• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.780-783
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• 2006

In this paper, we confirmed the yellowish gravity-mura phenomenon in Fringe-Field Switching (FFS) mode using 2-D simulation. As the cell gap increases, while the LC efficiency of blue wavelength remains almost same, that of red and green wavelength increases continuously. As a result, yellowish phenomenon occurs.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.691-694
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• 2006

So far, we have done much research improving quality of LCD TV. Recently, we have developed 26" WXGA LCD TV by advance fringe field switching (AFFS) technology with smooth and every scene realistic in color image that obtained from the amazing authentic color delivery, optical characteristic and fast response time. Our upgrade device has shown the brightness over 600nits (Color shift <0.015 and Transmittance ratio > 5.5%), gray to gray response time under 6ms, contrast ratio over 1200:1 and viewing angle over 178/178, respectively. And also, motion artifacts improved by fast response of LC with low viscosity, cell gap and dielectric constant.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1609-1614
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• 2003

In this study, a practical holographic interferometric tomography system, which is instantaneous and non-contact for measuring three dimensional flow field, was developed. The system consists of holographic recording/reconstruction system, fringe analysis code and computational tomography code and it is developed with Gill environment for general users. The developed system was applied to three-dimensional natural convection from a discrete flush-mounted circular heat source on the bottom of a cubic enclosure. The heat source was located at the off-center of the bottom plate so that three-dimensional temperature field can be achieved. A set of multi-directional holographic interferograms was recorded by employing a double-reference beam, double-exposure holographic technique. Optical pathlength data were extracted from the recorded interferometric data and finally three dimensional temperature field inside the cube was reconstructed.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1789-1794
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• 2003

Transient and asymmetric density distributions have been investigated by digital speckle tomography. Multiple CCD images captured movements of speckles in three angles of view simultaneously because the flows were asymmetric and transient. The speckle movements between no flow and downward butane flow from a circular half opening have been calculated by a cross-correlation tracking method so that those distances can be tranferred to deflection angles of laser rays for density gradients. The three-dimensional density fields have been reconstructed from the fringe shift by a real-time multiplicative algebraic reconstruction technique (MART).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.140-143
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• 2001

Digital shearography, a speckle pattern method is based on the superposition of two laterally sheared images. Therefore, object points which are positioned in some distance from each other are superposed in the image plane. This shearography, one of NDT methods without contact, is able to inspect defects in pipelines and pressure vessels that are used in nuclear power plants. This is can inspect whole fields and has a low sensitivity to environmental noise. Because optical setting is very simple, it has a little exhaustion of time, cost and man power. And also it can find a defect position through real time monitoring of a part. This paper, finds out the relationship among shearing quantity image quality and defect size with this method.

• 대한기계학회논문집A
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• 제25권3호
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• pp.408-414
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• 2001

The structural characteristics of the stiffened double cylinder was investigated through experiment and analysis. The outside cylinder was excited with piezoelectric actuator and the mode shape of the cylinder with stiffening T frame was obtained by using holographic interferometry. Finite element method was applied for further modal investigation of the stiffened cylinder. The experimental results showed that the mode shape of cylinder was dependent on the exciting frequencies and the T frame showed salient effect of damping at most of the resonent frequencies. In particular frequencies, the T frame worked as a transmitter. FFM showed similar results with the experiments. This paper showed that the laser-based method such as holographic interferometry is well suited for investigation of the whole-field mode shapes and FEM has good performance to estimate the medal characteristics of the mechanical structure.

• 한국정밀공학회지
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• 제10권4호
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• pp.135-141
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• 1993

고속으로 변형을 받는 재료의 변형 강도는 정적인 부하를 받는 경우와는 다르며 이 고속 현상을 해석하기 위해서는 시간적, 공간적 변화를 조사할 필요가 있다. 일반적으로 스트레인 속도를 구하는 데는 스트레인 게이지를 이용하고 있지만, 고무와 같은 대변형을 하는 물체에서는 정확한 데이터를 얻기가 곤란 하므로 스플라인 함수를 이용해서 보간 작업을 해야 한다. 그래서, 최근에는 스트레인 속도를 구하는 방법 으로 격자법, 모아레법, 광탄성법 등이 이용되고 있다. 재료의 변위 분포를 구하는 데는 격자법이 잘 이용 되어지고 있지만 스트레인 속도 분포의 해석의 정도에 문제가 되고 있다. 이러한 문제를 해결하기 위하여 본 논문에서는, 고속으로 변형하는 물체의 형상을 역학적으로 해석하기 위해 고속도 카메라로 촬영을 하고 그 때 얻어진 격자 화상을 퓨리에 변환 격자법을 이용해서 위상을 구하고 스트레인 속도 분포를 해석했다.

• 한국정밀공학회지
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• 제11권5호
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• pp.56-65
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• 1994

We have carried out a research on automatic measurement of gage blocks below 250mm and then improved the accuracy of the system, and reduced the measurement time using image processing technique and computer interface. The accuracy of the system is (230+10330 $L^{2}$)$^{2}$ nm (L:m) with confidence level of 95%. We participated APMP gage block intercomparision-1993/1994. The 1st round intercomparision showed that the measured values of all 5 gage blocks were within 21 nm from average.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.28-32
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.