• The Journal of the Acoustical Society of Korea
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• v.19 no.4
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• pp.107-114
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• 2000

This work is aimed to develop a new type of the Push-Pull ultrasonic transducer that can provide higher sound pressure level and simpler internal structure than conventional types. The driving part of the newly designed transducer is positioned in the middle of the cylinder, and its optimum geometry is determined by using the FEM package, ANSYS. Through FEM model analysis, the effects of all of its geometrical variables such as transducer length, transducer radius, and the edge shape of the end cap have been examined, and the results have led to the optimum geometry. The newly designed transducer has been found to give better performance than that of traditional ones.

• Computers and Concrete
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• v.29 no.4
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• pp.247-253
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• 2022

In this study, the problem of discontinuous contact in two functionally graded (FG) layers resting on a rigid plane and loaded by two rigid blocks is solved by the finite element method (FEM). Separate analyzes are made for the cases where the top surfaces of the problem layers are metal, the bottom surfaces are ceramic and the top surfaces are ceramic and the bottom surfaces are metal. For the problem, it is accepted that all surfaces are frictionless. A two-dimensional FEM analysis of the problem is made by using a special macro added to the ANSYS package program The solution of this study, which has no analytical solution in the literature, is given with FEM. Analyzes are made by loading different Q and P loads on the blocks. The normal stress (σy) distributions at the interfaces of FG layers and between the substrate and the rigid plane interface are obtained. In addition, the starting and ending points of the separations between these surfaces are determined. The normal stresses (σx, σy) and shear stresses (τxy) at the point of separation are obtained along the depth. The results obtained are shown in graphics and tables. With this method, effective results are obtained in a very short time. In addition, analytically complex and long problems can be solved with this method.

• Structural Engineering and Mechanics
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• v.82 no.3
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• pp.401-416
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• 2022

The aim of this study is to examine the frictionless double receding contact problem for two functionally graded (FG) layers pressed with a uniformly distributed load and resting on a homogeneous half plane (HP) using analytical and numerical methods. The FG layers are made of a non-homogeneous material with an isotropic stress-strain law with exponentially varying properties. It is assumed that the contact at the FG layers and FG layer-HP interface is frictionless. The body force of the FG layers and homogeneous HP are ignored in the study. Firstly, an analytical solution for the contact problem has been realized using the theory of elasticity and the Fourier integral transform techniques. Then, the problem modeled and two-dimensional analysis was carried out by using the ANSYS package program based on FEM. Numerical results for contact lengths and contact pressures between FG layers and FG layer-HP were provided for various dimensionless quantities including material inhomogeneity, distributed load width, the shear module ratio, and the heights of the FG layers for both methods. The results obtained using FEM were compared with the results found using the analytical formulation. It was found that the results obtained from analytical formulation were in perfect agreement with the FEM study.

• Computers and Concrete
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• v.27 no.3
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• pp.199-210
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• 2021

The aim of this paper was to examine the continuous and discontinuous contact problems between the functionally graded (FG) layer pressed with a uniformly distributed load and homogeneous half plane using an analytical method and FEM. The FG layer is made of non-homogeneous material with an isotropic stress-strain law with exponentially varying properties. It is assumed that the contact at the FG layer-half plane interface is frictionless, and only the normal tractions can be transmitted along the contacted regions. The body force of the FG layer is considered in the study. The FG layer was positioned on the homogeneous half plane without any bonds. Thus, if the external load was smaller than a certain critical value, the contact between the FG layer and half plane would be continuous. However, when the external load exceeded the critical value, there was a separation between the FG layer and half plane on the finite region, as discontinuous contact. Therefore, there have been some steps taken in this study. Firstly, an analytical solution for continuous and discontinuous contact cases of the problem has been realized using the theory of elasticity and Fourier integral transform techniques. Then, the problem modeled and two-dimensional analysis was carried out by using ANSYS package program based on FEM. Numerical results for initial separation distance and contact stress distributions between the FG layer and homogeneous half plane for continuous contact case; the start and end points of separation and contact stress distributions between the FG layer and homogeneous half plane for discontinuous contact case were provided for various dimensionless quantities including material inhomogeneity, distributed load width, the shear module ratio and load factor for both methods. The results obtained using FEM were compared with the results found using analytical formulation. It was found that the results obtained from analytical formulation were in perfect agreement with the FEM study.

• Journal of KSNVE
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• v.4 no.3
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• pp.327-335
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• 1994

In this paper, to identify the dynamic characteristics of antenna system, the antenna is divided into 4 components and those were analyzed with a conventional FEM package MSC/NASTRAN. Using a Component Mode Synthesis Method, dynamic characteristics of total system is also identified. The Coherence of each component to total system is evaluated by using strain and kinetic component to total system is evaluated by using strain and kinetic energy. The improving strategy of dynamic characteristics is suggested by changing mass and stiffness of large coherence components.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.15-18
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• 2007

As the line width of the pattern become thin more and more, the accuracy of ultra-precision stage should be increased. Various type stages have been developed and used in fabrication phase and inspection lab. Furthermore the line with become several tens of nanometer recently. We need ultra high precision stage. In this paper a new type stage is proposed in order to reduce the deformation of working table. The table is supported by several flexure hinges and actuated by a PZT. The local deformation is analyzed and the vibratory motion is also examined by FEM package.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.203-206
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• 1999

The shift of flow behavior due to dynamic recrystallization during hot forming process is investigated, A series of load relaxation and compression tests has been conducted at various temperatures Constitutive relations and recrystallization behaviors were formulated from the mechanical test results, The consideration of dynamic recrystallization during a specific forming process was implemented to commercial FEM package by conditioned remeshing and remapping of state variables. Improvement of Load-Stroke prediction was validated by comparison with experimental results.

• Journal of Welding and Joining
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• v.19 no.6
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• pp.658-663
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• 2001

Residual stress caused in the weldments with high restraint force are often during welding observed in the weldments of large size nozzles or radial tanks. The reason is that quantitative analysis about thermal stresses during welding is lack for this weldments. To verify FEM theory, the temperature was measured with thermocouple in a real time in this paper. Also analysis of the thermal stress for welding condition is performed by ABAQUS program package on various welding condition in STS butt welding.

• Journal of KSNVE
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• v.2 no.1
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• pp.41-47
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• 1992

In order to reduce the shock which may occur during shipping of a drumtype container, rubber mounts were designed using a commercial FEM package and manufactured, and then the performance was checked by static and dynamic test. According to the design specifications, the container system was tested by dropping. The experimental results are compared with the theoretical ones.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.