• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.125-126
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• 2008

• Proceedings of the Optical Society of Korea Conference
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• 1989.02a
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• pp.193-195
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• 1989

A simple fabrication technique of diffraction gratings with short periods is presented. We can see that the monitoring of diffracted light from photoresist gratings during the development process provides optimum conditions for exposure and development processes. With this technique reproducibility and high quality of diffraction gratings is expected.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5748-5755
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• 2015

Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.9
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• pp.442-445
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• 2006

In order to realize the commercial application of HTSC materials, it is necessary to develop the fabrication process of high Tc oxide superconductor materials with desired shape and for practical application and high critical current density as well as good mechanical strength which can withstand high lorenz force generated at high magnetic field. Much studies have been concentrated to develop the fabrication technique for high critical current density but still there are a lot of gap which should be overcome for large scale application of HTSC materials at liquid nitrogen temperature. Recently some new fabrication techniques have been developed for YBaCuO bulk superconductor with high mechanical strength and critical current density. In this project, the establishment of fabrication condition and additive effects of second elements were examined so as to improve the related properties to the practical use of YBaCuO superconductor, and we reported the production of the YBaCuO high Tc superconductor by the pyrolysis method.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.8 s.227
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• pp.1065-1074
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• 2004

A robust optimal design considering fabrication influence has been performed for the decoupled vibratory microgyroscope fabricated by the bulk micromachining. For the analysis of the gyroscope, a design tool has been developed, by which user can perform the system level design considering electric signal process and the fabrication influence as well as mechanical characteristics. An initial design of the gyroscope is performed satisfying the performances of scale factor (or sensitivity) and phase delay, which depend on the frequency difference between driving and sensing resonant frequencies. The objective functions are formulated in order to reduce the variances of the frequency difference and the frequency in itself by fabrication error. To certify the results, the standard deviations are calculated through the Monte Caries Simulation (MCS) and compared initial deviation that is measured fabricated gyroscope chip.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.7
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• pp.364-366
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• 2006

In order to realize the commercial application of HTSC materials, it is necessary to develop the fabrication process of high Tc oxide superconductor materials with desired shape and for practical application and high critical current density as well as good mechanical strength which can withstand high lorenz force generated at high magnetic field. Much studies have been concentrated to develop the fabrication technique for high critical current density but still there are a lot of gap which should be overcome for large scale application of HTSC materials at liquid nitrogen temperature. Recently some new fabrication techniques have been developed for YBaCuO bulk superconductor with high mechanical strength and critical current density. In this project, the establishment of fabrication condition and additive effects of second elements were examined so as to improve the related properties to the practical use of YBaCuO superconductor, and we reported the production of the YBaCuO high Tc superconductor by the pyrolysis method.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.39 no.1
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• pp.73-80
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• 2016

This study focuses on the formation of input release lots in a semiconductor wafer fabrication facility. After the order-lot pegging process assigns lots in the fab to orders and calculates the required quantity of wafers for each product type to meet customers' orders, the decisions on the formation of input release lots should be made to minimize the production costs of the release lots. Since the number of lots being processed in the wafer fab directly is related to the productivity of the wafer fab, the input lot formation is crucial process to reduce the production costs as well as to improve the efficiency of the wafer fab. Here, the input lot formation occurs before every shift begins in the semiconductor wafer fab. When input quantities (of wafers) for product types are given from results of the order-lot pegging process, lots to be released into the wafer fab should be formed satisfying the lot size requirements. Here, the production cost of a homogeneous lot of the same type of product is less than that of a heterogeneous lot that will be split into the number of lots according to their product types after passing the branch point during the wafer fabrication process. Also, more production cost occurs if a lot becomes more heterogeneous. We developed a multi-dimensional dynamic programming algorithm for the input lot formation problem and showed how to apply the algorithm to solve the problem optimally with an example problem instance. It is necessary to reduce the number of states at each stage in the DP algorithm for practical use. Also, we can apply the proposed DP algorithm together with lot release rules such as CONWIP and UNIFORM.

• Journal of Sensor Science and Technology
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• v.27 no.3
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• pp.170-174
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• 2018

In this paper, the $TiO_2$/glucose oxidase (GOD) mixture has synthesized through simple and low-cost fabrication methods. The physical properties of the mixture were proved using an FT-IR/NIR spectrometer, an X-Ray diffractometer, and a Raman spectrometer. GOD maintained its bioactivity during all fabrication process. The current characteristics of the glucose biosensor were proportional to the glucose concentration and effective surface area of square pyramid on a silicon substrate. The maximum current change was measured in a pH 7.0 buffer solution. The simple and low-cost fabrication process and surface treatment can be used widely in previous research for improvements in effective surface area.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.8
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• pp.743-748
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• 2015

This paper reports the enhanced fabrication and characterization of a $3{\times}3$ array tactile actuator composed of cellulose acetate. The array tactile actuator, with dimensions of $15{\times}15{\times}1mm^3$, consists of 9 pillar-supported cells made from a cellulose-acetate molding. The fabrication process and performance test along with the results for the suggested actuator are explained. To improve the cell-array fabrication, a laser cut was adopted after the molding process. The displacement of the unit cell increased the input voltage and frequency. Various top masses are added onto the actuator to mimic the touch force, and the acceleration of the actuator is measured under actuation. When 2 kV is applied to the actuator, the maximum acceleration is 0.64 g, which is above the vibrotactile threshold. The actuation mechanism is associated with the electrostatic force between the top and bottom electrodes.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.164-173
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• 2006

The cooling capacity of a micro-heat pipe is mainly governed by the magnitude of capillary pressure induced in the wick structure. For microchannel wicks, a higher capillary pressure is achievable for narrower and deeper channels. In this study, a metallic micro-heat pipe adopting high-aspect-ratio microchannel wicks is fabricated. Micromachining of high-aspect-ratio microchannels is done using the laser-induced wet etching technique in which a focused laser beam irradiates the workpiece placed in a liquid etchant along a desired channel pattern. Because of the direct writing characteristic of the laser-induced wet etching method, no mask is necessary and the fabrication procedure is relatively simple. Deep microchannels of an aspect ratio close to 10 can be readily fabricated with little heat damage of the workpiece. The laser-induced wet etching process for the fabrication of high-aspect-ratio microchannels in 0.5mm thick stainless steel foil is presented in detail. The shape and size variations of microchannels with respect to the process variables, such as laser power, scanning speed, number of scans, and etchant concentration are closely examined. Also, the fabrication of a flat micro-heat pipe based on the high-aspect-ratio microchannels is demonstrated.