• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2006.05a
• /
• pp.314-317
• /
• 2006

Electroformed part is widely used in modem manufacturing industries, especially semi-conductor division. It is basically a specialized form of electroplating. So, it has very similar parameters with electroplating. The object of this study is development of the fine metal mask by electroforming process. In this paper considered two parameters. The first is relationship of UV exposure and soft baking time. The other one is thickness uniformity of electroformed parts by distance of between electrodes. This paper presents the fabrication method of fine metal mask by electroforming process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.11
• /
• pp.925-931
• /
• 2007

We successively fabricated the Ni metal mask by additive method and evaluated the effects of wetting agents addition on the microstructure, hardness, and friction coefficient. In the process, the additive patterns with fine hole and pitch were made by photolithography technique and subsequently Ni plate was electroformed on the patterns. We found that the microstructure and mechanical properties were significantly varied when the different combinations of the wetting agents were used. When the wetting agents of both SF-1 and SF-2 were added, the microstructure consisted of crystal and amorphous phases, the grain size reduced to 5-40 nm, the RMS value decreased to 11.4 nm and the wear resistance improved. In addition, the hardness was as high as 638 Hv which is higher than that of commercial stainless steel mask and this improvement is probably due to the presence of amorphous Phase and fine grain size. The improvement of the wear resistance can provide a higher reliability and a longer service life.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2009.06a
• /
• pp.345-346
• /
• 2009

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2009.05a
• /
• pp.12.1-12.1
• /
• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Design & Manufacturing
• /
• v.14 no.3
• /
• pp.44-49
• /
• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.502-502
• /
• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.133-136
• /
• 2002

It is very important to get a stable and large-capacity organic effusion source for achievement of OLED mass-production equipment. We present an organic effusion source with film uniformity less than ${\pm}$ 5%, the material charge volume, 300cc for $400{\times}400\;mm^2$ substrate. The fine metal shadow mask alignment technology, one of the color forming technique, also have to support more accurate and fast operating in mass-production. In this paper, we will describe the OLED mass-production equipment with the large volume effusion source and the precision shadow mask alignment technique.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.1053-1055
• /
• 2002

Recently CRT is getting large-sized, Flatness and High Fine Pitched in the meantime the raw material for shadow mask is in rapid progress of thinness, Low Thermal Expansion and high strength.Until now we have used AK(Aluminum Killed) & Invar(Fe-Ni alloy) materials for main raw material of shadow mask component. However recently Nb and Co addition and Nb+Co addition, which has advantage of Low Thermal Expansion and High Strength. has been developed as well as applying in mass production as CRT's trend has become more flat and fine pitch. Among of them, Co addition has been mass production as forming type (Flat CRT) with the beneficial effect of low thermal expansion & high strength for the first time. Since then Nb+Co addition has been used in mass production by the request of much higher strength of shadow mask component. In case of Nb addition, It's thermal expansion coefficient is a little lower than normal Invar and a little higher than Co addition, meanwhile Its Mechanical property is almost similar to Co Addition. The used samples of this experiment are 36%Ni + Fe, 32%Ni + 5%Co + Fe, 32%Ni + 5%Co + 0.3%Nb + Fe, 32%Ni + 0.3%Nb + Fe with heat treatment temperature of 600$^{\circ}C$, 650$^{\circ}C$, 700$^{\circ}C$, 750$^{\circ}C$, 800$^{\circ}C$, 850$^{\circ}C$, 900$^{\circ}C$ respectively under the condition of 15min holding time. After heat treatment, we have observed the change of mechanical property with addition of small elements through mechanical property investigation and metal structure observation as well as transition of thermal expansion coefficient by measuring of thermal expansion coefficient at 850$^{\circ}C$. In conclusion, 5%Co addition indicates that its thermal expansion coefficient is very similar under the condition of at 850$^{\circ}C$ for 15min 's heat treatment. From the experimental result it is suggested that Co addition is mostly suitable for Doming property and Nb addition is mostly suitable for Drop property.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.10
• /
• pp.4685-4693
• /
• 2013

Present work deals with a shape optimal design to minimize the weight of the mask-frame used in the process of OLED vapor deposition by the fine metal mask. A design concept for an optimal shape of the frame to increase the stiffness and to reduce the weight is derived using the topology optimization, shape design variables of the frame by adopting slots being defined. An optimal shape is determined by solving the shape optimization problem to minimize the weight of the frame under constraints of the maximum displacement. Weight of the optimal design is 117.6 kg, which is reduced by 138.4 kg(54.1%) of that of the first design, 256 kg.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.4
• /
• pp.65-68
• /
• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.