• 제목/요약/키워드: Free Surface Machining Process

검색결과 46건 처리시간 0.021초

자유곡면 연마를 위한 자동 연마 시스템 개발 (Development of Computer Control Polishing System for Free Form Surface)

  • 전문식;오창진;이응석;김옥현
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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    • pp.327-331
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    • 2001
  • In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

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CMP와 Spin Etching에 의한 Blanket Wafer(TEOS) 가공 특성 비교에 관한 연구 (A Study on Machining Characteristic Comparison of Blanket Wafer(TEOS) by CMP and Spin Etching)

  • 김도윤;정해도;이은상
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.1068-1071
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    • 2001
  • Recently, the minimum line width shows a tendancy to decrease and the multi-level to increase in semiconductor. Therefore, a planarization technique is needed, which chemical polishing(CMP) is considered as one of the most important process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as microscratches, abrasive contaminations, and non-uniformity of polished wafer edges. Spin Etching can improve the defects of CMP. It uses abrasive-free chemical solution instead of slurry. Wafer rotates and chemical solution is simultaneously dispensed on a whole surface of the wafer. Thereby chemical reaction is occurred on the surface of wafer, material is removed. On this study, TEOS film is removed by CMP and Spin Etching, the results are estimated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU).

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모형 프로펠러 제작을 위한 과절삭이 없는 공구 경로 생성 (Gouging-free Tool-path Generation for Manufacturing Model Propellers)

  • 김유철;김태완;서정천
    • 대한조선학회논문집
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    • 제44권2호
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    • pp.198-209
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    • 2007
  • In this paper, we present the gouging and collision-free tool-path generation for manufacturing model propellers using the 5-axis NC machine. Because it takes much time to generate tool-paths when we use general purpose CAD/CAM systems, a specific system would be necessary for marine propellers. Overall manufacturing process is composed of two steps: roughcut and finishcut steps. The roughcut is conducted using only 3-axis for efficient machining and the finishcut is done using 5-axis for avoiding collision. The tool-path that might happen to gouging is searched and the tool position is also decided for avoiding interference between the tool and the propeller blades. The present algorithm is applied extensively to the surface piercing propellers. Some results are demonstrated for its validation.

Design of Linear Astigmatism Free Three Mirror System (LAF-TMS) for Sky Monitoring Programs

  • Park, Woojin;Pak, Soojong;Chang, Seunghyuk;Kim, Sanghyuk;Kim, Dae Wook;Lee, Hanshin;Lee, Kwangjo
    • 천문학회보
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    • 제42권2호
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    • pp.88.1-88.1
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    • 2017
  • We report a novel design of the "linear astigmatism-free" three mirror system (LAF-TMS). In general, the linear astigmatism is one of the most dominant aberration degrading image qualities in common off-axis systems. The proposed LAF-TMS is based on a confocal off-axis three mirror system, where higher order aberrations are minimized via our numerical optimization. The system comprises three pieces of aluminum-alloy freeform mirrors that are feasible to be fabricated with current single-point diamond turning (SPDT) machining technology. The surface figures, dimensions, and positions of mirrors are carefully optimized for a LAF performance. For higher precision-positioning mechanism, we also included alignment parts: shims (for tilting) and L-brackets (for decentering). Any possible mechanical deformation due to assembly process as well as 1-G gravity, and its influence on optical performances of the system are investigated via the finite element (FE) analysis. The LAF-TMS has low f-number and a wide field of view, which is promising for sky monitoring programs such as supernova surveys.

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유동해석을 통한 MR fluid jet polishing 시스템의 재료제거 특성 분석 (A study on material removal characteristics of MR fluid jet polishing system through flow analysis)

  • 신봉철;임동욱;이정원
    • Design & Manufacturing
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    • 제13권3호
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    • pp.12-18
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    • 2019
  • Fluid jet polishing is a method of jetting a fluid to polish a concave or free-form surface. However, the fluid jet method is difficult to form a stable polishing spot because of the lack of concentration. In order to solve this problem, MR fluid jet polishing system using an abrasive mixed with an MR fluid whose viscosity changes according to the intensity of a magnetic field is under study. MR fluid jet polishing is not easy to formulate for precise optimal conditions and material removal due to numerous fluid compositions and process conditions. Therefore, in this paper, quantitative data on the factors that have significant influence on the machining conditions are presented using various simulations and the correlation studies are conducted. In order to verify applicability of the fabricated MR fluid jet polishing system by nozzle diameter, the flow pattern and velocity distribution of MR fluid and polishing slurry of MR fluid jet polishing were analyzed by flow analysis and shear stress due to magnetic field changes was analyzed. The MR fluid of the MR fluid jet polishing and the flow pattern and velocity distribution of the polishing slurry were analyzed according to the nozzle diameter and the effects of nozzle diameter on the polishing effect were discussed. The analysis showed that the maximum shear stress was 0.45 mm at the diameter of 0.5 mm, 0.73 mm at 1.0 mm, and 1.24 mm at 1.5 mm. The cross-sectional shape is symmetrical and smooth W-shape is generated, which is consistent with typical fluid spray polishing result. Therefore, it was confirmed that the high-quality surface polishing process can be stably performed using the developed system.

티타늄의 절삭성에 관한 연구 (A Study on the Machinabilty of Tianium)

  • 홍환표;오석형;서남섭
    • 한국정밀공학회지
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    • 제6권1호
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    • pp.45-51
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    • 1989
  • In metal cutting various types of chips are produced in consequence of cutting conditions. According to the type of chips the cutting mechanism is to be changed. Most of the cutting theory is based on the continuous chip because of its convenient analysis, but the occurrence of the saw-toothed chip depends upon the workpiece and/or the cutting conditions, one of which is titanium alloy used widely. Nowadays titanium alloys are used widely with the rapid development of aerospace structural engineering application, whereas the theory of cutting mechanism has not been established yet, and the formatting process has not been understood satisfactorily, either. Unfortunately several misconceptions, conflicting statements and statements needing further clarifi- cation are also found. In this paper an attempt is made to clarify the formation process of saw-toothed chips which are to be produced during the orthogonal cutting process of titanium alloys. They were machined at low speed to avoid the rapid tool wear. We observed the SEM-photographs of chips taken at the quick-st- opping device. It is hoped that a rational model of the mechanics of cyclic chip formation can be developed. The results obtained are as follows. 1. When a saw- toothed chip is formed, the shear band begins at the primary shear zone and trans- fers to the free surface, so that a segment is produced and it is completed by upsetting between the formatting segment and the formatted segment. 2. As the rake angle or the clearance angle increases in the machining of the titanium alloy, the chip approaches to that of the continous type. 3. When the rake angle and the clearance angle are increased the shear energy and the unit friction energy decrease, which shows the same aspect as that of the continuous chip.

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