• Title/Summary/Keyword: Film defect

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Effect of Doping Amounts of Al2O3 and Discharge Power on the Electrical Properties of ZnO Transparent Conducting Films (ZnO 투명 전도막의 전기적 특성에 미치는 Al2O3 의 도핑 농도 및 방전전력의 효과)

  • Park Min-Woo;Park Kang-Il;Kim Byung-Sub;Lee Se-Jong;Kwak Dong-Joo
    • Korean Journal of Materials Research
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    • v.14 no.5
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    • pp.328-333
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    • 2004
  • Transparent ZnO:Al conductor films for the optoelectronic devices were deposited by using the capacitively coupled DC magnetron sputtering method. The effect of Al doping concentration and discharge power on the electrical and optical properties of the films was studied. The film resistivity of $8.5${\times}$10^{-4}$ $\Omega$-cm was obtained at the discharge power of 40 W with the ZnO target doped with 2 wt% $Al_2$$_O3$. The transmittance of the 840 nm thick film was 91.7% in the visible waves. Increasing doping concentration of 3 wt% $Al_2$$O_3$ in ZnO target results in significant decrease of film resistivity, which may be due to the formation of $Al_2$$O_3$ particles in the as-deposited ZnO:Al film and the reduced ZnO grain sizes. Increasing DC power from 40 to 60 W increases deposition rate by more than 50%, but can induce high defect density in the film, resulting in higher film resistivity.

Liquid Crystal Alignment Effects Using a Carbon Nitride Thin Film (Carbon Nitride 박막을 이용한 액정배향 효과)

  • Park, Chang-Joon;Hwang, Jeong-Yeon;Kang, Hyung-Ku;Seo, Dae-Shik;Ahn, Han-Jin;Kim, Kyung-Chan;Kim, Jong-Bok;Baik, Hong-Koo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04a
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    • pp.23-26
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    • 2004
  • We studied the nematic liquid crystal (NLC) aligning capabilities using the new alignment material of a Carbon Nitride (NDLC) thin film. NDLC thin film exhibits high electrical resistivity and thermal conductivity that are similar to the properties shown by diamond-like carbon (DLC) thin films. The diamond-like properties and nondiamond-like bonding make NDLC an attractive candidate for applications. A high pretilt angle of about $9.9^{\circ}$ by ion beam (IB) exposure on the NDLC thin film surface was measured. A good LC alignment is achieved by the IB alignment method on the NDLC thin film surface at annealing temperature of $200^{\circ}C$. The alignment defect of the NLC was observed above annealing temperature of $250^{\circ}C$. Consequently, the high pretilt angle and the good LC alignment by the IB alignment method on the NDLC thin film surface can be achieved.

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Effects of rapid thermal annealing and bias sputtering on the structure and properties of ZnO:Al films deposited by DC magnetron sputtering (Bias를 인가한 DC magnetron sputtering 법으로 증착된 ZnO:Al 박막의 구조적 특성과 RTP의 annealing에 따른 영향)

  • Park, Kyeong-Seok;Lee, Kyu-Seok;Lee, Sung-Wook;Park, Min-Woo;Kwak, Dong-Joo;Lim, Dong-Gun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.500-501
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    • 2005
  • Aluminum doped zinc oxide films (ZnO:Al) were deposited on glass substrate by DC magnetron sputtering from a ZnO target mixed with 2 wt% $Al_2O_3$. The effects of substrate bias on the electrical properties and film structure were studied. Films deposited with positive bias have been annealed at $600^{\circ}C$ using rapid thermal anneal (RTA) process. The effects of RTA on the evolution of film microstructure are to be also studied using X-ray diffraction, transmission electron microscopy, and atomic force microscopy. Positive bias sputtering may induce lattice defects caused by electron bombardments during deposition. The as-deposited film microstructure evolves from the film with high defect density to more stable film condition. The electrical properties of the films after RTA process were also studied and the results were correlated with the evolution of film microstructures.

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A Study on Correlation of Dry Film Thickness with Multi-Nozzle Spray Pattern of Shop Primer (Shop Primer의 다중 노즐 분사 스프레이 패턴 인자와 도막두께의 상관관계에 관한 연구)

  • Yun, Won-Jun;Choi, Min-Kyu;Ro, Young-Shic
    • Journal of the Society of Naval Architects of Korea
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    • v.47 no.5
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    • pp.743-749
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    • 2010
  • Multi-nozzle spray painting procedure of the inorganic zinc shop primer was established in order to obtain uniform film thickness. The shop primer paint prevents the corrosion of steel block during shipbuilding. When the dry film thickness of shop primer is insufficient, rust will be generated on the steel block. Otherwise, thick coating of shop primer may be a problem of weld defect. So, it is important to obtain the uniform film thickness of shop primer. The uniformity of dry film thickness is affected by spray speed, distance from spray gun to target surface and overlapping span of spray path. In order to uniformly maintain coating thickness of shop primer, the coating procedure was established based on the correlation of shop primer spray variables.

Evaluation of crystallinity and defect on (100) ZnTe/GaAs grown by hot wall epitaxy

  • Kim, Beong-Ju
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.12 no.6
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    • pp.299-303
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    • 2002
  • The relationship of crystallinity between defects distribution with (100) ZnTe/GaAs using HWE growth was investigated by four crystal rocking curve (FCRC) and transmission electron microscopy (TEM). The thickness dependence of crystal quality in ZnTe epilayer was evaluated. The FWHM value shows a strong dependence on ZnTe epilayer thickness. For the films thinner than 6 ${\mu}{\textrm}{m}$, the FWHM value decreases very steeply as the thickness increases. For the films thicker than 6 ${\mu}{\textrm}{m}$, it becomes an almost constant value. At the thickness of 12 $\mu\textrm{m}$ with the smallest value of 66 arcsec. which is the best value so far reported on ZnTe epilayers was obtained. Investigation into the nature and behavior of dislocations with film thickness in (100) ZnTe/(100)GaAs heterostructures grown by Hot Wall Epitaxy (HWE). This film defects range from interface to 0.7 ${\mu}{\textrm}{m}$ thickness was high density, due to the large lattice mismatch and thermal expansion coefficients. The thickness of 0.7~1.8 ${\mu}{\textrm}{m}$ was exists low defect density. In the thicker range than 1.8 ${\mu}{\textrm}{m}$ thickness was measured hardly defects.

Fatigue Characteristics of PZT Thin Films Deposited by ECR-PECVD

  • Chung, Su-Ock;Lee, Won-Jong
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.4
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    • pp.177-185
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    • 2005
  • Fatigue characteristics of lead zirconate titanate (PZT) films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) were investigated. The fatigue characteristics were investigated with respect to PZT film thickness, domain structure, fatigue pulse height, temperature, electrode materials and electrode configurations. The used top and bottom electrode materials were Pt and $RuO_2$. In the fatigue characteristics with fatigue pulse height and PZT film thickness, the fatigue rates are independent of the applied fatigue pulse height at the electric field regions to saturate the P-E hysteresis and polarization $(P^*,\;P^A)$ characteristics. The unipolar and bipolar fatigue characteristics of PZT capacitors with four different electrode configurations $(Pt//Pt,\;Pt//RuO_2,\;RuO_2//Pt,\;and\;RuO_2//RuO_2)$ were also investigated. The polarization-shifts during the unipolar fatigue and the temperature dependence of fatigue rate suggest that the migration of charged defects should not be expected in our CVD-PZT films. It seems that the polarization degradations are attributed to the formation of charged defects only at the Pt/PZT interface during the domain switching. The charged defects pin the domain wall at the vicinity of Pt/PZT interface. When the top and bottom electrode configurations are of asymmetric $(Pt//RuO_2,\;RuO_2//Pt)$, the internal fields can be generated by the difference of charged defect densities between top and bottom interfaces.

Efficiency Analysis with Deposition Time of OVC layer in Cu(InGa)$Se_2$ Films (Cu(InGa)$Se_2$ 박막 제조시 OVC층의 증발시간에 따른 광변환효율 분석)

  • Kim, S.K.;Lee, J.L.;Kang, K.H.;Yoon, K.H.;Park, I.J.;Song, S.;Han, S.O.
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1587-1589
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    • 2002
  • Photovoltaics is considered as one of the most promising new energy technology, because its energy source is omni present, pollution-free and inexhaustive. It is agreed that these solar cells must be thin film type because thin film process is cost-efficive in the fact that it uses much less raw materials and can be continuous. The defect chalcopyrite material $CuIn_3Se_5$ has been identified as playing an essential role in efficient photovoltaic action in $CuInSe_2$-based devicesm It has been reported to be of n-type conductivity, forming a p-n junction with its p-type counterpart CuInSe2. Because the most efficient cells consist of the $Cu(In,Ga)Se_2$ quarternary, knowledge of some physical properties of the Ga-containing defect chalcopyrite $Cu(In,Ga)_3Se_5$ may help us better understand the junction phenomena in such devices.

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A simulation of high efficiently thin film solar cell with buffer layer (버퍼층 삽입을 통한 박막 태양전지의 고효율화 시뮬레이션)

  • Kim, Heejung;Jang, Juyeon;Baek, Seungsin;Yi, Junsin
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.64.2-64.2
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    • 2011
  • a-Si 박막 태양전지는 a-Si:H을 유리 기판 사이에 주입해 만드는 태양전지로, 뛰어난 적용성과 경제성을 지녔으나 c-Si 태양전지에 비해 낮은 변환 효율을 보이는 단점이 있다. 변환 효율을 높이기 위한 연구 방법으로는 a-Si 박막 태양전지 단일cell 제작 시 high Bandgap을 가지는 p-layer를 사용함으로 높은 Voc와 Jsc의 향상에 기여할 수 있는데, 이 때 p-layer의 defect 증가와 activation energy 증가도 동시에 일어나 변환 효율의 증가폭을 감소시킨다. 이를 보완하기 위해 본 실험에서는 p-layer에 기존의 p-a-Si:H를 사용함과 동시에 high Bandgap의 buffer layer를 p-layer와 i-layer 사이에 삽입함으로써 그 장점을 유지하고 높은 defect과 낮은 activation energy의 영향을 최소화하였다. ASA 시뮬레이션을 통해 a-Si:H보다 high Bandgap을 가지는 a-SiOx 박막을 사용하여 p-type buffer layer의 두께를 2nm, Bandgap 2.0eV, activation energy를 0.55eV로 설정하고, i-type buffer layer의 두께를 2nm, Bandgap 1.8eV로 설정하여 삽입하였을 때 박막 태양전지의 변환 효율 10.74%를 달성할 수 있었다. (Voc=904mV, Jsc=$17.48mA/cm^2$, FF=67.97).

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Structural Analysis of High-Density Mobile Micro-Connector (초소형 고집적 모바일 커넥터부품 구조해석)

  • Jeon, Yong-Jun;Shin, Kwang-Ho;Heo, Young-Moo
    • Design & Manufacturing
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    • v.9 no.2
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    • pp.1-5
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    • 2015
  • Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

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Designing an Evaluation Method for the in-situ Impact Strength of Rollable Devices

  • Hyojung Son;Ki-Yong Lee;Byoung-Seong Jeong
    • Applied Chemistry for Engineering
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    • v.35 no.2
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    • pp.148-153
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    • 2024
  • In this study, a methodology for evaluating impact strength in rollable devices was developed, focusing on measuring impact strength and evaluating rolling and unrolling durability simultaneously, with findings reported from tests on a real demonstration unit. The study utilized a flexible and rollable polyimide (PI) substrate for the evaluations. The chosen parameters for this methodology were a flat-type impactor, weights of 300 g, 500 g, and 1000 g, a rolling shaft ranging from 30 R to 5 R, and the positioning of the impactor. The results revealed that the difference in defect rates when comparing the 300 g and 500 g weights was minimal. However, the adoption of a 1000 g weight markedly increased the defect count due to damage to the PI film's surface. Furthermore, an uptick in rolling and unrolling cycles led to more pronounced surface scratches on the PI film. These methods and findings are poised to make a substantial contribution towards refining reliability testing for a wide array of rollable device applications, including smartphones, watches, pads, and wearable technology.