• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.33-39
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• 2009

A microlens array (MLA) was developed based on the wet-etched quartz substrate and coating of UV adhesive on the substrate for maskless lithography application. The developed MLA has the focal length of ${\sim}45\;{\mu}m$ and the spot size of ${\sim}1\;{\mu}m$. The spot size of the focused beam passing through the MLA was detected by CCD camera, and its intensity was monitored by beam profiler. Uniform spots with nearly identical intensities were observed on the focal plane when a beam passes through the fabricated MLA. The focal length was varied depending on thickness of the coated UV adhesive. The thicker the thickness of the UV adhesive was, the shorter the focal length of the MLA was. With a general mask aligner, UV beam focusing was tested onto photoresist (PR). The beams were well focused onto PR when UV passes through the MLA. Depending on the variable distances from the MLA, beam sizes onto PR were controlled. Even at high temperature for a long time, the performances of the MLA were not changed.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.29B no.2
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• pp.40-49
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• 1992

In this paper,a new approach-using the linear movement of the lens location in a camera and focal distance in each location for the measurement of the depth of the 3-D object from several 2-D images-is proposed. The sharply focused edges are extracted from the images obtained by moving the lens of the camera, that is, the distance between the lens and the image plane, in the range allowed by the camera lens system. Then the depthin formation of the edges are obtained by the lens location. In our method, the accurate and complicated control system of the camera and a special algorithm for tracing the accurate focus point are not necessary, and the method has some advantage that the depth of all objects in a scene are measured by only the linear movement of the lens location of the camera. The accuracy of the extracted depth information is approximately 5% of object distances between 1 and 2m. We can see the possibility of application of the method in the depth measurement of the 3-D objects.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.8
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• pp.1104-1110
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• 2014

This paper investigates geometric effect of landmarks on three-dimensional navigation error in landmark-based vision navigation systems. Dilution of precision is derived for landmark measurement error on the focal plane of the camera and separately expressed in position DOP and attitude DOP. Values of DOP are observed for various configurations of landmarks.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.101-101
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• 2000

MSC(Multispectral Camera), which will be a unique payload on KOMPSAT-II, is designed to collect panchromatic and multi-spectral imagery with a ground sample distance of 1m and a swath width of 15km at 685km altitude in sun-synchronous orbit. The instrument is designed to have an orbit operation duty cycle of 20% over the mission life time of 3 years. MSC electronics consists of three main subsystems; PMU(Payload Management Unit), CEU(Camera Electronics Unit) and PDTS(Payload Data Transmission Subsystem). PMU performs all the interface between spacecraft and MSC, and manages all the other subsystems by sending commands to them and receiving telemetry from them with software protocol through RS-422 interface. CEU controls FPA(Focal Plane Assembly) which contains TDI(Timc Delay Integration) CCD(Charge Coupled Device) and its clock drivers. PMU provides a Master Clock to synchronize panchromatic and multispectral camera. PDTS performs compression, storage and encryption of image data and transmits them to the ground station through x-band.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.780-783
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• 2004

The two-dimensional modeling of the non-stationary thermal state and voltage responsivity of the sensitive elements usually used in solid-state pyroelectric focal plane arrays are presented. Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, which is composed of the pyroelectric sensitive elements mounted on a single silicon substrate, are numerically calculated. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column and the bulk silicon readout. The results of the numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f < 10Hz) of periodically modulated light. It is also shown that the use of our models gives the possibility to improve the design, operating regimes and sensitivity of the device.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1043-1044
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• 2008

In this study, a novel algorithm of the improvement residual non-uniformity (RNU) in thermal imaging system is proposed using correlated double sample signal processing. The proposed method attempts to eliminate offset variation of ROIC in IR detector causing the variation of FPA (focal plane array) temperature and suppling power. Experimental results show that the proposed method confirmed a better performance than the existing RNU system.

• Proceedings of the KSRS Conference
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• 2003.11a
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• pp.1118-1120
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• 2003

In MSC(Multi-spectral camera ), the incoming light is converted to electronic analog signals by the CCD(charge coupled device) detectors. The analog signals are amplified, biased and converted into digital signals (pixel data stream) in the FPE(Focal plane electronics ). The digital data is transmitted to the PMU for pre-processing to correct for nonuniformity, to partially reorder the pixel stream and to add header data for identification and synchronization In this paper, the video data streams is described in terms of hardware.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.5
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• pp.558-567
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• 1999

X-ray laminography and DT(digital tomosynthesis) that can form a cross-sectional image of 3-D objects promis to be good solutions for inspecting interior defects of industrial products. DT is a kind of laminography technique and the difference is in the fact that it synthesizes the several projected images by use of the digitized memory and computation. The quality of images acquired from the DT system varies according to image synthesizing methods, the number of images used in image synthesizing, and X-ray projection angles. In this paper, a new image synthesizing method named 'log-root method' is proposed to get clear and accurate cross-sectional images, which can reduce both artifact and blurring generated by materials out of focal plane. To evaluate the quality of cross-sectional images, two evaluating criteria : (1) shape accuracy and (2) clearness of the cross-sectional images are defined. Based on these criteria, a series of simulations are performed, and the results show the superiority of the new synthesizing method over the existing ones such as averaging and minimum methods.

• Journal of information and communication convergence engineering
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• v.13 no.4
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• pp.270-274
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• 2015

In this paper, we propose an improved framework to analyze an N-ocular imaging system under fixed constrained resources such as the number of image sensors, the pixel size of image sensors, the distance between adjacent image sensors, the focal length of image sensors, and field of view of image sensors. This proposed framework takes into consideration, for the first time, the defocusing effect of the imaging lenses according to the object distance. Based on the proposed framework, the N-ocular imaging system such as integral imaging is analyzed in terms of depth resolution using two-point-source resolution analysis. By taking into consideration the defocusing effect of the imaging lenses using ray projection model, it is shown that an improved depth resolution can be obtained near the central depth plane as the number of cameras increases. To validate the proposed framework, Monte Carlo simulations are carried out and the results are analyzed.