• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.405-410
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• 2020

In this study, the following results were obtained by analysis of electric properties with FT-IR, DSC, XRD, and SEM, in the range of temperature 30~160℃ and frequency 0.1~200 kHz, when filling agent (0~100 phr) and silicone oil (0~12 phr) were added to raw silicone rubber. In the case of 100 phr mixed samples, the relative dielectric constant εr gradually decreased from 4.3 to 3.96 as frequency increased, and the dielectric loss tan δ decreased to 0.01 at 300 Hz, then increased to 0.022 at 30 kHz, then decreased to 200 kHz. The FT-IR analysis identified the same binding structure according to the chemical composition of added silica (SiO₂). Through DSC analysis, we could determine the change of heat quantity and the glass transition temperature of each specimen. In the XRD analysis, it was found that the images SiO₂, TiO₂, and Fe₂O₃ appeared for specimens with 0%, 50% and 100% filling agent. Finally, the SEM analysis confirmed that particles of 0.5 to 1.5 ㎛ size with silica (SiO₂) mixing were dispersed evenly.

• Proceedings of the Korean Geotechical Society Conference
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• 2005.03a
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• pp.1343-1350
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• 2005

In this study, the whole deformation conditions of domestic old tunnels and reinforcement methods for deformation tunnels were investigated and analysed, and the present conditions, occurrence cause and reinforcement methods of cavity behind the tunnel lining were investigated and analysed comprehensively. The deformation causes of domestic old tunnels could be classified in three kinds : change of earth pressure operating tunnel ground, material problem of concrete lining, mistake of design and construction. As a result of analysis, the tunnel deformation was occurred by not specific cause but various cause As a result of investigation for 455 domestic tunnel data, more than 70% of the tunnel deformation was related to leakage and the other deformation cause also accompanied leakage mostly. An applied reinforcement method was related to leakage and flood prevention measures, but application of reinforcement method for boundary area between tunnel and ground and tunnel periphery which influence on the tunnel stability was still defective. The cavity of domestic old tunnel occupied about 16% of the total tunnel length and about 68% of cavity was located in the crown of tunnel, and besides, the occurrence cause of cavity was analysed to design, construction and management cause. The filling method for cavity using filling material was comprehensively appling to cavity behind tunnel lining.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.7 s.166
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• pp.1075-1084
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• 1999

The family of unidirectional continuous fiber reinforced polymeric composites are currently used in automotive bumper beams and load floors. The material properties and mechanical characteristics of the compression molded parts are determined by the curing behavior, fiber orientation and formation of knit lines, which are in turn determined by the mold filling parameters. In this paper, a new model is presented which can be used to predict the 3-dimensional flow under consideration of the slip of mold-composites and anisotropic viscosity of composites during compression molding of unidirectional fiber reinforced thermoplastics for isothermal state. The composites is treated as an incompressible Newtonian fluid. The effects of longitudinal/transverse viscosity ratio A and slip parameter $\alpha$ on the buldging phenomenon and mold filling patterns are also discussed.

• Geomechanics and Engineering
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• v.12 no.3
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• pp.399-415
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• 2017

A series of direct shear tests were conducted to investigate the frictional properties of the interface between structures and the filling soil of Chongqing airport fourth stage expansion project. Two types of structures are investigated, one is low carbon steel and the other is the bedrock sampled from the site. The influence of soil water content, surface roughness and material types of structure were analyzed. The tests show that the interface friction and shear displacement curve has no softening stage and the curve shape is close to the Clough-Duncan hyperbola, while the soil is mainly shear contraction during testing. The interface frictional resistance and normal stress curve meets the Mohr-Coulomb criterion and the derived friction angle and frictional resistance of interface increase as surface roughness increases but is always lower than the internal friction angle and shear strength of soil respectively. When surface roughness is much larger than soil grain size, soil-structure interface is nearly shear surface in soil. In addition to the geometry of structural surface, the material types of structure also affects the performance of soil-structure interface. The wet interface frictional resistance will become lower than the natural one under specific conditions.

• Journal of The Korean Society of Agricultural Engineers
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• v.48 no.5
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• pp.73-80
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• 2006

The mono-layer cover system is composed of soils only as a filling material and various plants are planted on the surface to control the water balance in the cover system. In this paper, the mono-layer cover system was considered as an alternative landfill final cover system and developed a model that could utilize industrial by-product (especially, coal ash & phosphogypsum) as additive filling materials. The mixture of granite soil, coal ash, and phosphogypsum was placed as a cover material in a box constructed with cement. Laboratory tests were carried out to investigate the environmental effect on the utilization of coal ash & phosphogypsum and to determine the mxing ratio of each materials. In the leaching test, all materials showed lower heavy metal concentration than the threshold values of regulation. The optimum mixing ratio of materials which was applied to field model test was determined to soil (4) : coal ash (1) : phosphogypsum (1) on the volume base. Field model tests were continued from February to July, 2004 in the soil box that was constructed with cement block. It was verified that coal ash and phospogypsum mixed with soil was to be safe environmentally and the water balance of mono-layer cover system was reasonable.

• Proceedings of the KSR Conference
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• 2009.05a
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• pp.1542-1549
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• 2009

The function of subgrade in the railway is to support track load on the subgrade as well as train load. Unlike the traditional railway, the uppermost subgrade layer in the Gyeongbu high speed railway was constructed as the reinforced road bed. The reinforced road bed comprises sub-ballast in the upper part and grade ballast in the lower part. The filling material such as soil and rocks in the subgrade can be settled by consolidation of original ground, compression due to self weight, plastic displacement due to train operation, and unequal settlement due to embankment material or improper compaction, therefore many efforts have been given for sufficient compaction and use of proper filling materials in the construction stage. The purpose of this study is to investigate the deformation state of subgrade in the Gyeongbu high speed railway. The investigation on the subgrade settlement was performed by choosing representative sections suspected to be settled based on the previous GPR test results and track maintenance history, measuring the settlement for some time period after installing settlement measuring instruments on and under the reinforced road bed. and analyzing the long-term subgrade settlement data from monitoring system which was installed at the construction stage of the high speed railway.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.162-163
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• 2016

This paper presents a mathematical model for optimizing earthwork allocation plan that minimizes earthwork cost. The model takes into account operational constraints in the real-world earthwork such as material-type (i.e., quality level of material) and quantities excavated from cut-sections, required quality of material and quantities for each embankment layer, top-down cutting and bottom-up filling constraints, and allocation orders. These constraints are successfully handled by assuming the rock-earth material as the three dimensional (3D) blocks. The study is of value to project scheduler because the model identifies the optimal earth allocation plan (i.e., haul direction (cut and fill pairs), quantities of soil, type of material, and order of allocations) expeditiously and is developed as an automated system for usability. It is also relevant to estimator in that it computes more realistic earthworks costs estimation. The economic impact and validity of the mathematical model was confirmed by performing test cases.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1596-1599
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• 2009

Mobile ODF (one drop filling) portable display such as mobile phone and application product is needed high reliability than notebook, monitor and TV. Therefore, material development in order to optimize mobile & application ODF panel is needed. Through considering mobile ODF process and design, we have developed method of material matching test by several tests which is heat stress, UV stress and ODF process condition. So we have developed a material with characteristics of high reliability for mobile ODF panel.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.05a
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• pp.227-228
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• 2021

There are various problems caused by environmental pollution around the abandoned mines. In addition, they are exposed to the risk of safety accidents due to sinkholes caused by ground subsidence. Therefore, the ground is stabilized through the filling and construction of abandoned mines using industrial by-products. However, in the case of Backfill Material, secondary pollution caused by acidic drainage and leachate is not suppressed. To solve this problem, the liner and cover material is first installed. Therefore, in this study, the watertightness of the liner and cover material was improved by mixing crystalline admixtures by content.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.