• Resources Recycling
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• v.16 no.2 s.76
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• pp.32-39
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• 2007

The measurement of physicochemical properties of ASR incineration ash has been carried dot and the preparation of light-weight material has also been performed using ASR ash for recycling point of view as building or construction materials. For this aim, chemical composition, particle size distribution, and heavy metal leachability were examined for 2 bottom ashes and 4 fly ashes obtained from the domestic ASR incinerator. In the present work, attempt has been made to prepare the lightweight material using boiler ash as a raw material, which is prepared by forming the mixture of boiler ash, lightweisht filler and inorganic binder and followed by calcination at elevated temperature. As a result, the content of Cu in bottom ash was as high as about 3wt% so that the recovery of Cu from ash was required. The major compound of SDR #5 and Bag filter #6 was found to be $CaCl_2{\cdot}Ca(OH)_2{\cdot}H_2O\;and\;CaCl_2{\cdot}4H_2O$, respectively. It is thought that heavy metal teachability of lightweight material prepared with boiler ash was significantly decreased due to the encapsulation or stabilization of heavy metal compounds.

• Resources Recycling
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• v.17 no.4
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• pp.30-36
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• 2008

The preparation of porous lightweight materials as well as the measurement of physical properties has been performed by using SSA(sewage sludge ash) as the raw material. For this aim, two types of lightweight filler, that is, perlite and silica sphere were employed respectively and bentonite was also used as an inorganic binder. The properties of lightweight specimen calcined at 1,000 were measured in terms of density, compressive strength, thermal conductivity and sound absorption to examine the effect of material composition as well as the preparation condition on the properties of lightweight material. As a result, the density of specimen prepared with perlite was ranged from 1.23 to $1.37g/cm^3$ and the compressive strength was ranged from 242.3 to $370.5kg/cm^2$. In case of specimen prepared with silica sphere, it was found that the compressive strength was less than $100kg/cm^2$ even though density was lower than that of specimen with perlite. As far as the thermal conductivity of specimen was concerned, it was ranged from 0.3 to $0.5W/m^{\circ}K$ depending on material composition so that the insulation effect was superior to conventional concrete.

• Journal of the Korean Wood Science and Technology
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• v.48 no.5
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• pp.755-764
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• 2020

Due to pronounced mechanical performance and being environmental friendly, aqueous polymer isocyanate adhesive (API) has been widely applied in the production of formaldehyde-free wood products. In this study, flame retardant formaldehyde-free plywood was prepared by incorporation of flame retardants into the API adhesive. Partially phosphorylated poly (vinyl alcohol) (PPVA) which was prepared by reacting poly (vinyl alcohol) with phosphoric acid was used to replace PVA in API formula. In addition, Mg-Al layered double hydroxides (LDH) was chosen as additive flame retardant, replacing traditional filler CaCO₃ in API adhesive formula. And then, the flame retardant API adhesive with main agent (PPVA replacing PVA70wt.%, SBR emulsion 30wt.%), curing agent 10wt.% (accounts for of the main agent), and 20wt.% LDHs (accounts of the main agent) was used to prepare flame retardant plywood. The effect of application of PPVA and Mg-Al LDH on bonding strength of plywood was investigated. The flammability characteristics of the plywood were determined by cone calorimeter test (CCT). The results revealed that compared with the plywood prepared with API adhesive, the use of PPVA and LDH enhanced the flame retardancy of plywood without negatively affecting bonding strength. The CCT tests indicated that the heat release and smoke production flame retardant API plywood were lower than those of the ordinary API glued plywood. Promising developments for flame retardant API adhesive were expected in future applications of flame retardant formaldehyde-free plywood.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• Resources Recycling
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• v.16 no.1 s.75
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• pp.44-53
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• 2007

The Jeonju-Il mine tailings contain large quantities of $SiO_2\;and\;Al_2O_3$ and lesser quantities of metallic components. In this study, we studied about the possibility of using mine tailings as a raw material in various industries. it was found that the sintered mine tailings had a good quality in every respect such as chromaticity, firing shrinkage and water absorption etc. Therefore if can substitute clay mineral in the ceramic industry. Also it can substitute about 2.94% of the raw materials of ordinary portland cement. We can use the coarse tailing as the fine aggregate for the ready-mixed mortar; and the fine tailing, as the filler for the bituminous paving mixture; because both products were not only suitable for Korea industrial standard in quality, but also environmentally harmless.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.5 no.2
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• pp.58-66
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• 1991

This paper measured the characteristic of the thermal expansion, dielectric and conductivity to use $Sb_2O_3$ Filler in epoxy resin.The results are summarized as follow : 1 ) In the [$155^{\circ}C$] 1, The coefficient of thermal expansion increasing temperature obtained 8.19 in the case of pure epoxy resin and $4.5{\times}10^{-5}$ in the case of the mixing 7[%].2) The peak point of $\varepsilon\iota, \varepsilon\rho$ increasing $Sb_2O_3$ mixing ratio moved on the part of the high temperature. 3) The conductivity value increasing temperature shows the corner on the part of the Tg and it's Value became low the sample material with mixing I[%] than in case of pure epoxy resin.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.125-133
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• 2016

With the aim of using a filler material in a conductive paste, fine Cu nanoparticles were synthesized through the high-speed chemical reaction between cuprous oxide ($Cu_2O$) powder and sulfuric acid in distilled water. Under external temperature of $7^{\circ}C$, sulfuric acid concentration of 48%, and $Cu_2O$ amount of 30 g, the $Cu_2O$ particles were eliminated and slightly aggregated Cu nanoparticles were synthesized. Futhermore, Cu nanoparticles of 224 nm, in which the aggregation between particles was obviousiy much suppressed, were synthesized with the choice of an additive. In the particle sample, occasionally there are coarse particles formed by the aggregation of fine nanoparticles and weak linkages between the nanoparticles. However, the coarse particles were destroyed and the linkages were broken after mixing with a resin formulation, indicating the behavior of untangling the aggregation between nanoparticles.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.41-41
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• 2010

에어컨용 냉매 압축기, 냉장고용 냉매압축기 및 자동차 샷시 부품들은 주로 겹치기 필릿용접을 GMAW 으로 실시하고 있다. 그러나 용접 시 스패터 발생으로 인한 추가공수가 요구되며 작업환경 또한 열악한 실정이다. 따라서 저가의 고생산이면서 용접비드의 외관이 미려하고 스패터, 소음 그리고 Fume 이 발생되지 않는 청정한 TIG 용접이 있지만, 용접속도가 수십 cpm 이하로 제한되어 생산성이 낮다는 기술적 모순을 가지고 있다. TIG 용접에서 생산성을 증가시키기 위해 모재와 와이어를 고속 용융 시키려면 전류를 높여 입열량을 증가시켜야 하지만, 증가된 전류로 인하여 상승된 아크력이 험핑비드와 언더컷이 발생되는 물리적 모순을 가진다. 또한 필러와이어를 사용한 기존의 TIG 용접에서 필러 와이어는 주로 원형 단면 와이어를 사용하게 되는데 와이어의 직경이 증가함에 따라 비표면적은 감소하여 용융효율이 낮아지므로 $\Phi$1.2 이하의 필러와이어를 송급하여 용접하였다. 그러나 요구되는 용착량이 큰 경우 필러 와이어를 고속으로 송급하게 되는데 이 경우 필러 와이어 용융이 곤란하거나 송급상의 문제가 자주 생겨 용접속도를 고속으로 하기 곤란하였다. 따라서 필러와이어를 사용한 TIG 용접에서 용착금속의 용융효율을 높게 함으로서 전류를 크게 증가시키지 않으면서도 용접속도를 높일 수 있는 용접 공정개발이 필요한 실정이다. 본 연구에서는 비표면적을 증가시켜 용착금속의 높은 용융효율을 얻을 수 있도록 개발된 와이어와 기존의 $\Phi$3.2 일반와이어 및 를 이용하여 BOP TIG 용접에 비교 실험하였으며, 개발된 와이어와 기존의 $\Phi$1.2 필러와이어를 이용하여 필릿용접부에 적용 실험하여 비교하였다. 그 결과 개발된 와이어의 경우 적절한 비드를 형성하였으나 3.2 일반와이어의 경우 과도한 볼록비드와 불용착부의 문제가 발생하였고, 필릿용접 비교실험에서는 각각 200cpm과 50cpm에서 적절한 비드가 형성되어 더 높은 용착금속 용융효율을 얻을 수 있었다.

• Korean Journal of Materials Research
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• v.22 no.11
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• pp.604-608
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• 2012

Recently, inorganic-organic hybrid materials have attracted much attention not only for their excellent thermal conductivity but also for their flame retardant properties. In this study, the properties of organic-inorganic hybrid insulating materials using inorganic fillers and polyurethane foam with different foaming conditions have been investigated. The addition of 1.5 wt% water to polyurethane as foaming agent shows the best foaming properties. The pore size was decreased in the foaming body with increasing of the $CaCO_3$ addition. The apparent density and thermal conductivity were increased by increasing the $CaCO_3$ addition. With an increasing amount of $CaCO_3$ powder, the flame retardant property is improved, but the properties of thermal conductivity and apparent density tend to decrease. When the addition of fine particles of $CaCO_3$, the apparent density and thermal conductivity were increased and, also, with the addition of coarse particles over $45{\mu}m$ in size, the apparent density and thermal conductivity were increased as well. In this study, the adding of $CaCO_3$ with average particle size of $27{\mu}m$ led to the lowest thermal conductivity and apparent density. After evaluation with different inorganic fillers, $Mg(OH)_2$ showed the highest thermal conductivity; on the other hand, $CaCO_3$ showed the lowest thermal conductivity.