• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.213-217
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Nuclear Engineering and Technology
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• 제36권4호
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• pp.338-345
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• 2004

This study examines the sensitivity of several fabrication parameters for dry process fuel, using a random sampling technique. The in-pile performance of dry process fuel with irradiation was calculated by a modified ELESTRES code, which is the CANDU fuel performance code system. The performance of the fuel rod was then analyzed using a Monte Carlo simulation to obtain the uncertainty of the major outputs, such as the fuel centerline temperature, the fission gas pressure, and the plastic strain. It was proved by statistical analysis that for both the dry process fuel and the $UO_2$ fuel, pellet density is one of the most sensitive parameters, but as for the fission gas pressure, the density of the $UO_2$ fuel exhibits insensitive behavior compared to that of the dry process fuel. The grain size of the dry process fuel is insensitive to the fission gas pressure, while the grain size of the $UO_2$ fuel is correlative to the fission gas pressure. From the calculation with a typical CANDU reactor power envelop, the centerline temperature, fission gas pressure, and plastic strain of the dry process fuel are higher than those of the $UO_2$ fuel.

• 한국정밀공학회지
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• 제27권6호
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• pp.98-104
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• 2010

Rapid Prototypes with internally colored objects are convenient by visualizing. A rapid prototyping method has been developed to fabricate mono-colored or multi-colored objects. In this work, a new process was proposed that can fabricate internally visible colored 3D objects in stereolithography parts. The process consists of projection stereolithography process using transparent photocurable resin for outer shapes and molten ink deposition process using molten solid ink for internal shapes. In molten ink deposition process, molten solid ink could be deposited uniformly in a designed pattern. To make molten solid ink uniform over a designed region, parametric study through a patterning solid ink was performed. By laminating resin and solid ink in sequence, the process can make colored 3D objects in StereoLithography(SL) parts. The practicality and effectiveness of the proposed process were verified through fabrication of colored basic 3D objects in SL parts.

• 대한전자공학회논문지SD
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• 제41권5호
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• pp.23-36
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• 2004

밀리미터파 대역용 고속 HEMT 소자 제작 및 개발을 위하여 0.l㎛ 이하의 T-게이트 길이를 형성하기 위한 전자빔 리소그래피 공정을 분석할 수 있는 새로운 몬테 카를로 시뮬레이터를 개발하였다. 전자빔에 의한 노광 공정 모델링을 위해 전자산란에 대한 몬데 카를로 시뮬레이션에서 다층 리지스트 및 다원자 타겟 기판 구조에서 리지스트에 전이되는 에너지를 효율적으로 계산하도록 내부 쉘 전자 산란과 에너지 손실에 대해 새로이 모델링하였다. 다층 리지스트 구조에서 T-게이트 형상을 얻기 위해서 보통은 재현성 문제로 각 리지스트에 대해 각기 다른 현상액을 사용하게 되는데, 3층 리지스트 구조에서의 전자빔 리소그래피 공정을 정확하게 시뮬레이션하기 위해 각기 다른 현상 모델을 적용하였다. 본 논문에서 제안 개발된 모델을 사용하여 HEMT 소자의 전자빔 리소그래피에 의한 0.l㎛ T-게이트 형성 공정을 시뮬레이션하고 SEM 측정 결과와 비교하여 T-게이트 형성 공정을 분석하였다.

• 한국정밀공학회지
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• 제31권12호
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• pp.1093-1100
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• 2014

The goal of this paper is to investigate preliminary the applicability of 3D printing technologies for the development of the hot bulk forming process and die. 3D printing technology based on the plastic material was applied to the preform design of the hot forging process. Plastic hot forging dies were fabricated by Polyjet process for the physical simulation of the workpiece deformation. The feasibility of application of Laser-aided Direct Metal Rapid Tooling (DMT) process to the fabrication of the hot bulk metal forming die was investigated. The SKD61 hot-working tool steel was deposited on the heat treated SKD61 using the DMT process. Fundamental characteristics of SKD 61 hot-working tool steel deposited specimen were examined via hardness and wear experiments as well as the observation of the morphology. Using the results of the examination of fundamental characteristics, the applicability of the DMT process to manufacture hot bulk forming die was discussed.

• 한국정밀공학회지
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• 제23권4호
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• pp.183-190
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• 2006

Digital 3D Real Object Duplication System (RODS) consists of 3D Scanner and Solid Freeform Fabrication System (SFFS). It is a device to make three-dimensional objects directly from the drawing or the scanning data. In this research, we developed an office type SFFS based on Three Dimensional Printing Process and an industrial SFFS using Dual Laser. An office type SFFS applied sliding mode control with sliding perturbation observer (SMCSPO) algorithm for control of this system. And we measured process variables about droplet diameter measurement and powder bed formation etc. through experiments. In case of industrial type SFFS, in order to develop more elaborate and speedy system for large objects than existing SLS process, this study applies a new Selective Dual-Laser Sintering (SDLS) process and 3-axis Dynamic Focusing Scanner for scanning large area instead of the existing f lens. In this process, the temperature has a great influence on sintering of the polymer. Also the laser parameters are considered like that laser beam power, scan speed, and scan spacing. Now, this study is in progress to evaluate the effect of experimental parameters on the sintering process.

• 센서학회지
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• 제28권4호
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• 산업공학
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• 제12권3호
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• pp.395-400
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• 1999

Shipbuilding process is composed of hull construction, in which the structural body of a ship is formed, and outfitting, in which all the non-structural parts such as pipes, derricks, engines, machinery, electrical cable, etc. are manufactured, added and assembled. Hull construction can be classified into parts fabrication, block assembly and hull erection. Among them, the parts fabrication is the first manufacturing stage that produces components or zones needed for block assembly and hull construction. More specifically, the parts fabrication is performed through machining processes including marking, cutting, pressing, and/or forming. When material is entering into the parts fabrication stage, it is important for achieving the total efficiency of production to select one of production division, so-called 'bay,' as well as machine tools on which the part is fabricated. In this paper, given production quantities of parts in the fabrication stage, the problem is to optimally select machine tools and production division, such that the total flow-time is minimized as well as the workload among machines is balanced. Specifically, three mathematical models for flow-time minimization, load balance, and simultaneously considering both objectives, and a numerical example are analyzed and presented.

• International Journal of Quality Innovation
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• 제8권2호
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• pp.132-146
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• 2007

Constructing an effective production control policy is the most important issue in wafer fabrication factories. Most of researches focus on the input regulations of wafer fabrication. Although many of these policies have been proven to be effective for wafer fabrication manufacturing, in practical, there is a need to help operators decide which lots should be pulled in the right time and to develop a systematic way to alleviate the long queues at the bottleneck workstation. The purpose of this study is to construct a photolithography workstation dispatching rule (PADR). This dispatching rule considers several characteristics of wafer fabrication and influential factors. Then utilize the weights and threshold values to design a hierarchical priority rule. A simulation model is also constructed to demonstrate the effect of the PADR dispatching rule. The PADR performs better in throughput, yield rate, and mean cycle time than FIFO (First-In-First-Out) and SPT (Shortest Process Time).

• 한국정밀공학회지
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• 제24권8호통권197호
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• pp.138-143
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• 2007

Microstereolithography technology is similar to the conventional stereolithography process and enables to fabricate a complex 3D microstructure. This is divided into scanning and projection type according to aiming at precision and fabrication speed. The scanning MSL fabricates each layer using position control of laser spot on the resin surface, whereas the projection MSL fabricates one layer with one exposure using a mask. In the projection MSL, DMD used to generate dynamic pattern consists of $1024{\times}768$ micromirrors which have $13.68{\mu}m$ per side. The fabrication range and resolution are determined by the field of view of the DMD and the magnification of the projection lens. If using the projection lens with high power, very fine microstructures can be fabricated. In this paper, the projection MSL system adapted to a large surface for array-type fabrication is presented. This system covers the meso range, which is defined as the intermediate range between micro and macro, with a resolution of a few ${\mu}m$. The fabrication of array-type microstructures has been demonstrated to verify the performance of implemented system.