• Applied Chemistry for Engineering
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• v.34 no.5
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• pp.534-540
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• 2023

The high-rate performance is limited by several factors, such as polarization generation, low electrical conductivity, low surface energy, and low electrolyte permeability of CF_X, which is widely used as a cathode active material in the lithium primary battery. Therefore, in this study, we aimed to improve the battery performance by using carbon fluoride modified by surface treatment using oxygen plasma as a cathode for lithium primary batteries. Through XPS and XRD analysis, changes in the surface chemical characteristics and crystal structure of CF_X modified by oxygen plasma treatment were analyzed, and accordingly, the electrochemical characteristics of lithium-ion primary batteries were analyzed and discussed. As a result, the highest number of semi-ionic C-F bonds were formed under the oxygen plasma treatment condition (7.5 minutes) with the lowest fluorine to carbon (F/C) ratio. In addition, the primary cell prepared under this condition using carbon fluoride as the active material of the cathode showed the highest 3 F/C(3 C rate-performance) rate-performance and maintained a relatively high capacity (550 mAh/g) even at high rates. In this study, it was possible to produce lithium primary batteries with high-rate performance by adjusting the fluorine contents of carbon fluoride and the type of carbon-fluorine bonding through oxygen plasma treatment.

• Journal of Korean Ophthalmic Optics Society
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• v.15 no.3
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• pp.207-212
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• 2010

Purpose: Rigid gas permeable (RGP) contact lenses, based on fluorosilicone acrylate, were treated with plasma in air. Methods: The chemical compositions were analyzed by using X-ray photoelectron spectroscopy (XPS), the surface morphology and roughness of RGP contact lenses were observed by using atomic force microscopy (AFM), and the wettability changes were estimated by wetting angle measurement. Results: As the contact lenses were treated by the plasma, the F contents decreased significantly, and the O and Si contents increased on the surface. The number of oxygen-containing hydrophilic radicals (C-O and Si-O) increased greatly, the hydrophobic surface decreased, and the wetting angle increased. But the C-O bonds created with exchange of the fluorine did not increase a wettability. The surface compositions were not remarkably changed for the 6 months after plasma treatment, but the wetting angle increased again. Conclusions: It was considered that the improved wettability of the RGP contact lenses of high fluorine content after plasma treatment was affected by the activation of surface, the increase of Si-O, and the decrease of hydrophobic surface.

• Textile Coloration and Finishing
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• v.11 no.1
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• pp.25-33
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• 1999

PET fabric was grafted with $CF_4$ or $C_2F_6$ plasmas generated by glow discharge. The water repellency of plasma-treated fabrics were evaluated with contact angle meter. The change in surface morphologies was observed by SEM, and the change of surface chemical characteristics were analyzed by FT-IR, ESCA and microchemical analysis technique. The results obtained are as follows : 1) The contact angle of plasma-treated fabric was over $150^\circ{C}$. 2) It was observed by SEM that the surface of treated substrate was over coated with thin film formed by the fluorocarbon plasma treatment. 3) According to ESCA analysis, there were prevailing -CHF-, $-CF_2$- and a little $-CF_3$ components on fluorocarbon plasma treated substrate. -CHF- and $-CF_2$- components were reduced by washing, and $-CF_2$- component was recovered by heat treatment. 4) In consideration of quantitative analysis of fluorine and F/C ratio by ESCA, we found that fluorination reached to the inner of substrate.

• Applied Chemistry for Engineering
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• v.32 no.6
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• pp.653-658
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• 2021

Polyvinylidene fluoride (PVDF) is a promising coating material because of its outstanding processability. The PVDF coating, however, has limitations in anti-corrosion application due to its weak hydrophobicity compared to that of other fluoropolymers. In this study, plasma fluorination was performed using carbon tetrafluoride (CF₄) gas to improve anti-corrosion properties of PVDF. The fluorine content and hydrophobicity of PVDF were investigated in different CF₄ flow rates, followed by the determination of anti-corrosion properties. The fluorine content on the surface of the PVDF film increased by up to 46.70%, but the surface free energy was independent of CF₄ flow rate. Meanwhile, the surface roughness of the PDVF film tended to increase by up to 150% and then decrease with increasing CF₄ flow rate. It is considered that the plasma fluorination affects the surface free energy due to the introduction of fluorine functional groups and surface etching. In addition, the degree of corrosion of the PVDF-coated Fe plate was significantly reduced from 49.2% to 19.0% compared to that of the uncoated Fe plate. In particular, the degree of corrosion of the fluorinated PVDF-coated Fe plate was 13.6%, which was 28.4% lower than that of the PVDF-coated Fe plate, showing improved anti-corrosion protection.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.47-48
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• 1996

No Abstract (See Full-text)

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.104.4-104
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.44.2-44.2
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• 2009

Polycrystalline materials suchas yttria and alumina have been applied as a plasma resisting material for the plasma processing chamber. However, polycrystal line material may easily generate particles and the particles are sources of contamination during the plasma enhanced process. Amorphous material can be suitable to prevent particle generation due to absence of grain-boundaries. We manufactured nitrogen-containing $SiO_2-Al_2O_3-Y_2O_3$ based glasses with various contents of silicon and fixed nitrogen content. The thermal properties, mechanical properties and plasma etching rate were evaluated and compared for the different composition samples. The plasma etching behavior was estimated using XPS with depth profiling. From the result, the plasma etching rate highly depends on the silicon content and it may results from very low volatile temperature of SiF4 generated during plasma etching. The silicon concentration at the plasma etched surface was very low besides the concentration of yttrium and aluminum was relatively high than that of silicon due to high volatile temperature of fluorine compounds which consisted with aluminum and yttrium. Therefore, we conclude that the samples having low silicon content should be considered to obtain low plasma etching rate for the plasma resisting material.

• ETRI Journal
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• v.16 no.1
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• pp.45-57
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• 1994

The effects of reactive ion etching (RIE) of $SiO_2$ layer in $CHF_3/C_2F_6$ on the underlying Si surface have been studied by X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometer, Rutherford backscattering spectroscopy, and high resolution transmission electron microscopy. We found that two distinguishable modified layers are formed by RIE : (i) a uniform residue surface layer of 4 nm thickness composed entirely of carbon, fluorine, oxygen, and hydrogen with 9 different kinds of chemical bonds and (ii) a contaminated silicon layer of about 50 nm thickness with carbon and fluorine atoms without any observable crystalline defects. To search the removal condition of the silicon surface residue, we monitored the changes of surface compositions for the etched silicon after various post treatments as rapid thermal anneal, $O_2$, $NF_3$, $SF_6$, and $Cl_2$ plasma treatments. XPS analysis revealed that $NF_3$ treatment is most effective. With 10 seconds exposure to $NF_3$ plasma, the fluorocarbon residue film decomposes. The remained fluorine completely disappears after the following wet cleaning.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.47-52
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• 1996

Cl-based gas chemistry is generally used to etching for al alloy metallization. After the etching of Al alloy with Cl-based gas plasma, residual chlorine on Al alloy reacts with H$_{2}$O due to air exposure and results in Al corrosion. In this study, the corrosion phenomena of Al wer examined with XPS(X-ray photoelectron spectroscopy) and SEM (scanning electorn microscopy). It was confirmed that chlorine mainly existed at the grian boundary of Al alloy after plasma etching of Al alloy with cl-based gas chemistry and Al corrosion was largely generated at the grain boundary of Al alloy. And residual chlorine was passivated by sulfur and fluorine which were generated by SF$_{6}$ plasma. These effects of passivation reduced the Al corrosion due to air exposure.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1500-1503
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• 2009

In this paper, we studied about atmospheric pressure remote plasma ashing of photoresist(PR), by using a modified dielectric barrier discharge(DBD). The effect of various gas combinations such as $N_2/O_2$, $N_2/O_2+SF_6$ on the changes PR ashing rate was investigated as a function of power. The maximum PR ashing rate of 1850 nm/min was achieved at $N_2$ (70 slm)/ $O_2$ (200 sccm) + $SF_6$ (3 slm). We found that as the oxygen and fluorine radical peaks were increased, the ashing rate is increased, too.