• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1107-1113
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• 2014

In this article, the megasonic cleaning system for cleaning micro/nano particles from flat panel display (FPD) surfaces was developed. A piezoelectric actuator and a waveguide were designed by finite element method (FEM) analysis. The calculated peak frequency value of the quartz waveguide was 1002 kHz, which agreed well with the measured value of 1003 kHz. The average acoustic pressure of the megasonic cleaning system was 43.1 kPa, which is three times greater than that of the conventional type of 13.9 kPa. Particle removal efficiency (PRE) tests were performed, and the cleaning efficiency of the developed system was proven to be 99%. The power consumption of the developed system was 64% lower than that of the commercial system. These results show that the developed megasonic cleaning system can be an effective solution in particle removing from FPD substrate with higher energy efficiency and lower chemical and ultra pure water (UPW) consumption.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.408-414
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• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.10 s.175
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• pp.186-194
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• 2005

This study was designed to investigate the mechanical properties of the coating layer on electronic galvanized sheet steel as a part of the ongoing research on the coated steel. Those properties were determined using nano-indentation, the finite element method, and artificial neural networks. First and foremost, the load-displacement curve (the loading-unloading curve) of coatings was derived from a nano-indentation test by CSM (continuous stiffness measurement) and was used to measure the elastic modulus and hardness of the coating layer. The properties derived were applied in FE simulations of a nano-indentation test, and the analytical results were compared with the experimental result. A numerical model for FE simulations was established for the coating layer and the substrate separately. Finally, to determine the mechanical properties of the coating, such as the stress-strain curve, functional equations of loading and unloading curves were introduced and computed using the neural networks method. The results show errors within $5\%$ in comparison with the load-displacement measured by a nano-indentation test.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.10 s.175
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• pp.195-201
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• 2005

A laterally driven electromagnetic microactuator (LaDEM) is presented, and a micro-optical switch is designed and fabricated as a possible application. LaDEM provides parallel actuation of the microactuator to the silicon substrate surface (in-plane mode) by the Lorentz force. Poly-silicon-on-insulator (Poly-SOI) wafers and a reactive ion etching (RIE) process were used to fabricate high-aspect-ratio vertical microstructures, which allowed the equipment of a vertical micro mirror. A fabricated arch-shaped leaf spring has a thickness of $1.8{\mu}m$, width of $16{\mu}m$, and length of $800{\mu}m$. The resistance of the fabricated structure fer the optical switch was approximately 5$\Omega$. The deflection of the leaf springs increases linearly up to about 400 mA and then it demonstrates a buckling behavior around the current value. Owing to this nonlinear phenomenon, a large displacement of $60{\mu}m$ could be measured at 566 mA. The displacement-load relation and some dynamic characteristics are analyzed using the finite element simulations.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.5
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• pp.486-487
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• 1997

This paper presents the pure capacitive lumped element equivalent circuits for several coplanar waveguide(CPW) discontinuities such as an open-end, an open-end with connected ground planes, a gap and an open-end CPW stub and gives their capacitive element values as a function of physical dimensions of the discontinuity and the frequency for a specific substrate. The capacitive element values are determined from the scattering parameters which are obtained using the finite-difference time-domain(FDTD) method. For an open-end, an open-end with connected ground planes and a gap, the numerical results of the FDTD are compared with the quasi-static results which are calculated using the three- dimensional finite difference method(3D-FDM).

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.22 no.9
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• pp.1975-1984
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• 1997

In this paper, we analyzed the frequency characteristics and the crosstalk of the adjacent parallel lines and the crossed lines in high-speed packaging interconnections by using the three-dimensional finite difference time domain (3D FDTD) method. To analyze the actual crosstalk phenomena in the transmission of the high-speed digital sgnal, the step pulse with fast rise time was used for the source excitation signal instead of using the Gaussian pulse that is generally used in FDTD. To veify the theoretical resutls, the experimental interconnection lines that were fabricated on the Duroid substrate($\varepsilon_{r}$=2.33, h=0.787 [mm]) were tested by TDR(time domain reflectometry). The results show good agreement between the analyzed results and the tested outcomes.

• ETRI Journal
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• v.36 no.4
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• pp.654-661
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• 2014

We develop accurate finite-difference time-domain (FDTD) modeling of polymer bulk heterojunction solar cells containing Ag nanoparticles between the hole-transporting layer and the transparent conducting oxide-coated glass substrate in the wavelength range of 300 nm to 800 nm. The Drude dispersion modeling technique is used to model the frequency dispersion behavior of Ag nanoparticles, the hole-transporting layer, and indium tin oxide. The perfectly matched layer boundary condition is used for the top and bottom regions of the computational domain, and the periodic boundary condition is used for the lateral regions of the same domain. The developed FDTD modeling is employed to investigate the effect of geometrical parameters of Ag nanospheres on electromagnetic fields in devices. Although negative plasmonic effects are observed in the considered device, absorption enhancement can be achieved when favorable geometrical parameters are obtained.

• Korean Journal of Materials Research
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• v.22 no.10
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• pp.519-525
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• 2012

Enhancement of light trapping in solar cells is becoming increasingly urgent for the development of next generation thin film solar cells. One of the possible candidates for increasing light trapping in thin film solar cells that has emerged recently is the use of scattering from metallic nanostructures. In this study, we have investigated the effects of the geometric parameters of Ag nanorings on the light scattering efficiency by using three dimensional Finite Different Time Domain (FDTD) calculations. We have found that the forward scattering of incident radiation from Ag nanorings strongly depends on the geometric parameters of the nanostructures such as diameter, height, etc. The forward scattering to substrate direction is increased as the outer diameter and height of the nanorings decrease. In particular, for nanorings larger than 200 nm, the inner diameter of Ag nanorings should be optimized to enhance the forward scattering efficiency. Light absorption and scattering efficiency calculations for the various nanoring arrays revealed that the periodicity of nanorings arrays also plays an important role in the absorption and the scattering efficiency enhancement. Light scattering efficiency calculations for nanoring arrays also revealed that enhancement of scattering efficiency could be utilized to enhance the light absorption through the forward scattering mechanism.