• Title/Summary/Keyword: Flexible circuit board

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Properties of Lead-free Solder Joints on Flexible Substrate for Automotive Electronics (자동차 전장을 위한 플렉시블 기판 무연 솔더 접합부 특성)

  • Ahn, Sungdo;Choi, Kyeonggon;Park, Dae Young;Jeong, Gyu-Won;Baek, Seungju;Ko, Yong-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.2
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    • pp.25-30
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    • 2018
  • Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

DEVELOPMENT OF THE READOUT CONTROLLER FOR INFRARED ARRAY (적외선검출기 READOUT CONTROLLER 개발)

  • Cho, Seoung-Hyun;Jin, Ho;Nam, Uk-Won;Cha, Sang-Mok;Lee, Sung-Ho;Yuk, In-Soo;Park, Young-Sik;Pak, Soo-Jong;Han, Won-Yong;Kim, Sung-Soo
    • Publications of The Korean Astronomical Society
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    • v.21 no.2
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    • pp.67-74
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    • 2006
  • We have developed a control electronics system for an infrared detector array of KASINICS (KASI Near Infrared Camera System), which is a new ground-based instrument of the Korea Astronomy and Space science Institute (KASI). Equipped with a $512{\times}512$ InSb array (ALADDIN III Quadrant, manufactured by Raytheon) sensitive from 1 to $5{\mu}m$, KASINICS will be used at J, H, Ks, and L-bands. The controller consists of DSP(Digital Signal Processor), Bias, Clock, and Video boards which are installed on a single VME-bus backplane. TMS320C6713DSP, FPGA(Field Programmable Gate Array), and 384-MB SDRAM(Synchronous Dynamic Random Access Memory) are included in the DSP board. DSP board manages entire electronics system, generates digital clock patterns and communicates with a PC using USB 2.0 interface. The clock patterns are downloaded from a PC and stored on the FPGA. UART is used for the communication with peripherals. Video board has 4 channel ADC which converts video signal into 16-bit digital numbers. Two video boards are installed on the controller for ALADDIN array. The Bias board provides 16 dc bias voltages and the Clock board has 15 clock channels. We have also coded a DSP firmware and a test version of control software in C-language. The controller is flexible enough to operate a wide range of IR array and CCD. Operational tests of the controller have been successfully finished using a test ROIC (Read-Out Integrated Circuit).

Shape Design of FPCB Connector to Improve Assembly Performance (체결 성능 향상을 위한 FPCB 커넥터의 형상설계)

  • Kim, Dae-Young;Park, Hyung-Seo;Kim, Woong-Kyeom;Pyo, Chang-Ryul;Kim, Heon-Young
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.3
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    • pp.347-353
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    • 2012
  • Recently, multi-functionalization (as in smart phones) has been in demand, and the connectors connecting the electrical signals of each board in a cellular phone have become key components. The miniaturization of these connectors is required to achieve a finer pitch design and enhance the electrical signal transfer capacity. However, the miniaturization of connectors reduces the structural safety, and a finer pitch design may cause contact problems under external impact. In this paper, a preliminary design for miniaturized, finer-pitch connectors is suggested for a product with 50 pins and a thickness of 0.2 mm. The assembly process of the FPCB (Flexible Printed Circuit Board) and connector was simulated to ensure the holding force between the two components and avoid overstressing. The design optimization process was performed with the Taguchi method. Fatigue analysis was also conducted to predict the fatigue life of the terminal, and the theoretical and experimental results were compared.

DMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board (DMAB첨가량에 따른 연성회로기판을 위한 무전해 Ni 도금박막에 관한 연구)

  • Kim, Hyung-Chul;Rha, Sa-Kyun;Lee, Youn-Seoung
    • Korean Journal of Materials Research
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    • v.24 no.11
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    • pp.632-638
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    • 2014
  • We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

A New Approach far Reducing Audible Noise in Mobile TFT LCD Module (모바일 TFT-LCD 모듈에서 발생하는 가청잡음을 줄이기 위한 새로운 방법)

  • Ryu, Jee-Youl;Noh, Seok-Ho
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.06a
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    • pp.540-543
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    • 2007
  • In this paper, we propose a new approach to reduce the audible noise generated by TFT-LCD module in mobile applications. We also analyzed impact factors which effect on the audible noise. It is expected that this noise source comes from various impact factors such as vibration of flexible printed-circuit board (FPCB) and LCD panel, and static electricity charged in window and back-light unit. Windowless type and window type models are evaluated to analyze noise level due to the static electricity charged in window. To obtain reliable and reproducible data, we constructed controllable test jig and measurement set-up.

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A Wireless Intraocular Pressure Sensor with Variable Inductance Using a Ferrite Material

  • Kang, Byungjoo;Hwang, Hoyong;Lee, Soo Hyun;Kang, Ji Yoon;Park, Joung-Hu;Seo, Chulhun;Park, Changkun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.4
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    • pp.355-360
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    • 2013
  • A wireless intraocular (IOP) pressure sensor based on micro electro mechanical system (MEMS) technology is proposed. The proposed IOP sensor uses variable inductance according to the external pressure. The proposed sensor is composed of two flexible membranes: a ferrite bottom part, an inductor, and a capacitor. The inductance of the sensor varies according to the external pressure. The resonance frequency of the sensor is also varied, and this frequency is detected using an external coil. The external coil is designed with an FR-4 printed circuit board. The feasibility of the proposed sensor structure using variable inductance to detect the external pressure is successfully demonstrated.

An Analysis of FCCL Shielding Effect for EMF Attenuation to On-Line Electric Vehicle (On-Line Electric Vehicle의 EMF 저감을 위한 FCCL 차폐효과 분석)

  • Shim, Hyung-Wook;Kim, Jong-Woo;Cho, Dong-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.6
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    • pp.770-775
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    • 2014
  • According to ICNIRP guidelines for limiting exposure to time-varying electric, magnetic and electromagnetic fields up to 300GHz, magnetic flux density which range from 3Hz to 150kHz are regulated to lower than $6.25{\mu}T$. In order to comply with its standard, OLEV(On-Line Electric Vehicle) have been designed considering EMF(Electro-Magnetic Field) reduction. However, if a current flowing in power line would be bigger for increasing power transfer efficiency, the established shield system no longer acts their role properly. In this paper, therefore, FCCL(Flexible Copper Clad Laminate) is applied to power line and pick-up devices to solve the problems. Though, the FCCL is normally utilized to insulator on circuit board, because of its high heat resistance characteristic, flexibility and thin properties, it makes effectiveness in the shielding device as well. 4 types of FCCL shielding structure are introduced to power line and pick-up devices. From the results, the FCCL which are placed in proposed positions shows maximum EMF reduction compared to the established shielding structure. Henceforth, if OLEV is applied FCCL shielding structure in practice, it will not only be more safe but also step forward to commercialization near future.

Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • v.4 no.1
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

FPGA Design and SoC Implementation of Constant-Amplitude Multicode Bi-Orthogonal Modulation (정진폭 다중 부호 이진 직교 변복조기의 FPGA 설계 및 SoC 구현)

  • Hong, Dae-Ki;Kim, Yong-Seong;Kim, Sun-Hee;Cho, Jin-Woong;Kang, Sung-Jin
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.32 no.11C
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    • pp.1102-1110
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    • 2007
  • In this paper, we design the FPGA (Field-Programmable Gate Array) of the CAMB (Constant-Amplitude Multi-code Biorthogonal) modulation, and implement the SoC (System on Chip). The ASIC (Application Specific Integrated Circuit) chip is be implemented through targeting and board test. This 12Mbps modem SoC includes the ARM (Advanced RISC Machine)7TDMI, 64Kbyte SRAM(Static Random Access Memory) and ADC (Analog to Digital Converter)/DAC (Digital to Analog Converter) for flexible applications. Additionally, the modem SoC can support the variable communication interfaces such as the 16-bits PCMCIA (Personal Computer Memory Card International Association), USB (Universal Serial Bus) 1.1, and 16C550 Compatible UART (Universal Asynchronous Receiver/Transmitter).

Technical Evaluation of Engineering Model of Ultra-Small Transmitter Mounted on Sweetpotato Hornworm

  • Nakajima, Isao;Muraki, Yoshiya;Mitsuhashi, Kokuryo;Juzoji, Hiroshi;Yagi, Yukako
    • Journal of Multimedia Information System
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    • v.9 no.2
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    • pp.145-154
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    • 2022
  • The authors are making a prototype flexible board of a radio-frequency transmitter for measuring an electromyogram (EMG) of a flying moth and plan to apply for an experimental station license from the Ministry of Internal Affairs and Communications of Japan in the summer of 2022. The goal is to create a continuous low-dose exposure standard that incorporates scientific and physiological functional assessments to replace the current standard based on lethal dose 50. This paper describes the technical evaluation of the hardware. The signal of a bipolar EMG electrode is amplified by an operational amplifier. This potential is added to a voltage-controlled crystal oscillator (27 MHz, bandwidth: 4 kHz), frequency-converted, and transmitted from an antenna about 10 cm long (diameter: 0.03 mm). The power source is a 1.55-V wristwatch battery that has a total weight of about 0.3 g (one dry battery and analog circuit) and an expected operating time of 20 minutes. The output power is -7 dBm and the effective isotropic radiated power is -40 dBm. The signal is received by a dual-whip antenna (2.15 dBi) at a distance of about 100 m from the moth. The link margin of the communication circuit is above 30 dB within 100 m. The concepts of this hardware and the measurement data are presented in this paper. This will be the first biological data transmission from a moth with an official license. In future, this telemetry system will improve the detection of physiological abnormalities of moths.