• 한국표면공학회지
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• 제47권2호
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.

• Tribology and Lubricants
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• 제39권1호
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• pp.8-12
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• 2023

This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.

• Composites Research
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• 제15권2호
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• pp.11-17
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• 2002

우수한 동적 감지특서을 갖는 압전필름센서는 구조 건전성 모니터링이나 평가와 같은 구조물과 재료의 변화를 분석하는데 사용될 수 있다. 압전필름센서의 이러한 특성을 이용하여 Gr/Ep 복합재 평판의 충격 손상개시를 모니터링하였다. 압전필름센서와 스트레인게이지를 Gr/Ep 복합재 평판에 부착하여 다양한 조건의 에너지에 대한 충격시험을 낙하식 충격 시험기를 사용하여 수행하였다. 충격시험을 수행하는 동안 영구압입, 기지균열, 층간분리와 같은 충격 손상개시를 예측하기 위하여 센서신호를 분석하였다. 충격에너지를 초기 손상이 발생할 수 있는 크기 이상으로 증가시키면 손상의 개시와 진전에 대한 정보를 포함하는 특정 센서 신호를 관찰할 수 있었다. 특히, 압전필름세서는 스트레인게이지 보다 충격 손상개시 및 진전에 대한 좋은 감지 특성을 보여주었다.

• 한국표면공학회지
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• 제50권6호
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• pp.480-485
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• 2017

Soft mold imprinting method that uses nanostructured polymer mold was investigated for anti-reflection film fabrication. The nanostructured soft mold was polyethylene terephthalate(PET) irradiated by oxygen ion beams. The collisional energy transfer between oxygen ion and the polymer surface induced cross-linking and scission reactions, resulting in self-organized nanostructures with regular patterns of the wavenumber of $5{\mu}m^{-1}$. Post processes including ultra-violet curable resin coating and delamination fabricated anti-reflection films. The imprinted resin surface also showed the consistent wavenumber, $5{\mu}m^{-1}$. Pristine PET, oxygen ion beam treated PET, and imprinted replica sample showed total transmittance of 91.04, 93.25, and 93.57-93.88%, respectively.

• Tribology and Lubricants
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• 제40권3호
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• pp.71-77
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• 2024

Hydrogen has emerged as an eco-friendly and sustainable alternative to fossil fuels. However, the utilization of hydrogen requires high-pressure compression, storage, and transportation, which poses challenges to the durability of compressor components, particularly the diaphragm. This study aims to improve the durability of 304 stainless steel diaphragms in hydrogen compressors by optimizing their surface roughness and corrosion resistance through wet etching. The specimens were prepared by immersing 304 stainless steel in a mixture of sulfuric acid and hydrogen peroxide, followed by etching in hydrochloric acid for various durations. The surface morphology, roughness, and wettability of the etched specimens were characterized using optical microscopy, surface profilometry, and water contact angle measurements. The friction and wear characteristics were evaluated using reciprocating sliding tests. The results showed that increasing the etching time led to the development of micro/nanostructures on the surface, thereby increasing surface roughness and hydrophilicity. The friction coefficient initially decreased with increasing surface roughness owing to the reduced contact area but increased during long-term wear owing to the destruction and delamination of surface protrusions. HCl-30M exhibited the lowest average friction coefficient and a balance between the surface roughness and oxide film formation, resulting in improved wear resistance. These findings highlight the importance of controlling the surface roughness and oxide film formation through etching optimization to obtain a uniform and wear-resistant surface for the enhanced durability of 304 stainless steel diaphragms in hydrogen compressors.

• 한국재료학회지
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• 제23권12호
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• pp.680-686
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• 2013

Tungsten oxide films were prepared by an electrochemical deposition method for use as the anode in rechargeable lithium batteries. Continuous potentiostatic deposition of the film led to numerous cracks of the deposits while pulsed deposition significantly suppressed crack generation and film delamination. In particular, a crack-free dense tungsten oxide film with a thickness of ca. 210 nm was successfully created by pulsed deposition. The thickness of tungsten oxide was linearly proportional to deposition time. Compositional and structural analyses revealed that the as-prepared deposit was amorphous tungsten oxide and the heat treatment transformed it into crystalline triclinic tungsten oxide. Both the as-prepared and heat-treated samples reacted reversibly with lithium as the anode for rechargeable lithium batteries. Typical peaks for the conversion processes of tungsten oxides were observed in cyclic voltammograms, and the reversibility of the heat-treated sample exceeded that of the as-prepared one. Consistently, the cycling stability of the heat-treated sample proved to be much better than that of the as-prepared one in a galvanostatic charge/discharge experiment. These results demonstrate the feasibility of using electrolytic tungsten oxide films as the anode in rechargeable lithium batteries. However, further works are still needed to make a dense film with higher thickness and improved cycling stability for its practical use.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.523-524
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• 2007

This paper discusses the planarization process of thick copper film structure used for power supply device. Chemical mechanical polishing(CMP) has been used to remove a metal film and obtain a surface planarization which is essential for the semiconductor devices. For the thick metal removal, however, the long process time and other problems such as dishing, delamination and metal layer peeling are being issued, Compared to the traditional CMP process, Electro-chemical mechanical planarization(ECMP) is suggested to solve these problems. The two-step process composed of the ECMP and the conventional CMP is used for this experiment. The first step is the removal of several tens ${\mu}m$ of bulk copper on patterned wafer with ECMP process. The second step is the removal of residual copper layer aimed at a surface planarization. For more objective comparison, the traditional CMP was also performed. As an experimental result, total process time and process defects are extremely reduced by the two-step process.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.49-54
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• 2021

The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime candidates to substitute traditional cover glass as a passivation layer to accommodate product flexibility. However, CPI films subjected to repetitive pure bending loads inevitably entail an accumulation of residual strain that can eventually cause wrinkles or delamination in the underlying component after a certain number of static and cyclic loading. The purpose of this study is to establish an experimental method to systematically evaluate the bending residual strain of CPI films. Films were monotonically and cyclically wrapped on mandrels of various diameters to ensure a constant strain in each. After unwrapping the wound CPI film, the residual radius of curvature remaining on the film was measured and converted into residual strain. The critical radius of curvature at which residual strain does not remain was about 5 mm, and the residual strain decreased in proportion to the log time. It is expected that flexible displays can be reliably designed using the data between the applied bending strain and the residual strain.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.244.1-244.1
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• 2016

Recently, the technology for flexible electronics such as flexible smart phone, foldable displays, and bendable battery is under active development. With approaching the real commercialization of flexible electronics, the electrical and mechanical reliability of flexible electronics have become significantly important because they will be used under various mechanical deformations such as bending, twisting, stretching, and so on. These mechanical deformations result in performance degradation of electronic devices due to several mechanical problems such as cracking, delamination, and fatigue. Therefore, the understanding of relationship between mechanical loading and electrical performance is one of the most critical issues in flexible electronics for expecting the lifetime of products. Here, we have investigated the effect of monotonic tensile and cyclic deformations on metal interconnect to provide a guideline for improving the reliability of flexible interconnect.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.