never shrunken even with the additional annealing process at the higher temperatures. We observed that the voids became smaller and disappeared with sequential scanning by our newly proposed fast linear annealing(FLA). FLA irradiates the focused line-shape halogen light on the surface while wafer moves from one edge to the other. We also propose the void shrinking mechanism in FLA with the finite differential method (FDM). Our results imply that we may eliminate the voids and enhance the yield for the direct bonding of wafer pairs by employing FLA.

• 열처리공학회지
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• 제22권1호
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• pp.23-26
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• 2009

Pt nanotubes with diameter of 200 nm were fabricated by simple and convenient method of Template-Wetting Process. Porous alumina membranes were prepared by 2 step anodic oxidation as the template. To improve wetting properties and lower surface energy, pt solution was mixed with polymer. Polymer was removed completely during annealing. Grain growth process of pt nanotubes during baking and furnace annealing was examined by FE-SEM and XRD.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.126-127
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• 2008

The effects annealing conditions on the electrical conductions of SOI substrate were studied. The reversible change of resistance and carrier concentration in accordance with the annealing temperature were observed for the first time in SOI substrate. The thermal donors due to interstitial oxygen atoms contribute the change of resistance and carrier concentration. Final1y, we show that the furnace annelaing at $500^{\circ}C$ at final heat treatment stage is effective for eliminate the thermal donor effects in SOI substrate.

• Applied Microscopy
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• 제24권4호
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• pp.123-131
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• 1994

In this study the initial stage nucleation and growth of Ni silicide on (001) Si by evaporation and furnace annealing have been investigated by transmission electron microscopy. The pressure was $10^{-6}$ Torr during evaporation and annealing. And the annealing temperature to produce $NiSi_2\;was\;800^{\circ}C$. From the evaporated film, $NiSi_2$ nucleus has grown into Si substrate with an epitaxial orientation relationship. Interfaces between $NiSi_2$ and Si were A-type {111} interfaces and {100} $NiSi_2$ interfaces were also observed at the initial stage of nucleation. Ni silicide grew into Si substrate, but the nucleus partly grew into the evaporated film, with no facets, from the nuclei in the Si substrate. $NiSi_2$ nucleus with (111) habit planes was also observed.

• 전자공학회논문지D
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• 제35D권3호
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• pp.46-55
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• 1998

This stud demonstrates the profiles of heavy ions (As, Sb) in silicon by high energy (1~10 MeV) implantation. Implanted profiles were measured by SIMS (Cameca 4f) and compared with simulation results (TRIM) program and analytical description method using Pearson function). The experimental results have a little bit deviation with simulation data in the case of As high energy implatation. But in the case of Sb, the experimental results are in good agreement with TRIM data. SIMS profiles are perfectly fitted with a analytical description method only using one pearson function in Sb implantation. but in the case of As, fitted profilesshow with a little bit deviations by channeling effects of SIMS profiles. Thermal annealing for electrical activation of implanted ions was carried out by furnace annealing and RTA(Rapid Thermal Annealing). Concentration-depth profile after heat treatement were measured by SR(Spreading Resistance) method.

• 한국연소학회:학술대회논문집
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• 한국연소학회 2001년도 제23회 KOSCO SYMPOSIUM 논문집
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• pp.83-89
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• 2001

Most technologies of reduction process used in the heat treatment of existent metal products are related to metals applied to bolts and parts of automobiles, and nonmetal such as copper. Heating conditions and reduction gases produced in above processes depend on types of products to be treated thermally but heating systems employ electricity commonly and the reduction gases are separated into additional production equipment and a gas dryer and inefficiently provided into the system. Electrical heating system has the advantage of convenient temperature-control but is not economical because of disadvantages of high electricity-running cost and extra installation cost of a transformer. Accordingly, development of the system which has economical heating mode in which provision of reduction gas and heating conditions are unified is necessary for improvement of economy and efficiency in current reduction processes. This study aimed to develop a new advanced heat treatment furnace using catalytic combustion. thereby minimizing the cost during heating, supplying heat and reductive gas at the same time and controlling operating condition freely by changing electrical heating system to heating system by the gas combustion and regeneration of wasted heat.

• 한국세라믹학회지
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• 제43권9호
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• pp.544-551
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• 2006

The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.