• JSTS:Journal of Semiconductor Technology and Science
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• 제5권1호
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• pp.11-16
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• 2005

This paper presents fabrication process and experimental results of two different types of flexible MEMS biosensors based on polymer/metal multilayer processing techniques. One type of a biosensor is a microelectrode array (MEA) for nerve signal monitoring through implanting the MEA into a living body, and another is a tactile sensor capable of being mounted on an arbitrary-shaped surface. The microelectrode array was fabricated and its electrical characteristics have been examined through in vivo and in vitro experiment. For sensitive skin, flexible tactile sensor array was fabricated and its sensitivity has been analyzed. Mechanical flexibility of these biosensors has been achieved by using a polymer, and it is verified by implanting a MEA to an animal and mounting the tactile sensor on an arbitrary-shaped surface.

• 비파괴검사학회지
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• 제30권6호
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• pp.569-577
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• 2010

Nonplanar surface geometries of components are frequently encountered in real ultrasonic inspection situations. Use of rigid array transducers can lead to beam defocusing and reduction of defect image quality due to the mismatch between the planar array and the changing surface. When a flexible array is used to fit the complex surface profile, the locations of array elements should be known to compute the delay time necessary for adaptive heam focusing. An alternative method is to employ the time reversal focusing technique that does not require a prior knowledge about the properties and structures of the specimen and the transducer. In this paper, a time reversal method is applied to simulate beam focusing of flexible arrays and imaging of point-like defects contained in specimens with nonplanar surface geometry. Quantitative comparisons are made for the performance of a number of array techniques in terms of the ability to focus and image three point-like reflectors positioned at regular intervals. The sinusoidal profile array studied here exhibits almost the same image quality as the flat, reference case.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.163-164
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1035-1036
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• 2013

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.714-717
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• 2008

In this paper, we propose a three-dimensional (3D) integral imaging system using an elastic lens array instead of conventional rigid lens array. The lens array is made of polydimethylsiloxane (PDMS) that is optically transparent and flexible material. We can stretch the PDMS lens array to be expanded into a certain extent, and control the lens pitch of the system easily. That flexible design enables a fine 3D integral imaging display.

• 한국항공우주학회지
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• 제37권9호
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• pp.837-842
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• 2009

구성 모드(Component mode) 합성법을 이용하여, 태양전지판의 유연구조 진동특성을 고려한 위성의 축약된 동적 모델링 기법을 수립하였다. 유연구조 위성의 본체와 태양전지판을 서로 다른 두 개의 부구조물로 나누고, 각각의 국부좌표계에 대하여 유도된 부구조물 표현식들을 위성 전체의 기준좌표계에 대해서 합성하였다. 수립된 부구조물 합성법은 단일 태양전지판을 갖는 유연구조 위성의 수치적 예제에 적용되었으며, 태양전지판의 회전을 고려한 전달함수 결과의 고찰을 통하여 동적 모델링 기법의 타당성을 확인하였다.

• 한국표면공학회지
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• 제41권6호
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• pp.331-334
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• 2008

The replica of highly ordered nano-sphere array patterns were fabricated using hot embossing method. First, silica nano-sphere array on Si substrate was transferred to PVC film at $130^{\circ}C$ and 7 bar using hot embossing process. Then, silica nano-sphere array on PVC template was removed by soaking the PVC film in buffered oxide etcher. In order to form anti-stiction layer, the PVC template was coated with silicon dioxide layer and self-assembled monolayer. Through UV nanoimprint lithography with the fabricated flexible PVC template, highly ordered nano-sphere array pattern was imprinted on curved substrates with high fidelity.

• 정보저장시스템학회:학술대회논문집
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• 정보저장시스템학회 2005년도 추계학술대회 논문집
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• pp.17-21
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• 2005

High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• 정보저장시스템학회논문집
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• 제2권2호
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• pp.91-95
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• 2006

High-density image sensors rave microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using UV transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.