• Title/Summary/Keyword: Flexible material

Search Result 1,045, Processing Time 0.036 seconds

A Feasibility Study on Resilient Modulus of Expanded Polystyrene (EPS) Geofoam as a Flexible Pavement Subgrade Material (연성포장의 노반재료로서 EPS 지오폼의 회복탄성계수에 관한 적합성 연구)

  • Park, Ki-Chul;Chang, Yong-Chai
    • Journal of the Korean GEO-environmental Society
    • /
    • v.12 no.12
    • /
    • pp.63-70
    • /
    • 2011
  • Expanded Polystyrene (EPS) is a type of geosynthetic material manufactured with various strengths, unit weights, and dimensions. Due to recent advances in research on EPS, the use of EPS has increased dramatically. This super light weight material has a unit weight of approximately $0.16{\sim}0.47kN/m^3$, equivalent to 6.3~15.7 of that of most natural soils with conditions of fill materials. In spite of this advantage, it is noted that no standard method of resilient modulus test on EPS geofoam was reported and no literature on resilient modulus test methods for EPS geofoam exist. The main object of this study was to investigate feasibility of the resilient modulus of EPS when it was applied for flexible pavement. The investigation of the feasibility was completed based on the results from triaxial tests.

Independent Cell Formation Considering Operation Sequences and Machine Capacity in Flexible Assembly Systems (작업 순서와 기계 용량을 고려하는 유연조립 시스템의 독립 셀형성)

  • 노인규;최형호
    • Journal of Korean Society of Industrial and Systems Engineering
    • /
    • v.19 no.40
    • /
    • pp.253-261
    • /
    • 1996
  • In optimizing the layout design of a multi-product assembly environment, tile analysis of the material flow is a vital ingredient. In flexible assembly systems, assembly time is usually very short thus the transfer time is relatively more important Therefore operations sequence must be so determined, that have no backtracking operations as possible as, It is important to form cells, so that they have no intercell movement in curring much processing delay, and to arrange machines as possible as densly. This study presents a independent cell formation method considering operation sequences and machine capacity in flexible assembly systems.

  • PDF

Characterization of a Misaligned Supercritical Shaft of Flexible Matrix Composite (축어긋남이 있는 유연복합재 고속구동축의 특성 분석)

  • 홍을표;신응수
    • Transactions of the Korean Society for Noise and Vibration Engineering
    • /
    • v.14 no.1
    • /
    • pp.32-39
    • /
    • 2004
  • This research is to investigate the performance of a flexible matrix composite driveshaft with respect to shaft design parameters such as the number of layers, ply orientations, and material properties. A finite element formulation is utilized to estimate the allowable misalignment under given driving torque, the maximum temperature at steady states, and external damping for ensuring whirling stability under supercritical speed. Results indicate that the system performance can be greatly affected by the shaft laminate parameters, especially the ply orientations. Several sets of shaft parameters that will provide satisfactory overall system performance are derived.

Petri Net based Performance Evaluation of Manufacturing Cell (페트리 넷을 이용한 제조 셀의 성능평가)

  • Kim, Tai-Oun;Seo, Yoon-Ho;Sheen, Dong-Mok
    • IE interfaces
    • /
    • v.17 no.spc
    • /
    • pp.152-159
    • /
    • 2004
  • The Purpose of this paper is to propose performance evaluation schemes of flexible manufacturing cell using a generalized stochastic Petri net. In the competitive and global manufacturing environment, to evaluate the feasibility and manufacturability of a product in the product design stage is highly required. Through this process, all the possible problems which may occur in the manufacturing stage can be fixed in early stage. The scheme of generalized stochastic Petri net utilizing both immediate and exponential distributed transitions are applied to model a manufacturing cell with flexible machines, material handler, transporter and buffers. Performance analyses are performed based on behavioral, structural and quantitative properties. A flexible manufacturing cell is evaluated using a Petri net simulator.

Polymer Micromachined Flexible Tactile Sensor for Three-Axial Loads Detection

  • Choi, Woo-Chang
    • Transactions on Electrical and Electronic Materials
    • /
    • v.11 no.3
    • /
    • pp.130-133
    • /
    • 2010
  • A flexible three-axial tactile sensor was fabricated on Kapton polyimide film using polymer micromachining technology. Nichrome (Ni:Cr = 8:2) strain gauges were positioned on an etched membrane to detect normal and shear loads. The optimal positions of strain gauges were determined through strain distribution from finite element analysis. The sensor was evaluated by applying normal and shear loads from 0 N to 0.8 N using an evaluation system. Sensitivity of the tactile sensor to normal and shear loads was about 206.6 mV/N and 70.1 mV/N, respectively. The sensor showed good linearity, and its determination coefficient ($R^2$) was about 0.982. The developed sensor can be applied in a curved or compliant surface that requires slip detection and flexibility, such as a robotic fingertip.

($LEXAN^{(R)}$ for Flexible OLED Display Technology

  • Yan, Min;Ezawa, Hiro
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2005.07a
    • /
    • pp.614-615
    • /
    • 2005
  • The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

  • PDF

Characterization of a Misaligned Supercritical Shaft of Flexible Matrix Composite (축어긋남이 있는 유연복합재 고속구동축의 특성 분석)

  • 홍을표;신응수
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
    • /
    • 2003.05a
    • /
    • pp.107-113
    • /
    • 2003
  • This research is to investigate the performance of a flexible matrix composite driveshaft with respect to shaft design parameters such as the number of layers, ply orientations, and material properties. A finite element formulation is utilized to estimate the allowable misalignment under given driving torque, the maximum temperature at steady states, and external damping for ensuring whirling stability under supercritical speed. Results indicate that the system performance can be greatly affected by the shaft laminate parameters, especially the ply orientations. Several sets of shaft parameters that will provide satisfactory overall system performance are derived.

  • PDF

Double Hole Transport Layers Deposited by Spin-coating and Thermal-evaporating for Flexible Organic Light Emitting Diodes

  • Chen, Shin Liang;Wang, Shun Hsi;Juang, Fuh Shyang;Tsai, Yu Sheng
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08a
    • /
    • pp.741-744
    • /
    • 2007
  • The research applied the processes of spin-coating and thermal-evaporating in proper order to deposit the hole transport material N,N'-Bis(naphthalen-1-yl)- N,N'-bis(phenyl)-benzidine (NPB) on the ITO substrate to make flexible organic light emitting diodes (FOLED) with double hole transport layer.

  • PDF

Flexible Ultra-high Gas Barrier Substrate for Organic Electronics

  • Yan, Min;Erlat, Ahmet Gun;Zhao, Ri-An;Scherer, Brian;Jones, Cheryl;Smith, David J.;McConnelee, Paul A.;Feist, Thomas;Duggal, Anil
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08a
    • /
    • pp.445-446
    • /
    • 2007
  • The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

  • PDF

Process Optimization for Flexible Printed Circuit Board Assembly Manufacturing

  • Hong, Sang-Jeen;Kim, Hee-Yeon;Han, Seung-Soo
    • Transactions on Electrical and Electronic Materials
    • /
    • v.13 no.3
    • /
    • pp.129-135
    • /
    • 2012
  • A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.