• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.155-161
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• 2018

강성도가 서로 다른 polydimethylsiloxane (PDMS) 탄성고분자와 flexible printed circuit board (FPCB)로 이루어진 PDMS/FPCB 구조의 강성도 국부변환 신축기판에 $100{\mu}m$ 직경의 Cu/Au 범프를 갖는 Si 칩을 anisotropic conductive adhesive (ACA)를 사용하여 플립칩 본딩 후, ACA내 전도성 입자에 따른 플립칩 접속저항을 비교하였다. Au 코팅된 폴리머 볼을 함유한 ACA를 사용하여 플립칩 본딩한 시편은 $43.2m{\Omega}$의 접속저항을 나타내었으며, SnBi 솔더입자를 함유한 ACA로 플립칩 본딩한 시편은 $36.2m{\Omega}$의 접속저항을 나타내었다. 반면에 Ni 입자를 함유한 ACA를 사용하여 플립칩 본딩한 시편에서는 전기적 open이 발생하였는데, 이는 ACA내 Ni 입자의 함유량이 부족하여 entrap된 Ni 입자가 하나도 없는 플립칩 접속부가 발생하였기 때문이다.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• 한국전기전자재료학회논문지
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• 제36권2호
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• pp.158-163
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• 2023

Recently, the global demands for high voltage power semiconductors are increasing across various industrial fields. The use of electric cars with high safety and convenience is becoming practical, and IGBT modules of 3.3 kV and 1.2 kA or higher are used for electric locomotives. Delicate design and advanced process technology are required, and research on the optimization of high-voltage IGBT parts is urgently needed in the industry. In this study, we attempted to design a simulation process through TCAD (technology computer-aid design) software to optimize the process conditions of the fielding process among the core unit processes for an especial high yield voltage. As well, the prior circuit technology design and a ring pattern with a large number of ring formation structures outside the wafer similar to the chip structure of other companies were constructed for 3.3 kV NPT-IGBT through a unit process demonstration experiment. The ring pattern was designed with 21 rings and the width of the ring was 6.6 ㎛. By changing the spacing between patterns from 17.4 ㎛ to 35.4 ㎛, it was possible to optimize the spacing from 19.2 ㎛ to 18.4 ㎛.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.73-73
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• 2012

Modern technology-driven society largely relies on hybrid electric vehicles or electric vehicles for eco-friendly transportation and the use of high technology devices. Lithium rechargeable batteries are the most promising power sources because of its high energy density but still have a challenge. Graphite is the most widely used anode material in the field of lithium rechargeable batteries due to its many advantages such as good cyclic performances, and high charge/discharge efficiency in the initial cycle. However, it has an important safety issue associated with the dendritic lithium growth on the anode surface at high charging current because the conventional graphite approaches almost 0 V vs $Li/Li^+$ at the end of lithium insertion. Therefore, a fundamental solution is to use an electrochemical redox couple with higher equilibrium potentials, which suppresses lithium metal formation on the anode surface. Among the candidates, $Li_4Ti_5O_{12}$ is a very interesting intercalation compound with safe operation, high rate capability, no volume change, and excellent cycleability. But the insulating character of $Li_4Ti_5O_{12}$ has raised concerns about its electrochemical performance. The initial insulating character associated with Ti4+ in $Li_4Ti_5O_{12}$ limits the electronic transfer between particles and to the external circuit, thereby worsening its high rate performance. In order to overcome these weak points, several alternative synthetic methods are highly required. Hence, in this presentation, novel ways using a synergetic strategy based on 1D architecture and surface coating will be introduced to enhance the kinetic property of Ti-based electrode. In addition, first-principle calculation will prove its significance to design Ti-based electrode for the most optimized electrochemical performance.

• Corrosion Science and Technology
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• 제6권2호
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• 대한기계학회논문집B
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• 제26권5호
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• pp.629-639
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• 2002

In-vitro flow characteristics downstream of a polyurethane artificial heart valve and a Bjork-Shiley Monostrut mechanical valve have been comparatively investigated in pulsatile flow using particle image velocimetry (PIV). With a triggering system and a time-delayed circuit the velocity distributions on the two perpendicular measurement planes downstream of the valves are evaluated at any given instant in conjunction with the opening behaviors of valve leaflets during a cardiac cycle. The regions of stasis and high shear stress can be found simultaneously by examining the entire view of the instantaneous velocity and Reynolds shear stress fields. It is known that high shear stress regions exist at the interface between strong axial jet flows along the wall and vortical flows in the central area distal to the valves. In addition. there are large stagnation or recirculation regions in the vicinity of the valve leaflet, where thrombus formation can be induced by accumulation of blood elements damaged in the high shear stress zones. A correlation between the unsteady flow patterns downstream of the valve and the corresponding opening postures of the polyurethane valve membrane gives useful data necessary for improved design of the frame structure and leaflet geometry of the polyurethane valve.

• 한국화재소방학회논문지
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• 제34권4호
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• pp.1-6
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• 2020

본 논문은 직렬 아크 방전이 진행될 때의 전압 및 전류 파형을 실시간 측정하였다. 아크 방전의 방사 패턴을 분석한 결과 간헐적인 방전, 아크의 성장, 발열부의 생성, 플룸의 발생, 적열부 형성 순서로 진행되는 것을 알 수 있었다. 직렬 아크 방진이 진행될 때 전류 및 전압 파형은 정현파와 같은 주기성을 나타냈다. 그리고 + 파형에서 - 파형으로 바뀔 때와 - 파형에서 + 파형으로 바뀔 때 파형의 재기전압이 발생하는 것이 확인되었다. 방전이 진행될 때 1 s 동안에 발생하는 열량은 약 0.317 mJ이고, 600 s 동안에 약 190 mJ의 열이 발생하는 것으로 해석되었다. 그리고 단락 지속시간은 약 1.66 ms인 것으로 해석되었으며, 동일한 주기에서 전압 파형은 49.9 V까지 전위가 상승하는 것을 알 수 있었다. 또한, 방전이 진행될 때 전류의 실효치는 약 1.72 A이고, 최대치는 약 2.53 A로 분석되었다. 그리고 전압의 실효치는 약 42.8 V로 계산되었고, 최대치는 약 208 V로 측정되었다.

• 마이크로전자및패키징학회지
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• 제13권3호
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• pp.1-8
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• 2006

인쇄회로기판이나 플라스틱 패키지 등 다양한 전자소자 부품내 배선간 간격이 갈수록 좁아짐에 따라 최근 많이 발생하고 있는 electrochemical migration(ECM) 현상은 양극에서 이온화된 금속에 의한 conductive anodic filament(CAF) 및 덴드라이트와 같은 전도성 필라멘트의 성장으로 인해 전자부품의 절연파괴를 일으키고 있다. 본 연구에서는 공정조성 Sn-37Pb솔더 합금의 ECM 거동과 부식특성 사이의 연관성 평가를 통해 ECM 우세원소를 파악하기 위해 D.I Water 및 NaCl 용액에서 Water Drop Test(WDT)와 분극실험을 실시하여 서로 비교하였다. WDT 실시 결과 공정조성 Sn-37Pb 솔더 합금에서 Pb-rich 상이 Sn-rich 상보다 우선적으로 양극 패드에서 녹아나서 상대적으로 ECM 저항성이 낮았으며, 음극패드에서 자라난 덴드라이트에도 Pb가 훨씬 많이 존재하였다. NaCl에서의 분극실험 결과 전기화학적으로 부동태 피막을 형성하는 Sn에 비해 Pb의 부식속도가 크게 나타났으며, WDT의 결과와 같은 경향을 보였다. 따라서 공정조성 SnPb 솔더 합금의 부식저항성과 ECM 저항성 사이에는 좋은 상관관계가 존재한다.