A Study on Bumping of Micro-Solder for Optical Packaging and Reaction at Solder/UBM interface (광패키징용 마이크로 솔더범프의 형성과 Contact Pad용 UBM간의 계면 반응 특성에 관한 연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2001.11a
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- pp.332-336
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- 2001