• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.3
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• pp.204-211
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• 2007

Experiments were conducted to investigate the failure and strengths of carbon composite-to-aluminum single-lap bonded joints with 5 different bonding lengths. Joint specimens were fabricated to have secondary bonding of laminate and aluminum with a film type adhesive, FM73m. Tested joints have the bonding strengths between the values of aluminum-to-aluminum joints and composite-to-composite joints. In the joints with bonding length-to-width ratio smaller than 1, the strength decreases as the bonding length increases. In the joints with the ratio larger than 1, however, the strength converges to a constant value. Final failure mode of all the specimens was delamination. To use the maximum strength of the adhesive, it is important to design the joint to have strong resistance to delamination.

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.4
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• pp.323-330
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• 2009

The objective of this research was to develop a practical integrated approach using extracted features from electrical resistance measurements and coupled electromechanical models of damage, for in-situ damage detection and sensing in carbon fiber reinforced plastic(CFRP) composites. To achieve this objective, we introduced specific known damage (in terms of type, size, and location) into CFRP laminates and established quantitative relationships with the electrical resistance measurements. For processing of numerous measurement data, an autonomous data acquisition system was devised. We also established a specimen preparation procedure and a method for electrode setup. Coupon and panel CFRP laminate specimens with several known damage were tested. Coupon specimens with various sizes of artificial delaminations obtained by inserting Teflon film were manufactured and the resistance was measured. The measurement results showed that increase of delamination size led to increase of resistance implying that it is possible to sense the existence and size of delamination. A quasi-isotropic panel was manufactured and electrical resistance was measured. Then three different sizes of holes were drilled at a chosen location. The panel was prepared using the established procedures with six electrode connections on each side making a total of twenty-four electrodes. Vertical, horizontal, and diagonal pairs of electrodes were chosen and the resistance was measured. The measurement results showed the possibility of the established measurement system for an in-situ damage detection method for CFRP composite structures.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.335-335
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• 2011

Instability of a thin film attached to a compliant substrate often leads to emergence of exquisite wrinkle patterns with length scales that depend on the system geometry and applied stresses. However, the patterns that are created using the current techniques in polymer surface engineering, generally have low aspect ratio of undulation amplitude to wavelength, thus, limiting their application. Here, we present a novel and effective method that enables us to create wrinkles with a desired wavelength and high aspect ratio of amplitude over wavelength as large as to 2.5:1. First, we create buckle patterns with high aspect ratio of amplitude to wavelength by deposition of an amorphous carbon film on a surface of a soft polymer poly(dimethylsiloxane) (PDMS). Amorphous carbon films are used as a protective layer in structural systems and biomedical components, due to their low friction coefficient, strong wear resistance against, and high elastic modulus and hardness. The deposited carbon layer is generally under high residual compressive stresses (~1 GPa), making it susceptible to buckle delamination on a hard substrate (e.g. silicon or glass) and to wrinkle on a flexible or soft substrate. Then, we employ glancing angle deposition (GLAD) for deposition of a high aspect ratio patterns with amorphous carbon coating on a PDMS surface. Using this method, pattern amplitudes of several nm to submicron size can be achieved by varying the carbon deposition time, allowing us to harness patterned polymers substrates for variety of application. Specifically, we demonstrate a potential application of the high aspect wrinkles for changing the surface structures with low surface energy materials of amorphous carbon coatings, increasing the water wettability.

• Journal of Adhesion and Interface
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• v.22 no.4
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• pp.144-152
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• 2021

Understanding charge transfer across the interface between organic semiconductor and gate insulator gives insight into the development of high-performance organic memory as well as highly stable organic field-effect transistors (OFETs). In this work, we firstly unveil a novel interfacial charge transfer mechanism, in which hole transfer from organic semiconductor to polymer insulator was nonlinearly boosted by localized states coupling. For this, OFETs based on rubrene single crystal semiconductor and Mylar gate insulator were fabricated via vacuum lamination, which allows stable repetition of lamination and delamination between semiconductor and gate insulator. The surfaces of rubrene single crystal and Mylar film were selectively degraded by photo-induced oxygen diffusion and UV-ozone treatment, respectively. Consequently, we found that the interfacial charge transfer and resultant bias-stress effect were nonlinearly boosted by coupling between localized states in rubrene and Mylar. In particular, the small number of localized states in rubrene single crystal provided fluent pathway for interfacial charge transport.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.89-92
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• 2001

Drop weight impact tests were performed to investigate the impact behavior of carbon fiber/epoxy composite laminates reinforced by short fibers and other interleaving materials. Characterization techniques, such as cross-sectional fractography and scanning acoustic microscopy, were employed quantitatively to assess the internal damage of some composite laminates. Scanning electron microscopy was used to observe impact damage and fracture modes on specimen fracture surfaces. The results show that composite laminates experience various types of fracture; delamination, intra-ply cracking, matrix cracking and fiber breakage depending on the interlayer materials. Among the composite laminates tested in this study, the composites reinforced by Zylon fibers showed very good impact damage resistance with medium level of damage, while the composites interleaved by poly(ethylene-co-acrylic acid) (PEEA) film is expected to deteriorate the bulk strength due to the reduction of fiber volume fraction, even though the damaged area is significantly reduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.735-738
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• 2003

Downsizing electronics requires precision position control with an accuracy of sub-micron order, which demands development of ultra-fine displacive devices. Piezoelectric transducer is one of devices transferring electric field energy into mechanical energy and being capable for fine displacement control. The transducer has been widely used as fine Position control device Multilayer piezoelectric actuator, one of typical piezo-transducer, is fabricated by stacking alternatively ceramic and electrode layers several hundred times followed by cofiring process. Electrode material should be tolerable in the firing process maintaining at ceramic-sintering temperatures up to $1100{\sim}1300^{\circ}C$. Ag-Pd can be used as stable electrode material in heat treatment above $960^{\circ}C$. Besides, adding small quantity ceramic powder allow the actuator to be fabricated in a good shape by diminishing shrinkage difference between ceramic and electrode layers, resulting in avoidance of crack and delamination at and/or nearby interface between ceramic an electrode layers. This study presents synthesis of nano-oxide-added Ag/Pd powders and its feasibility to candidate material tolerable at high temperature. The powders were formed in a co-precipitation process of Ag and Pd in nano-oxide-dispersed solution where Ag and Pd precursors are melted in $HNO_3$ acid.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.3
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• pp.213-217
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Elastomers and Composites
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• v.48 no.2
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• pp.167-171
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• 2013

Weatherability was examined according to aluminum particle size and its orientation used in PCM(Paint Coated Metal). Substrate delamination was checked by different UV transmission rate with QUV$^{(R)}$ (Q-LAB) equipment that can make accelerated UV irradiation. Film was prepared using three different types of conflake aluminum pastes under a PCM coating process and clearcoat was sprayed. UV transmission test results showed low transmission rate when EKART #790 having the smallest particle size and horizontal orientation was used. From the gloss retention results, gloss retention was highest in EKART #790 and followed by #770, #750.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• Journal of Ocean Engineering and Technology
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• v.13 no.1 s.31
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• pp.62-69
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• 1999

67Ni-22Cr-10Al-1Y and $ZrO_2-8Y_2O_3$ were coated on the substrate surface of ST304 and Al2024 by the plasma spraying method. The adgesion of the films varies depending on the substrates and the laminating method. In the case of STS304, the cracks were observed at thermal shock temperature difference ${Delta}T$ of $900^{circ}C$ in the non functionally gradient material(NFGM) and at $1100^{circ}C$ in the functionally gradient material(FGM). The film adhesion of the FGM is better than that of the NFGM in ST304. The cumulative AE count of the FGM of STS304 increased continuously at the bending test. But the NFGM of STS304 showed discontinuity of the AE count. The total AE count for the FGM of STS304 decreased as the number of thermal shock increased, and this tendency was evident as the thermal shock temperature difference increased.