• Tribology and Lubricants
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• v.34 no.6
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• Journal of the Korean Applied Science and Technology
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• v.31 no.4
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• pp.595-601
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• 2014

The microstructures of NATM were examined by SEM, FT-IR spectra, tensile properties, mole % of [NCO/OH], and particle size analyzer. Growing concerns in the environment-friendly industries have led to the development of solvent-free formulations that can be cured. We had synthesized NATM(New Austria Tunnel Method) resin having the ability to protect stainless steel against corrosion. Comparing with general NATM resin and coatings, this resin that synthesized with polyurethane and epoxy was highly stronger in intensity and longer durability. Hybrid resin was composed of polyols, MDI, epoxy, silicone surfactant, catalyst and crosslink agent, and fillers. Moreover, fillers such as fume silica not only accelerated the curing rate but also improved the physical property as thermal barriers. The rigid segments of synthetic resin in mechanical properties were due to fume silica and the increase the mole% of [NCO/OH] for corrosion protection. In conclusion, the hybrid resin microstructure with crosslink agent and fume silica are good material for thermosetting coating of metal substrates such as stainless steel.

• YAKHAK HOEJI
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• v.32 no.1
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• pp.6-13
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• 1988

A gas chromatographic method is described for the determination of volatile free acids(VFAs) in body fluids. VFAs were trace enriched from body fluids by liquid-solid extraction using Chromosorb P as the solid sorbent and ether as the eluant. The enriched VFAs were injected in splitless injection mode onto a HP-20M fused silica capillary column. The flame ionization detector was used as the detector. The present method was applied to the profiling of VFAs in body fluids from patients suffering from the infectious disease, hepatitis. The VFAs concentrations were high in saliva of hepatitis patients and isobutyric acid detected in sera of hepatitis patients compared to healthy subjects.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1600-1604
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Journal of the Korean Ceramic Society
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• v.17 no.4
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• pp.188-196
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• 1980

To investigate the corrosion behavior of the clay-bonded kaolin chamotte by molten aluminum, the mixture of 20 wt% fire clay and 80 wt% kaolin chamotte was prepared and fired in the temperature range 900~120$0^{\circ}C$. The specimens fired at each temperature were reacted with molten aluminum at 90$0^{\circ}C$. The results obtained in this experiment are as followed. 1) It was confirmed through X-ray diffraction analysis that the clay-bonded kaolin chamotte exposed to molten aluminum suffered penetration by the reaction of aluminum with silica forming alumina and metallic silicon. 2) Penetration was independent whether the silica existed as free or one component of mullite. 3) Penetration of the specimen fired at 90$0^{\circ}C$ was negligible while the others fired above 100$0^{\circ}C$ showed remarkable penetration. 4) Penetration rate at 90$0^{\circ}C$ was parabolically increased with the holding time as in the case of metal oxidation.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.277-277
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• 2006

Conducting polymers (e.g. poly[2-methoxy-5-(2'-ethyl-hexyloxy)-1,4-phenylen vinylene] (MEH-PPV)) confined in one-dimensional nanoscale channels of mesoporous materials, are expected to lead the novel applications for electroconductive and optoelectronic devices. We investigated the adsorption behavior of MEH-PPV on organically surface-modified mesoporous silica (FSM-16) and mesoporous organosilica. The amount of the confined MEH-PPV was found to strongly depend on the surface modifications of the mesoporous materials. The optical absorption edge of the confined MHE-PPV was clearly blue-shifted when compared to that of a free MHE-PPV.

• Korean Journal of Optics and Photonics
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• v.11 no.4
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• pp.255-260
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• 2000

We report that the crack-free organic-inorganic hybrid silica thin films were fabricated by sol-gel process using organometallic compounds as a precursor and that we have established very reproducible fabrication condition with systematic investigation of thickness and refractive index variations for various control parameters, such as, coating type, coating speed, chemical composition, prebake and postbake temperature. Additionally, we measured and compared the change of optical property with the UV exposure dose for three different kinds of photoinitiators. Furthermore, the fabrication of Ix4 MMI optical power splitter using the sol-gel thin film provides the possibility of various applications to the optical waveguide devices. vices.

• Journal of the Korean Ceramic Society
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• v.36 no.6
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• pp.625-631
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• 1999

Ceramic tapes were fabricated by ultrasonically spraying slurries of monodispersed spherical and alumina powders. Effects of slurry compositions on tape forming were investigated. A relatively fast rate of solvent evaporation caused pores and cracks to be formed. A good chemical affinity between solvent and binder gave rise to binder separation resulting in inhomogeneous distribution of binder. Defect-free silica tapes with uniform distribution of particle packing and the binder were obtained from the solvent having a low chemical affinity and a slow evaporation rate and containing appropriate amounts of the binder and the plasticizer. Tape thickness could be controlled by adjusting solids loadings and slurry feed rates. It was possible to fabricate a tape in 15 $\mu\textrm{m}$ thickness from 7 vol% alumina slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• Journal of Powder Materials
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• v.1 no.2
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• pp.135-144
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• 1994

Silicon carbide powder was prepared from mixtures of Sangdong silica sand and carbon black by SHS (Self propagating High temperature Synthesis) method which utilizes magnesiothermic reduction of silica. In the powder preparation process, the reacted powder was leached by chloric acid to remove the magnesium oxide and was subsequently roasted to remove free carbon. The impurities were mostly eliminated by hot acid treatment. The resultant SiC powder showed the mean particle size of 0.22 ${\mu}{\textrm}{m}$ and the specific surface area of $66.55 m^2/g$. The SiC powder was mixed with 1 wt% of boron and of carbon to increase densification rate. The mixed powder was pressed and sintered pressurelessly at $2100^{\circ}C$ for 30 min in argon gas. The sintered body showed the hardness of $2550 kg{\cdot}f/mm^2$ and the fracture toughness, KIC of $3.47 MN/m^{3/2}$.