• 제목/요약/키워드: Fine-pitch

검색결과 180건 처리시간 0.042초

호흡기를 통한 약액 전달을 위한 진세노사이드 초미세입자 분무장치 제작 (Fabrication of an ultra-fine ginsenoside particle atomizer for drug delivery through respiratory tract)

  • 이병철;박진수;양웅모
    • 대한융합한의학회지
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    • 제2권1호
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    • pp.5-12
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    • 2021
  • Objectives: The purpose of this study is to fabricate an ultra-fine ginsenoside particle atomizer that can provide a new treatment method by delivering ginsenoside components that have a therapeutic effect on respiratory diseases directly to the lungs. Methods: We fabricated the AAO vibrating mesh by using the micromachining process. The starting substrate of an AAO wafer has a 350nm pore diameter with 50㎛ thickness. A photomask having several 5㎛ opening holes with a 100㎛ pitch was used to separate each nanopore nozzle. The photoresist structure was optimized to pattern the nozzle area during the lift-off process precisely. The commercial vibrating mesh was removed from OMRON's NE-U100 product, and the fabricated AAO vibrating mesh was installed. A diluted sample of 20mL with 30% red ginseng concentrate was prepared to atomize from the device. Results: As a result of liquid chromatography analysis before spraying the ginsenoside solution, ginsenoside components such as 20S-Rg3, 20R-Rg3, and Rg5 were detected. After spraying through the AAO vibrating mesh, ginsenosides of the same component could be detected. Conclusion: A nutrient solution containing ginsenosides was successfully sprayed through the AAO vibrating mesh with 350 nm selective pores. In particular, during the atomizing experiment of ginsenoside drug solution having excellent efficacy in respiratory diseases, it was confirmed that atomizing through the AAO vibrating mesh while maintaining most of the active ingredients was carried out.

WSOLA를 이용한 동영상 미세배속 재생 서비스에 대한 콘텐츠별 배속 선호도 분석 연구 (A Study about the Users's Preferred Playing Speeds on Categorized Video Content using WSOLA method)

  • 김이길
    • 디지털콘텐츠학회 논문지
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    • 제16권2호
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    • pp.291-298
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    • 2015
  • 빠르게 발전하는 IT환경 속에서 이제 동영상 콘텐츠는 TV를 통한 일방 시청이 아니라 언제 어디서든 다양한 단말에서 볼 수 있는 VOD (Video on Demand) 형태로 발전하고 있다. 이러한 동영상 시청형태의 변화는 디지털이란 특성 때문에 동영상의 재생 속도 또한 다양하게 조절할 수 있다는 부가적인 장점을 사용자에게 제공 한다. 지루하고 따분한 동영상 콘텐츠는 빠르게 돌려보고 흥미 있는 장면은 느리게 천천히 볼 수 있는 동영상 미세배속 재생 기능은 오늘날 다양한 동영상 플레이어에서 제공되고 있다. 동영상 미세배속 재생 시 동영상 콘텐츠 내용의 정확한 이해를 위해서는 시각정보 못지않게 음성정보 청취가 중요한데 정상속도 보다 빠르거나 느린 재생 시 발생하는 음성의 왜곡을 줄이기 위한 음성미세배속 기술들이 음성처리 분야에서 꾸준히 발전되어 왔다. 본 논문에서는 이중 WSOLA와 같은 우수한 음성미세배속 알고리즘에 대해 알아보고 동영상 시청 시 이러한 기능 제공이 실제 얼마나 사용자 니즈(needs)에 부합하는 지 분석해보고자 한다. 특히, 동영상 콘텐츠를 사용자의 콘텐츠 소비 목적에 따라 종류별로 구분하여 재생 배속의 선호도를 조사하고 그 결과를 분석해 봄으로써 동영상 미세배속 기능 제공시 콘텐츠별 소비 목적에 맞게 재생 배속을 제공하는 것이 필요하다는 것을 제안하고자 한다.

마이크로 탐침의 형상최적설계 및 접촉력 계산 (Shape Optimization of Micro-probes and Its Contact Forces)

  • 장동수;김철;김광중
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.608-613
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    • 2007
  • Fine pitch microprobe arrays are microneedle-like probes for inspecting the pixel of LCD panel. They are usually made of multilayers of metallic, nonmetallic, or combination of the two. In this study, the microprobe arrays were fabricated using the process applied for MEMS fabrication technology and they consist of BeCu, BeNi, or Si. Their contacting probing force and deflection were measured using the laser equipment. The design requirement are 5gf of a minimum contact force and $150{\mu}m$ of a maximum deflection. A lot of microprobe shape are possible satisfying the requirement. A double cantilever-type microprobe having needles on both ends were applied for this study. Several candidate were chosen using the topology and shape optimization technique subjected to the design requirements. Finite element results and experimental results were compared and both gave good correlation.

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Covariance Analysis Study for KOMPSAT Attitude Determination System

  • Rhee, Seung-Wu
    • International Journal of Aeronautical and Space Sciences
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    • 제1권1호
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    • pp.70-80
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    • 2000
  • The attitude knowledge error model is formulated for specifically KOMPSAT attitude determination system using the Lefferts/Markley/Shuster method, and the attitude determination(AD) error analysis is performed so as to investgate the on-board attitude determination capability of KOrea Multi-Purpose SATellite(KOMPSAT) using the covariance analysis method. Analysis results show there is almost no initial value effect on Attitude Determination (AD) error and the sensor noise effects on AD error are drastically decreased as is predicted because of the inherent characteristic of Kalman filter structure. However, it shows that the earth radiance effect of IR-sensor(earth sensor) and the bias effects of both IR-sensor and fine sun sensor are the dominant factors degrading AD error and gyro rate bias estimate error in AD system. Analysis results show that the attitude determination errors of roll, pitch and yaw axes are 0.056, 0.092 and 0.093 degrees, respectively. These numbers are smaller than the required values for the normal mission of KOMPSAT. Also, the selected on-orbit data of KOMPSAT is presented to demonstrate the designed AD system.

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경사진 전극링을 이용한 고균일도의 미세 솔더범프 형성 (Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring)

  • 주철원;이경호;민병규;김성일;이종민;강영일
    • 한국전기전자재료학회논문지
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    • 제18권9호
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    • pp.798-802
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    • 2005
  • The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $\pm16.6\%,\;\pm4\%$ respectively.

FLIP CHIP SOLDER BUMPING PROCESS BY ELECTROLESS NI

  • Lee, Chang-Youl;Cho, Won-Jong;Jung, Seung-Boo;Shur, Chang-Chae
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.456-462
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    • 2002
  • In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

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Three-dimensional integral imaging using an elastic PDMS lens array

  • Kim, Yun-Hee;Kim, Yeun-Tae;Jung, Jae-Hyun;Lee, Sin-Doo;Lee, Byoung-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.714-717
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    • 2008
  • In this paper, we propose a three-dimensional (3D) integral imaging system using an elastic lens array instead of conventional rigid lens array. The lens array is made of polydimethylsiloxane (PDMS) that is optically transparent and flexible material. We can stretch the PDMS lens array to be expanded into a certain extent, and control the lens pitch of the system easily. That flexible design enables a fine 3D integral imaging display.

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Development of High-Definition PDP TV with High-Efficient Hexagonal Array Structure

  • Lee, Byung-Hak;Heo, Eun-Gi;Yoon, Cha-Keun;Lee, Kwang-Sik;Cho, Yoon-Hyoung;Yoo, Min-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.347-350
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    • 2003
  • Optimization of the luminance, luminous efficiency, and address voltage margin characteristics has been made on the delta color array PDP with various hexagonal shape subpixels. The optimal subpixel and electrode designs are obtained for the 42-inch high-definition PDP ($1,366{\times}768$) with the fine pixel pitch less than 0.7 mm. The hexagonal delta array structure shows more improved characteristics than that of the normal delta array structure with rectangular shape subpixels.

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Nd:YAG 레이저를 이용한 Flipchip 접합 (Flip-chip Bonding Using Nd:YAG Laser)

  • 송춘삼;지현식;김종형;김주현;김주한
    • 한국공작기계학회논문집
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    • 제17권1호
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    • pp.120-125
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    • 2008
  • A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.