• International Journal of Naval Architecture and Ocean Engineering
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• 제1권2호
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• pp.57-63
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• 2009

Numerical simulations have been carried out on the flooding system of a dry located at the south coasts of Iran. The main goals of seawater flow haracteristics in the intake channels conditions of the flooding system are imposed in the modeling. The upstream boundary condition is the tidal fluctuations of sea water level. At the downstream, the gradually rising water surface elevation in the dry described in a transient boundary condition. The numerical results are compared with available laboratory a good agreement is obtained. The seawater discharge through the flooding system and the required time to filling up the dry dock is determined at the worst case. The water current velocity and pressure on the rigid boundaries are discussed.

• 자원환경지질
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• 제7권1호
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• pp.23-35
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• 1974

Dalsung Mine, located in Kyungsang puk-do, Korea, is well known as one of the typical breccia pipe filling hydrothermal W-Cu deposit. By homogenization temperature with fluid inclusions in quartz crystals (330 samples were dealt with) by heating stage microscope, two temperature ranges were figured out, one is $154^{\circ}{\sim}267^{\circ}C$ (average $210^{\circ}C$), and the other is $283^{\circ}{\sim}335^{\circ}C$ (average $309^{\circ}C$). Regarding to mineral paragenesis, mineralization of the deposit were thought that former, mesothermal stage, W-Cu mineralization processed through out the ore body and later mineralization were limitted under -4level as katathermal solution with Cu minerals.

• Design & Manufacturing
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• 제11권2호
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• pp.9-14
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• 2017

The design and manufacturing tehcnology of IC sockets beyond 0.3mm pitch were presented. We compared the developed IC socket with the conventional one especially on the core metal-insulation part. Advanced machining techniques were employed to provide high precision. Our wire electrodischarge machining and high speed machining centers were able to maintain the micro-scale precision. We performed an injection molding analysis using a commercial analysis tool to predict the performance of the developed IC socket. We found that the solidification of the plastic resin and the high level of the clamping force are responsible for the defects such as incomplete filling and short shot. From these results, we modified the IC socket and successfully remove the defects. We were also able to find out that the new design socket needs less maintenance cost.

• Journal of Electrical Engineering and Technology
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• 제9권2호
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• pp.721-725
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• 2014

In this paper, we propose a fast adaptive power allocation method for an orthogonal frequency division multiple access (OFDMA) system that employs an adaptive modulation and coding (AMC) scheme. The proposed scheme aims to reduce the calculation complexity of greedy adaptive power allocation (APA), which is known as the optimal algorithm for maximizing the utility argument of power. Unlike greedy APA, which starts power allocation from "0", the proposed algorithm initially allocates a certain level of power determined by the water-filling scheme. We theoretically demonstrate that the proposed algorithm has almost the same capability of maximizing the utility argument as the greedy APA while reducing the number of operations by 2M, where M is the number of AMC levels.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 추계학술대회 논문집
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• pp.87-88
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• 2007

무전해 구리 도금 공정에서 첨가제로 사용되는 HIQSA 화합물이 Damascene 공정을 이용한 60nm급 trench 패턴 내 무전해 구리 배선 형성 과정에 미치는 효과를 전기 화학적 기법과 광학적 기법을 이용하여 관찰하였다. HIQSA 농도별 open circuit potential의 변화를 관측한 결과, 3ppm 수준으로 첨가되었을 때, 무전해 도금 과정 중 가장 안정한 전위가 유지됨을 볼 수 있었다. 무전해 도금액 내 HIQSA 농도가 높아짐에 따라 구리 도금층의 두께는 지수적으로 감소하였으며, 표면의 결정 크기도 감소하였다. 60nm급 trench 내 무전해 구리 도금 시, 용액 내 침적 시간 60초가 무결함 superconformal copper filling을 얻기 위한 최적 시간이었다.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.129-133
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• 2019

In this paper, we developed a system to monitor the storage capacity of suction-type device such as vacuum cleaner or crop harvesters. The monitoring system consists of load cells and a differential pressure sensor which simultaneously monitor the weight and volume of the stock. Since weighing objects stored in storage containers alone cannot fully monitor the level of filling, more accurate monitoring can be achieved by monitoring volume and fusion with weight information. The volume was monitored using a phenomenon in which the flow rate of the inhaled air varies depending on the volume of the object filled in the storage container. In this paper, we developed a system to monitor the storage in three stages: low, medium and high.

• Nuclear Engineering and Technology
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• 제53권3호
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• pp.1041-1048
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• 2021

An engineered barrier system (EBS) for the disposal of high-level radioactive waste (HLW) is composed of a disposal canister with spent fuel, a buffer material, a gap-filling material, and a backfill material. As the buffer is located in the empty space between the disposal canisters and the surrounding rock mass, it prevents the inflow of groundwater and retards the spill of radionuclides from the disposal canister. Due to the fact that the buffer gradually becomes saturated over a long time period, it is especially important to investigate its thermal-hydro-mechanical-chemical (THMC) properties considering variations of saturated condition. Therefore, this paper suggests a new method of measuring thermal conductivity and water suction for single compacted bentonite at various levels of saturation. This paper also highlights a convenient method of saturating compacted bentonite. The proposed method was verified with a previous method by comparing thermal conductivity and water suction with respect to water content. The relative error between the thermal conductivity and water suction values obtained through the proposed method and the previous method was determined as within 5% for compacted bentonite with a given water content.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2021년도 가을 학술논문 발표대회
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• pp.67-68
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• 2021

In this study, Repair mortar was prepared using CNT powder with improved dispersibility and its characteristics were analyzed. As a result of the experiment, the compressive strength and flexural strength were found to be at similar levels compared to Plain without CNT. In addition, as a result of the drying shrinkage test, it was found that the drying shrinkage amount was decreased due to the effect of CNT mixed into the porous material filling the internal pores of the repair mortar.. The Bond strength of the repair mortar was at a similar level regardless of whether CNT was added or not

• 한국유기농업학회지
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• 제15권2호
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• pp.207-218
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• 2007

웰빙시대의 도래와 함께 안전농산물에 대한 국민요구가 커져가고 있으며, 이에 따라 친환경 쌀 생산체계 개발이 절실한 실정이다. 따라서 본 연구는 최근 효과가 큰 것으로 알려지고 있는 유효미생물제제인 Amo, 발효자재인 Amo-bokasi 등 몇 가지 친환경농자재를 이용하여 친환경 벼 생산체계를 수립코자 수행한 연구결과를 하면 다음과 같다. 1. 주당 분얼수는 유효미생물처리 2, 3수준이 각각 48.8, 47.3개로 많았으며, 관행구가 41.0개로 가장 적었다. 2. 수잉기의 엽면적은 유효미생물처리구의 3수준이 $3228.5cm^2$로 가장 많았으며, 관행구는 $2264.7cm^2$로 가장 엽면적이 큰 처리구 3수준에 비하여 70.2% 이었다. 3. 유효분얼수는 관행구가 63.7%로 가장 높았으며, 친환경농자재가 가장 많이 처리된 처리 3수준구가 55.4%로 가장 적었다. 4. 주당수수는 처리구의 3수준구가 20.9개로 가장 많았으며, 관행구가 19.3개로 가장 적었으며 유의한 차이를 나타내었다. 수당립수는 처리구의 2수준구가 85.2로 가장 많았으며, 관행구가 81.9개로 가장 적어 통계적으로도 유의한 차이를 나타내었으며, 처리간에도 유의한 차이가 인정되었다. 5. 등숙율은 관행구가 85.0%로 가장 높았으며, 처리의 3수준구가 81.8%로 가장 낮았으며, 처리간에는 대차 없었다. 1000립중도 마찬가지로 관행구가 21.7g으로 가장 무거웠으며, 처리구가 전반적으로 약 1g 정도 낮은 경향을 보였다. 6. 10a당 정조중은 처리구의 2수준구에서 654.3kg으로 가장 많았고, 처리구의 3수준구에서 636.1kg으로 가장 적었으며, 이들 간에는 유의적인 차이가 인정되었다.

• 센서학회지
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• 제15권1호
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.