• 제목/요약/키워드: Fabrication processing

검색결과 866건 처리시간 0.03초

SOI 기술의 이해와 고찰: 소자 특성 및 공정, 웨이퍼 제조 (Basic Issues in SOI Technology : Device Properties and Processes and Wafer Fabrication)

  • 최광수
    • 한국재료학회지
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    • 제15권9호
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    • pp.613-619
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    • 2005
  • The ever increasing popularity and acceptance in the market place of portable systems, such as cell phones, PDA, notebook PC, etc., are fueling effects in further miniaturizing and lowering power consumption in these systems. The dynamic power consumption due to the CPU activities and the static power consumption due to leakage currents are two major sources of power consumption. Smaller devices and a lower de voltage lead to reducing the power requirement, while better insulation and isolation of devices lead to reducing leakage currents. All these can be harnessed in the SOI (silicon-on-insulator) technology. In this study, the key aspects of the SOI technology, mainly device electrical properties and device processing steps, are briefly reviewed. The interesting materials issues, such as SOI structure formation and SOI wafer fabrication methods, are then surveyed. In particular, the recent technological innovations in two major SOI wafer fabrication methods, namely wafer bonding and SIMOX, are explored and compared in depth. The results of the study are nixed in that, although the quality of the SOI structures has shown great improvements, the processing steps are still found to be too complex. Between the two methods, no clear winner has yet emerged in terms of the product quality and cost considerations.

Progess in Fabrication Technologies of Polycrystalline Silicon Thin Film Transistors at Low Temperatures

  • Sameshima, T.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.129-134
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    • 2004
  • The development of fabrication processes of polycrystalline-silicon-thin-film transistors (poly-Si TFTs) at low temperatures is reviewed. Rapid crystallization through laser-induced melt-regrowth has an advantage of formation of crystalline silicon films at a low thermal budget. Solid phase crystallization techniques have also been improved for low temperature processing. Passivation of $SiO_2$/Si interface and grain boundaries is important to achieve high carrier transport properties. Oxygen plasma and $H_2O$ vapor heat treatments are proposed for effective reduction of the density of defect states. TFTs with high performance is reported.

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RF 및 Microwave 응용을 위한 SU-8 공정 연구 (A Study on SU-8 Fabrication Process for RF and Microwave Application)

  • 왕종;김남영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.65-66
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    • 2009
  • This paper describes a procedure developed to fabricate negative photo resist SUMS to a semi-insulating (SI)-GaAs-based substrate. SU-8 is attractive for micromachine multi-layer circuit fabrication, because it is photo-polymerizable resin, leading to safe, and economical processing. This work demonstrates SUMS photo resist can be used for RFIC/MMIC application.

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홀로그래픽 광학소자 개발 (Development of holographic Optical Elements)

  • 정만호;송재봉;이인원
    • 한국광학회:학술대회논문집
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    • 한국광학회 1990년도 광학 및 양자전자학 워크샵
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    • pp.87-93
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    • 1990
  • Estimation and collection of the suitable recording materials are important for the fabrication of the holographic optical elements. In this study, silver halide emulsion, photoresist and dichromated gelatin are selected as a recording materials to investigate the properties and processing methods. Some parameters which affect the diffraction efficiencies of the holographic optical elements (HOE) are presented. As an example of the HOE, the results of design and the fabrication method of the off axis 12P hologram lens are also presented.

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Fabrication of V-grooved Mold for the Light Guide Plate of TFT-LCD with MEMS Technology

  • Lee, Woon-Seob;Han, Man-Hee;Lee, Sung-Keun;Lee, Seung-S
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.994-996
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    • 2002
  • We present a novel fabrication method for a V-grooved mold of the light guide plat of TFT-LCD with MEMS technology. This method is performed by the inclined UV lithography and Ni electroplating unlike the previous mechanical processing technique. V-grooves with different dimension can be made simultaneously with single photomask.

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UV 레이저에 의한 블라인드 비아홀 가공 (Blind via Hole manufacturing technology using UV Laser)

  • 장정원;김재구;신보성;장원석;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.160-163
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    • 2002
  • Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

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On the fabrication of carbon fabric reinforced epoxy composite shell without joints and wrinkling

  • Vasanthanathan, A.;Nagaraj, P.;Muruganantham, B.
    • Steel and Composite Structures
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    • 제15권3호
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    • pp.267-279
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    • 2013
  • This article describes a simple and cost effective fabrication procedure by using hand lay-up technique that is employed for the manufacturing of thin-walled axi-symmetric composite shell structures with carbon, glass and hybrid woven fabric composite materials. The hand lay-up technique is very commonly used in aerospace and marine industries for making the complicated shell structures. A generic fabrication procedure is presented in this paper aimed at manufacture of plain Carbon Fabric Reinforced Plastic (CFRP) and Glass Fabric Reinforced Plastic (GFRP) shells using hand lay-up process. This paper delivers a technical breakthrough in fabrication of composite shell structures without any joints and wrinkling. The manufacture of stiffened CFRP shells, laminated CFRP shells and hybrid (carbon/glass/epoxy) composite shells which are valued by the aerospace industry for their high strength-to-weight ratio under axial loading have also been addressed in this paper. A fabrication process document which describes the major processing steps of the composite shell manufacturing process has been presented in this paper. A study of microstructure of the glass fabric/epoxy composite, carbon fabric/epoxy composite and hybrid carbon/glass/fabric epoxy composites using Scanning Electron Microscope (SEM) has been also carried out in this paper.

AAO를 이용한 나노 패턴 마스터 제작에 관한 연구 (Study on Fabrication of Highly Ordered Nano Patterned Master by Using Anodic Aluminum Oxidation)

  • 신홍규;권종태;서영호;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.368-370
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    • 2007
  • AAO(Anodic Aluminum Oxidation) method has been known that it is practically useful for the fabrication of nano-structures and makes it possible to fabricate the highly ordered nano masters on large surface and even on the 2.5 or 3D surface at low cost comparing to the expensive e-beam lithography or the conventional silicon processing. In this study, by using the multi-step anodizing and etching processes, highly ordered nano patterned master with concave shapes was fabricated. By varying the processing parameters, such as initial matter and chemical conditions; electrical and thermal conditions; time scheduling; and so on, the size and the pitch of the nano pattern can be controlled. Consequently, various alumina/aluminum nano structures can be easily available in any size and shape by optimized anodic oxidation in various aqueous acids. The resulting good filled uniform nano molded structure through hot embossing molding process shows the validity of the fabricated nano pattern masters.

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산업용 SFF 시스템에서 Laser Beam Spot size 측정 메커니즘 개발 (Development of Measurement mechanism of Laser Beam Spot size for Industrial SFF system)

  • 배성우;김동수;최경현
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1383-1388
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    • 2007
  • Accuracy and processing time are very important factors when the desired shape is fabricated with Selective Laser Sintering (SLS), one of Solid Freeform Fabrication (SFF) systems. In a conventional SLS process, laser spot size is fixed during laser exposing on the sliced figure. Therefore, it is difficult to accurately and rapidly fabricate the desired shape. In this paper, to deal with those problems an SFF system having ability of changing spot size is developed. The system provides high accuracy and optimal processing time. Specifically, a variable beam expander is employed to adjust spot size for different figures on a sliced shape. Finally, Design and performance estimation of the SFF system employing a variable beam expander are achieved and the mechanism will be addressed to measure the real spot size generated from the variable beam expander.

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비전 센서를 이용한 레이져 용접물의 용접성 평가에 관한 연구 (A Study on Weldability Estirmtion of Laser Welded Specimens by Vision Sensor)

  • 엄기원;이세헌;이정익
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.1101-1104
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    • 1995
  • Through welding fabrication, user can feel an surficaial and capable unsatisfaction because of welded defects, Generally speaking, these are called weld defects. For checking these defects effectively without time loss effectively, weldability estimation system setup isan urgent thing for detecting whole specimen quality. In this study, by laser vision camera, catching a rawdata on welded specimen profiles, treating vision processing with these data, qualititative defects are estimated from getting these information at first. At the same time, for detecting quantitative defects, whole specimen weldability estimation is pursued by multifeature pattern recognition, which is a kind of fuzzy pattern recognition. For user friendly, by weldability estimation results are shown each profiles, final reports and visual graphics method, user can easily determined weldability. By applying these system to welding fabrication, these technologies are contribution to on-line weldability estimation.

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