• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.19 no.12
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• pp.2468-2478
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• 1994

A hybrid finite element method is presented for a characterization of scattering an radiation properties of microstrip patch and arrays residing in a cavity recessed in a ground plane. The technique combines the finite element and boundary integral methods to formulate a system for the solution of fields at the aperture and the scattering field and radar cross sections at free space. By virture of the finite element method, the proposed technique is applicable to patch antennas and arrays residing on or embeded in a layered dielectric loss/lossless substrate and is also capable of treating various feed configuration. Several numerical results are presented demonstrating the validity, efficiency and capability of the technique.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.10
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• pp.27-37
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• 2021

The use of additive manufacturing processes for the repair and remanufacturing of mechanical parts has attracted considerable attention because of strict environmental regulations. Directed energy deposition (DED) is widely used to retrofit mechanical parts. In this study, finite element analyses (FEAs) were performed to investigate the influence of the substrate phase and inclination angle on the heat transfer characteristics in the vicinity of Hastelloy X regions deposited via DED. FE models that consider the bead size and hatch distance were designed. A volumetric heat source model with a Gaussian distribution in a plane was adopted as the heat flux model for DED. The substrate and the deposited powder were S45C structural steel and Hastelloy X, respectively. Temperature-dependent thermal properties were considered while performing the FEAs. The effects of the substrate phase and inclination angle on the temperature distributions and depth of the heat-affected zone (HAZ) in the vicinity of the deposited regions were examined. Furthermore, the influence of deposition paths on depths of the HAZ were investigated. The results of the analyses were used to determine the suitable phase and inclination angle of the substrate as well as the appropriate deposition path.

• Journal of the Korea Institute of Military Science and Technology
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• v.4 no.2
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• pp.122-129
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• 2001

A characterization procedure for analyzing symmetric coupled MIS(Metal-Insulator-Semiconductor) transmission line is used the same procedure as a general single layer symmetric coupled line with perfect dielectric substrate from the extraction of the characteristic impedance and propagation constant for even- and odd-mode. In this paper, an analysis for a new substrate shielding symmetric coupled MIS structure consisting of grounded crossbar at the interface between Si and SiO2 layer using the Finite- Difference Time-Domain(FDTD) method is presented. In order to reduce the substrate effects on the transmission line characteristics, a shielding structure consisting of grounded crossbar lines over time-domain signal has been examined. Symmetric coupled MIS transmission line parameters for even- and odd-mode are investigated as the functions of frequency, and the extracted distributed frequency- dependent transmission line parameters and corresponding equivalent circuit parameters as well as quality factor for the new MIS crossbar embedded structure are also presented. It is shown that the quality factor of the symmetric coupled transmission line can be improved without significant change in the characteristic impedance and effective dielectric constant.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• 연구논문집
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• s.27
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• pp.183-200
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• 1997

We have calculated the energy of three distinct grain configurations, namely completely connected, partially connected and unconnected configurations, evolving during a spheroidization of polycrystalline thin film by extending a geometrical model due to Miller et al. to the case of spheroidization at both the surface and film-substrate interface. "Stabilitl" diagram defining a stable region of each grain configuration has been established in terms of the ratio of grain size to film thickness vs. equilibrium wetting or dihedral angles at various interface energy conditions. The occurrence of spheroidization at the film-substrate interface significantly enlarges the stable region of unconnected grain configuration thereby greatly facilitating the occurrence of agglomeration. Complete separation of grain boundary is increasingly difficult with a reduction of equilibrium wetting angle. The condition for the occurrence of agglomeration differs depending on the equilibrium wetting or dihedral angles. The agglomeration occurs, at low equilibrium angles, via partially connected configuration containing stable holes centered at grain boundary vertices, whereas it occurs directly via completely connected configuration at large equilibrium angles except for the case having small surface and/or film-substrate interface energy. The initiation condition of agglomeration is defined by the equilibrium boundary condition between the partially connected and unconnected configurations for the former case, whereas it can, for the latter case, largely deviate from the equilibrium boundary condition between the completely connected and unconnected configurations because of the presence of a finite energy barrier to overcome to reach the unconnected grain configuration.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.1 s.104
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• pp.52-59
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• 2006

To construct its complex permittivity from the reflection coefficient of a thin film such as PCB substrate measured by open-ended coaxial probe, an integral equation is formulated using modal analysis and equivalent source. The accuracy of the conversion model based on the integral equation is confirmed in both cases of converted complex permittivities calculated from numerically computed and actually measured reflection coefficients. And the maximum valid frequency of open-ended coaxial probe is limited by the size of its flange.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• Structural Engineering and Mechanics
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• v.58 no.3
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• pp.423-442
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• 2016

This study considers a functionally graded (FG) elastic layer resting on homogeneous elastic substrate under axisymmetric static loading. The shear modulus of the FG layer is assumed to vary in an exponential form through the thickness. In solution, the FG layer is approximated into a multilayered medium consisting of thin homogeneous sublayers. Stiffness matrices for a typical homogeneous isotropic elastic layer and a half-space are first obtained by solving the axisymmetric elasticity equations with the aid of Hankel's transform. Global stiffness matrix is, then, assembled by considering the continuity conditions at the interfaces. Numerical results for the displacements and the stresses are obtained and compared with those of the classical elasticity and the finite element solutions. According to the results of the study, the approach employed here is accurate and efficient for elasto-static problems of FGMs.

• The Journal of the Acoustical Society of Korea
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• v.20 no.3E
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• pp.31-37
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• 2001

Finite element model of a cMUT is constructed using the commercial code ANSYS to analyze the cross talk mechanism. Calculation results of the complex load impedance seen by single capacitor cells are presented, and then followed by a calculation of the plane wave real load impedance seen by a parallel combination of many cells that are used to make a transducer. Cross talk between 1-D array elements is found to be due to two main sources: coupling through a Stoneley wave propagating at the transducer-water interface and coupling through Lamb waves propagating in the substrate. To reduce the cross talk level, the effect of various structural variations of the substrate are investigated, which include a change of its thickness and etched trenches or polymer walls between array elements.