• 반도체디스플레이기술학회지
• /
• 제4권4호
• /
• pp.27-31
• /
• 2005

This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

• Design & Manufacturing
• /
• 제9권2호
• /
• pp.1-5
• /
• 2015

Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

• 한국재료학회지
• /
• 제9권1호
• /
• pp.65-72
• /
• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• 센서학회지
• /
• 제11권4호
• /
• pp.200-208
• /
• 2002

This paper represents the development of an array-type flexible tactile sensor using PVDF(polyvinylidene fluoride) film and flexible circuitry. The tactile sensor which has $8{\times}8$ taxels is made by using PVDF film and FPC(flexible printed circuit) technique. Experimental results on static and dynamic properties are obtained by applying arbitrary forces and frequencies generated by the shaker. In the static characteristics, the threshold and the linearity of the sensor are investigated. Also dynamic response of the sensor subjected to the variable frequencies is examined. The signals of a contact force to the tactile sensor are sensed and processed in the DSP system in which the signals are digitalized and filtered. Finally, the signals are integrated for taking the force profile. The processed signals of the outputs of the sensor are visualized on a personal computer, the shape and force distribution of the contacted object are obtained using two and three-dimensional image in real time. The reasonable performance for the detection of contact state is verified through the experiment.

• Smart Structures and Systems
• /
• 제9권6호
• /
• pp.535-547
• /
• 2012

Controlling the balance of motion in a context involving a biped robot navigating a rugged surface or a step is a difficult task. In the present study, a $3{\times}5$ flexible piezoelectric tactile sensor array is developed to provide a foot pressure map and zero moment point for a biped robot. We introduce an innovative concept involving structural electrodes on a piezoelectric film in order to improve the sensitivity. The tactile sensor consists of a polymer piezoelectric film, PVDF, between two patterned flexible print circuit substrates (FPC). Additionally, a silicon rubber bump-like structure is attached to the FPC and covered by a polydimethylsiloxane (PDMS) layer. Experimental results show that the output signal of the sensor exhibits a linear behavior within 0.2 N ~ 9 N, while its sensitivity is approximately 42 mV/N. According to the characteristic of the tactile sensor, the readout module is designed for an in-situ display of the pressure magnitudes and distribution within $3{\times}5$ taxels. Furthermore, the trajectory of the zero moment point (ZMP) can also be calculated by this program. Consequently, our tactile sensor module can provide the pressure map and ZMP information to the in-situ feedback to control the balance of moment for a biped robot.

• 전기전자학회논문지
• /
• 제22권1호
• /
• pp.193-196
• /
• 2018

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2006년도 춘계 학술대회 개요집
• /
• pp.16-17
• /
• 2006

We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.

• Journal of Nutrition and Health
• /
• 제3권3호
• /
• pp.129-135
• /
• 1970

우리나라 유유아 및 성장기아동을 위한 영양식품 개발을 목표로 시작한 일련의 연구 중 시제품 F-P-4가 단일 완전식품 및 다목적 식품으로서 가장 우수하였다. 본 연구는 F-P-4 보다 영양가를 향상시키면서도 제품의 가격을 저하시킬 수 있는 가능성을 구명하기 위하여 이를 기준으로 새로이 F-P-5, F-P-6 및 F-P-7을 조제하고, 재차 화학적 성분분석, 동물사육시험, 유유아 급식시험을 실시하므로서 시제품에 대한 영양학적 생화학적 검토와 함께 그 저장성을 검토하였다. 1. F-P-5, F-P-6 및 F-P-7의 단백질 함량은 구성 원료의 배합비에 다소 변동이 있으나 F-P-4의 경우와 마찬가지로 약21%이였다. 2. 흰쥐에 급식, 7주간 사육한 결과 F-P-4, F-P-5 및 F-P-6군은 그 성장도가 서로 비슷하고 FER이 다같이 0.20이었으나, F-P-7군은 FER이 0.16으로 가장 낮고 타군에 비하여 성장도 떨어졌다. 3. F-P-4, F-P-5 및 F-P-6를 $3{\sim}12$개월 되는 유유아에게 30일간 급식한 결과 잘 먹었고 전반적으로 체온, 대변의 성상, 체중증가 등이 정상이었고 발육도 좋았다. 그리고 Hemoglobin 함량은 급식 전에는 정상치보다 다소 낮았으나, 30일 급식 후에는 0.6{\sim}2.2g%$가 증가하여 정상범위에 이르렀고, 혈청 albumin 및 총단백질량도 급식 후에는 전반적으로 증가하는 경향을 보였다. 한편 BUN도 대체로 소아표준치의 정상범위내에 있었다. 4. F-P-4를 8개월간 $25^{\circ}C,\;65{\sim}80%$의 상대습도에서 polyethlene film (0.04mm)으로 포장 저장한 결과 비타민 C와 생균수가 감소, POV, TBA value가 증가하였으며, spectral reflectance intensity, organoleptic quality에도 역시 변화가 있어서 식용할 수 있는 범위는 2개월 이내로 판정되었다. 따라서 저장성을 높이기 위한 제품 및 포장에 대한 검토가 필요하다. 5. F-P-5와 F-P-6 제품은 F-P-4에 비하여 그 영양가는 비등하되, 약 10%의 원료비의 절약이 예상된다. 원료배합 공정까지를 고려할 때 F-P-5가 가장 우수한 제품으로 밝혀졌다. 6. 식물성 혼합물인 F-P-7은 유아를 위한 단일 완전식품으로서는 불충분하나, F-P-4보다 20%나 원료비가 낮으므로 성장기 어린이를 위하여 값싼 보충식품으로 활용할만하다고 생각된다.