• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.2070-2076
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• 2015

Nano composite materials were multi-constituent combinations of nano dimensional phases with distinct differences in structure, chemistry and properties. Nano particles were less likely to create large stress concentrations and thereby can avoid the compromise of the material ductility while improve other mechanical properties. Corona discharge was an electrical discharge. The ionization of a fluid surrounding a conductor was electrically energized. This discharge would occur when the strength of the electric field around the conductor was high enough to form a conductive region, but not high enough to cause electrical breakdown or arcing to nearby objects. This paper shows all the studies done on the preparation of nano fillers. Special attention has given to the ACSR transmission line conductor, TiO₂ nano fillers and also to the evaluation of corona resistance on dielectric materials discussed in detail. The measurement of the dielectric properties of the nano fillers and the parameters influencing them were also discussed in the paper. Corona discharge test reveals that in 0%N ACSR sample corona loss was directly proportional to the applied line voltage. No significant change in corona loss between 0%N and 1%N. When TiO₂ nano filler concentration was increased up to 10%N fine decrement in corona loss was found when compared to base ACSR conductor, corona loss was decreased by 40.67% in 10%N ACSR sample. It was also found from the surface conditions test that inorganic TiO₂ nano filler increases the key parameters like tensile strength and erosion depth.

• Applied Chemistry for Engineering
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• v.16 no.3
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• pp.317-322
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• 2005

Nowadays, recycling of aggregates from the waste concrete is in big demand due to the protection of environment and the shortage of aggregates that are needed for ever expanding construction projects. This study was undertaken to examine the feasibility of recycling waste concrete powder produced in the crushing process of demolished concrete as a filler material for polymer mortar. In this study, polymer mortar specimens were prepared by varying the mix proportion of polymer binder (ranging 9~15 wt%), waste concrete powder (ranging 0~20 wt%) substituted for silica powder, 0.1~0.3 mm fine aggregate (ranging 21~24 wt%) and 0.7~1.2 mm fine aggregate (ranging 44~47 wt%). For the prepared polymer mortar specimens, various physical properties such as strength, water absorption, heat water resistance, acid resistance, pore distribution and SEM observation were investigated in this work. As a result, physical properties of polymer mortar were observed to have remarkably improved with an increase of polymer binder, but greatly deteriorated with an increase of substitution quantity of waste concrete powder.

• Journal of the Korean Chemical Society
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• v.21 no.5
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• pp.379-383
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• 1977

Since the organophilic bentonite disperses well in polymer matrix, a composite material of polymer and bentonite was studied for its mechanical properties. To increase the degree of dispersion and the bond in forces to the polymer matrix, bentonite, encapsulated by imidazoline, was used as a filler. Polyethylene powder of particle size of 100 mesh was used, and organophilic bentonite, so-called bentone, whose particle size was 250 mesh was also used in this experiment. V-type mixer was used for mixing and Banbury mixer was used for melt-blending. The sample specimen were made by heating the mixture in the plate press, and the specimen were formed as a sheet, exactly the same as the mold on the plate. Tensile strength, bending strength and compressive strength were studied specially. Tensile strength, elongation rate, bending strength and bending rate at constant pressure were decreased as the filler content increased. Compressive strength was increased as the filler content increased.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• v.33 no.1
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• pp.7-12
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• 2020

Over the past decade, liquid crystalline epoxy (LCER) has attracted much attention as a promising matrix for the development of efficient heat dissipation materials. This study presents a comprehensive study including synthesis, preparation and chacterization of polymer/inorganic composites using typical 4,4-diglycidyloxybiphenyl (DP) epoxy among LECR. To confirm the thermal conductivity of composite materials, we have prepared composite samples composed of epoxy resin and single-wall carbon nanotube (SWCNT) as a filler. In particular, DP composites exhibit higher thermal conductivity than commercial epoxy composites that use the same type of filler due to the highly ordered microstructure of the LCER. In addition, the thermal conductivity of the DP composite can be controlled by controlling the amount of filler. In particular, the DP composite containing a SWCNT content of 50 wt% has the highest thermal conductivity of 2.008 W/mK.

• Journal of the Korean Ceramic Society
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• v.55 no.5
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• pp.492-497
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• 2018

This paper reports the efficacy of tape casting using an Ag-10 wt% CuO filler for the successful joining of a sintered $Ce_{0.9}Gd_{0.1}O_{2-{\delta}}-La_{0.7}Sr_{0.3}MnO_{3{\pm}{\delta}}$ (GDC-LSM) ceramic with a SUS 460 FC metal alloy by reactive air brazing. The as-prepared green tape was highly flexible without drying cracks, and the handling was easy when used as a filler material for reactive air brazing. Heat treatment for the GDC-LSM/SUS 460 FC joint was performed at $1050^{\circ}C$ for 30 min in air. Microstructural observations indicated a reliable and compact joining. The room temperature mechanical shear strength of the as-brazed joints was $60{\pm}8MPa$ with a cohesive failure. The flexural strength of joints was measured from room temperature up to $850^{\circ}C$, where the strength retention revealed to be almost 100% at $500^{\circ}C$. However, the joints showed a degradation in strengths at 800 and $850^{\circ}C$, exhibiting strength retentions of 57% and 37%, respectively.

• Food Science and Preservation
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• v.31 no.3
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• pp.394-407
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• 2024

The poultry industry faces disposal difficulty in waste, but recent advancements in material science and sustainability have enabled the innovative transformation of waste into valuable resources. In this study, eggshell (EC) was added as a bio-filler to gum Arabic (GA) to fabricate a GA-EC bio-composite film. Bio-composites containing 0.5 g (GA-EC_0.5) and 1.0 g (GA-EC_1.0) EC dispersed in 30 mL of 15% GA solution were fabricated and characterized using standard analytical techniques. The GA-EC_0.5 composites showed significantly higher moisture content, transparency, water solubility, and water vapor permeability but lower tensile strength and thermal stability than GA-EC_1.0. Following a post-harvest wrapping of tomato fruits with the GA-EC composite films and storage at 25±2℃ for 20 days, significant (p>0.05) reductions in weight loss, pH, lycopene content, and activities of polyphenol oxidase and pectin methylesterase compared to unwrapped fruits were recorded. Adding EC to GA has enabled the fabrication of composite films with improved mechanical, barrier, and thermal properties with potential application in the post-harvest storage of tomato fruits.

• Journal of the korean academy of Pediatric Dentistry
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• v.36 no.1
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• pp.62-70
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• 2009

The objective of this study was to measure the leaching of filler (Si, Ba) from nanofiller-contained composites (Palfique Estelite $sigma^{{R}}$ (Tokuyama Dental Corp., Tokyo, Japan), $Z-350^{{R}}$ (3M ESPE, USA), Ceram X duo $E3^{{R}}$, $D3^{{R}}$ (Dentsply, Konstanz, Germany)) under different conditions. The samples used for the study of leachable components were made by insertion of the material into a circular mold, 10 mm in diameter and 3.0 mm high. Each specimen was placed in a disposable polystyrene vial containing 5 mL of distilled water, artificial saliva or 0.1N NaOH and kept in an oven at $37^{\circ}C$. ; water and artificial saliva - 150 days, 0.1N NaOH - 15days. Inductively coupled plasma atomic emission spectroscopy (ICP-AES) was used to determine the amount of Si and Ba in the test solutions. 1. Filler leaching was significantly great in 0.1N NaOH among all samples(p<.0.001). 2. When samples were stored in the distilled water, Estelite showed the lowest amount of Si leaching. When samples were stored in the artificial saliva, Z-350 showed the lowest amount of Si leaching. 3. There were significant differences in filler leaching between 3 storage medias and composite resins(p<.0.001). 4. Si and Ba leaching occurred in greater proportion when samples were stored in the artificial saliva than distilled water. 5. There were significant interactions in monthly filler leaching between leaching in artificial saliva and in distilled water, as well as the interaction between storage medium and filler(p<.0001). These results indicate that a continuous filler leaching of nanofiller-contained composite resins was in storing aqueous solutions under over time.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.125-126
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• 1994

The chemorheological changes and kinetics during curing reaction of an silica filled epoxy system (DGEBA with curing agent Polyxoypropylenediamine) were investigated. This study concentrates on the influence of silica on the reaction kinetics and rheological behavior of the eopxy system. The concentration of the filler was varied 0~200phr. Curing behavior of the silica filled epoxy system was measured at various heating rates with DSC. Conversion was also measured by integrating the obtained DSC curve and Kinetic parameters measured by using the nonlinear regression method. DSC experiments showed that the presence of silica was found to accelerate the progress of the curing reaction and of reduce the heat of reaction compared with that of unfilled epoxy systems . Rheological experiments were conducted on a Physica by using a disposable parallel plate fixture. Material properites were measured such as the elastic modulus(G′), the loss modulus(G"), the loss tangent(tan $\delta$), and the viscosity was at the initial stahe, and the more the silica filler was added, and the lower the gel temperature was in the epoxy system. In this study it is concluded that the curing of the silica filled epoxy system was found to be accelerated, as silica was added to the epoxy compound.