• Korean Journal of Optics and Photonics
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• v.18 no.6
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• pp.383-388
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• 2007

A color filter was demonstrated incorporating a patterned metal grating in a quartz substrate. The filter is created in a metal layer perforated with a symmetric two-dimensional array of circular holes, with the pitch smaller than the wavelength of the visible light. A finite-difference time-domain simulation was performed to analyze the device by investigating the effect of structural parameters like the grating height, the period, the hole size, and the refractive index of the hole-filling material on its performance. The device performance was especially optimized by controlling the refractive index of the material comprising the holes of the grating. And two different devices were fabricated by means of the e-beam direct writing with the following design parameters: the grating height of 50 nm, the two pitches of 340 nm for the red color and 260 nm for the green color. For the prepared device with the period of 340 nm, the center wavelength was 680 nm and the peak transmission 57%. And for the other device with the pitch of 260 nm, the center wavelength was 550 nm and the peak transmission was 50%. The filling of the hole with a material whose refractive index is matched to that of the substrate has led to an increase of ${\sim}15%$ in the transmission efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• Korean Journal of Optics and Photonics
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• v.28 no.1
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• pp.28-32
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• 2017

In this research, we designed an LSPR sensor based on a thin-film multilayer comprising $TiO_2$ and $SiO_2$. The thickness of the overall substrate layer of the suggested multilayer LSPR sensor is limited to 100 nm, and the number of repeating $TiO_2$ and $SiO_2$ thin films is 1-4 within a limited thickness. Additionally, a nanowire structure with a gold thin film of 40 nm, height of 40 nm, period of 600 nm, and line width of 300 nm was formed on the multilayer. To design the variable wavelength-type SPR, the angle was fixed at $75^{\circ}$ and the wavelength was changed. We then simulated the system with the finite-element method (FEM) using Maxwell's equations. It was confirmed that the resonance wavelength became shorter as the number of multilayers increased when the refractive index was fixed. We found that the wavelength changes were more sensitive. However, no changes were observed when the number of the multilayers was three or higher.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.12
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• pp.1343-1351
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• 2010

In this paper, a novel patch antenna based on the metamaterial CRLH(Composite Right- and Left-Handed) structure is designed, implemented, and measured. Contrary to the standard microstrip patch's fundamental resonance mode of half-wavelength or its positive multiple, the proposed antenna shows the in-phase electric field over the entire antenna. The proposed antenna has a desired omni-directional field pattern which is typical characteristic of $\lambda/4$ monopole antenna, and also shows the merit of low profile. HFSS(High Frequency Structure Simulator) of Ansoft which is based on the FEM(Finite Element Method) is used to simulate the proposed antenna. FR-4 substrate of thickness 1.6 mm and relative permitivity 4.4 is used for the proposed antenna implementation. The implemented antenna showed VSWR (Voltage Standarding Wave Ratio)$\leq$2 for the frequency band from 2.63 GHz to 2.655 GHz which is used for S-DMB (Satellite-Digital Multimedia Broadcasting) service. And measured peak gain and efficiency are 2.65 dBi and 81.14 %, respectively.

• Journal of electromagnetic engineering and science
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• v.6 no.2
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• pp.135-145
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• 2006

This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.147.2-148
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• 2016

Light management technology is very important for thin film solar cells, which can reduce optical reflection from the surface of thin film solar cells or enhance optical path, increasing the absorption of the incident solar light. Using proper light trapping structures in hydrogenated amorphous silicon (a-Si:H) solar cells, the thickness of absorber layers can be reduced. Instead, the internal electric field in the absorber can be strengthened, which helps to collect photon generated carriers very effectively and to reduce light-induced loss under long-term light exposure. In this work, we introduced a chemical etching technology to make honey-comb textures on glass substrates and analyzed the optical properties for the textured surface such as transmission, reflection and scattering effects. Using ray optics and finite difference time domain method (FDTD) we represented the behaviors of light waves near the etched surfaces of the glass substrates and discussed to obtain haze parameters for the different honey-comb structures. The simulation results showed that high haze values were maintained up to the long wavelength range over 700 nm, and with the proper design of the honey-comb structure, reflection or transmission of the glass substrates can be enhanced, which will be very useful for the multi-junction (tandem or triple junction) thin film a-Si:H solar cells.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.5 s.96
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• pp.488-493
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• 2005

In this study, waveguide-to-CPW transitions were developed for integrating waveguide and MMIC at V-band. The finite element method for numerical analysis and repeated experiments were performed to propose two types of waveguide-to-CPW transition. Using quartz substrate, proposed structures were designed for low loss as well as broadband characteristics. These waveguide-to-CPW transitions showed a good reliability and insensitivity to matching precision, and they could be fabricated with lower cost than that of the conventional connectors. Proposed two types of the structure showed insertion loss less than 1.9 dB and return loss better than 14 dB from 53 GHz to 60 GHz except unwanted resonance region, respectively.

• International Journal of Korean Welding Society
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• v.5 no.1
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• pp.15-28
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• 2005

The ball shear test was investigated in terms of the effects of test parameters, i.e., shear height and shear speed, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. Two representative Pb-free solder compositions were examined in this work: Sn-3.5Ag-0.75Cu and In-48Sn. The substrate was a common SMD type with solder bond pad openings of 460 $\mu$m in diameter. The microstructural investigations were carried out using SEM, and the IMCs were identified with EDS. Shear tests were conducted with the two varying test parameters. It could be observed that increasing shear height, at fixed shear speed, has the effect of decreasing shear force for both Sn-3.5Ag-0.75Cu and In-48Sn solder joints, while the shear force increased with increasing shear speed at fixed shear height. Too high shear height could cause some undesirable effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball. The low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces. The shear speed conditions were discussed with the stress analyses of the solder ball, and we cannot find any conspicuous finding which is related to optimum shear speed from the stress analyses.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.2
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• pp.307-315
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• 2005

We have studied to obtain the SAW filter for the passband was formed on the Langasite substrate and was evaporated by Aluminum-Copper alloy and then we performed computer-simulated by simulator. We can fabricate that the block weighted type IDT as an input transducer of the filter and the withdrawal weighted type IDT as an output transducer of the filter from the results of our computer-simulation. Also, we have performed to obtain the properly design conditions about phase shift of the SAW filter for WCDMA. We have employed that the number of pairs of the input and output IDT are 50 pairs and the thickness and the width of reflector are 5000$\AA$ and 3.6$mu$m, respectively. Frequency response of the fabricated SAW filter has the property that the center frequency is about 190MHz and bandwidth at the 3dB is probably 8.2MHz. And we could obtain that return loss is less then 16dB, ripple characteristics is probably 4dB and triple transit echo is less then 18dB after when we have matched impedance.

• Journal of Advanced Navigation Technology
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• v.17 no.2
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• pp.171-176
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• 2013

A microstrip-fed miniaturized folded-slot antenna that is cut at the finite ground plane edge for the size reduction is proposed as a ZigBee module operating in the 2.4 GHz frequency band, as specified by the IEEE standard 802.15.4. The antenna is fabricated within space limited to $35mm{\times}9mm$ on a $35mm{\times}35mm$ substrate, which is about the PCB size of a typical wireless ZigBee module. The measured impedance bandwidth and antenna gain are 2.37~2.49 GHz and 2.4 dBi respectively. The measured radiation patterns are similar to conventional folded-slot antennas and are also stable across the pass band. These properties and its compact structure help in making the antenna suitable for ZigBee module.