• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.146-150
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• 2021

Plasma information based virtual metrology (PI-VM) that predicts wafer-to-wafer etch rate variation after wet cleaning of plasma facing parts was developed. As input parameters, plasma information (PI) variables such as electron temperature, fluorine density and hydrogen density were extracted from optical emission spectroscopy (OES) data for etch plasma. The PI-VM model was trained by stepwise variable selection method and multi-linear regression method. The expected etch rate by PI-VM showed high correlation coefficient with measured etch rate from SEM image analysis. The PI-VM model revealed that the root cause of etch rate variation after the wet cleaning was desorption of hydrogen from the cleaned parts as hydrogen combined with fluorine and decreased etchant density and etch rate.

• 한국결정성장학회지
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• 제14권5호
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• pp.220-225
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• 2004

Four different Fluorine-based gases ($SF_6/,NF_3, PF_5,\; and \; BF_3$) were examined for high rate Inductively Coupled Plasma etching of Si. Etch rates up to ~8$\mu\textrm{m}$/min were achieved with pure $SF_6$ discharges at high source power (1500 W) and pressure (35 mTorr). A direct comparison of the four feedstock gases under the same plasma conditions showed the Si etch rate to increase in the order $BF_3$ < $NF_3$< $PF_5$ < $SF_6$. This is in good correlation with the average bond energies of the gases, except for $NF_3$, which is the least strongly bound. Optical emission spectroscopy showed that the ICP source efficiently dissociated $NF_3$, but the etched Si surface morphologies were significantly worse with this gas than with the other 3 gases.

• 전자공학회논문지D
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• 제35D권1호
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• pp.27-33
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• 1998

In this study, chlorine(Cl)-based gas chemistry is generally used to etching for AlCu films metallization.The corrosion phenomena of AlCu films were examined with XPS (X-ray photoelectron spectroscopy), SEM 9Scanning electron microscopy), and TEM (Transmission electron microscopy). SF$_{6}$ plasma treatment sulbsequent to the etching process preventas the corrosion effectively in the pressure of 300 mTorr. It is found that the cholrine atoms on the etched surface are not substituted for fluorine atoms during SF$_{6}$ treatment, but a passivation layer on the surface by fluorine-related compounds would be formed. The passivation layer prevents the moisture penetration on the SF$_{6}$ treated surface and suppresses the corrsion sucessfully.fully.

• 마이크로전자및패키징학회지
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• 제6권1호
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• pp.75-79
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• 1999

차세대 저유전상수 층간 절연막중 하나로 대두되고 있는 polyimide를 플라즈마에 노출시키고 이때 나타나는 전기적 특성변화를 살펴보았다. polyimide를 알루미늄 식각시 사용되고 있는 Cl-based 플라즈마에 노출시켰을때 유전상수가 약간 증가함을 볼 수 있었고, F-based 플라즈마로 $SF_{6}$ 플라즈마에 노출시켰을 때는 유전상수 감소를 볼 수 있었다. 이는 fluorine또는 chlorine bond의 생성과 관련된 것으로 FTIR과 XPS분석을 통해 확인할 수 있었다. 따라서 Cl-based 플라즈마로 알루미늄 식각 후 $SF_{6}$플라즈마에 노출시킴으로써 이 부식문제의 해결뿐만 아니라 po1yimide의 유전상수도 낮출 수 있으리라 기대된다.

• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.119-126
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• 2022

MAS-based glass, which has been studied to replace the ceramic material used in the plasma etching chamber, has problems such as forming and processing due to its high melting temperature. To solve this problem, in this study, fluoride was added to the existing MAS-based glass to increase the workability in the glass manufacturing and to improve the chemical resistance to CF₄/Ar/O₂ plasma gas. Through RAMAN analysis, the structural change of the glass according to the addition of fluoride was observed. In addition, it was confirmed that high-temperature viscosity and thermal properties decreased as the fluoride content increased and plasma resistance was maintained, it showed an excellent etching rate of up to 11 times compared to quartz glass.

• 전자공학회논문지A
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• 제33A권12호
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• pp.47-52
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• 1996

Cl-based gas chemistry is generally used to etching for al alloy metallization. After the etching of Al alloy with Cl-based gas plasma, residual chlorine on Al alloy reacts with H$_{2}$O due to air exposure and results in Al corrosion. In this study, the corrosion phenomena of Al wer examined with XPS(X-ray photoelectron spectroscopy) and SEM (scanning electorn microscopy). It was confirmed that chlorine mainly existed at the grian boundary of Al alloy after plasma etching of Al alloy with cl-based gas chemistry and Al corrosion was largely generated at the grain boundary of Al alloy. And residual chlorine was passivated by sulfur and fluorine which were generated by SF$_{6}$ plasma. These effects of passivation reduced the Al corrosion due to air exposure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.252-255
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• 1996

Cl-based gas chemistry is generally used to etching for Al alloy metallization. After the etching of Al alloy with Cl-based gas plasma, residual chlorine on Al alloy reacts with $H_2O$ due to air exposure and results in Al corrosion. In this study, the corrosion Phenomena of Al were examined with XPS(X-ray photoelectron spectroscopy) and SEF(Scanning electron microscopy). It was confirmed that chlorine mainly existed at the grain boundary of Al alloy after plasma etching of Al alloy with Cl-based gas chemistry and Al corrosion was largely generated at the grain boundary of Al a1loy. And residual chlorine was passivated by sulfur and fluorine which were generated by SF$_{6}$ plasma. These effects of passivation reduced the Al corrosion due to air exposure.e.

• 한국안광학회지
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• 제15권3호
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• pp.207-212
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• 2010

목적: 불화규소 아크릴레이트 RGP 콘택트렌즈(Boston EO, Boston XO)를 공기 중에서 플라즈마로 처리하여 표면의 성분, 형상, 습윤성의 변화를 연구하였다. 방법: 성분과 결합구조는 X-선광전자분광분석기(XPS), 형상과 거칠기는 원자현미경(AFM)으로 관찰하였으며, 습윤성의 변화는 접촉각을 측정하여 평가하였다. 결과: 플라즈마 처리에 의해 표면에서 불소는 크게 감소하고, 산소와 실리콘은 증가하였다. 산소를 포함하는 친수성기(C-O, Si-O)가 증가하고, 소수성인 표면이 감소하였으며, 접촉각이 증가하였다. 그러나 불소의 치환으로 생성된 C-O는 습윤성을 증진하지 않았다. 결과: 플라즈마 처리한 다음 6개월이 지나면 표면조성에는 큰 변화가 없으나, 접촉각이 다시 증가하였다. 결론: 불소의 함량이 높은 RGP 콘택트렌즈의 플라즈마 처리에 의한 습윤성 증가는 활성화된 표면과 Si-O의 증가, 소수성 표면의 감소에 의한 것으로 판단된다.

• 공업화학
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• 제34권5호
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• pp.534-540
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• 2023

일차전지 환원극의 활물질로 널리 사용되고 있는 불화탄소는 낮은 전기 전도도, 표면 에너지 및 전해질 투과도 등의 요인에 의하여 Li/CF_X 일차전지의 율속 성능 저하를 초래한다. 따라서 본 연구에서는 산소 플라즈마를 이용한 표면처리를 통하여 표면이 개질된 불화탄소를 리튬 일차전지의 환원극으로 사용하여 전지 성능을 향상시키고자 하였다. XPS 및 XRD 분석을 통해 산소 플라즈마 처리에 의해 변화된 불화탄소의 표면 화학적 특성 및 결정 구조 변화를 분석하였으며, 이에 따른 리튬 일차전지의 전기 화학적 특성에 대한 변화를 분석하고 고찰하였다. 그 결과, 탄소 대 불소비율(F/C) 비율이 가장 낮은 산소 플라즈마 처리 조건(7.5 min)에서 반이온성 C-F 결합이 가장 많이 형성되었다. 또한, 이 조건에서 제조된 불화탄소를 환원극의 활물질로 사용한 일차전지는 가장 높은 3 C의 율속 특성을 보였으며, 고율속에서도 비교적 높은 용량(550 mAh/g)을 유지하였다. 본 연구를 통하여, 산소 플라즈마 처리를 통해 불화탄소의 불소함량 및 탄소-불소 간의 결합 유형을 조정하여 고율속 성능을 가진 리튬 일차전지를 제조할 수 있었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 추계학술발표대회
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• pp.44.2-44.2
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• 2009

Polycrystalline materials suchas yttria and alumina have been applied as a plasma resisting material for the plasma processing chamber. However, polycrystal line material may easily generate particles and the particles are sources of contamination during the plasma enhanced process. Amorphous material can be suitable to prevent particle generation due to absence of grain-boundaries. We manufactured nitrogen-containing $SiO_2-Al_2O_3-Y_2O_3$ based glasses with various contents of silicon and fixed nitrogen content. The thermal properties, mechanical properties and plasma etching rate were evaluated and compared for the different composition samples. The plasma etching behavior was estimated using XPS with depth profiling. From the result, the plasma etching rate highly depends on the silicon content and it may results from very low volatile temperature of SiF4 generated during plasma etching. The silicon concentration at the plasma etched surface was very low besides the concentration of yttrium and aluminum was relatively high than that of silicon due to high volatile temperature of fluorine compounds which consisted with aluminum and yttrium. Therefore, we conclude that the samples having low silicon content should be considered to obtain low plasma etching rate for the plasma resisting material.