• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1664-1666
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• 2004

This paper describes the use of Armaid papers and varnishes in electric motors. We compare with boundary element method(BEM) and finite element method(FEM) by calculated electric field strength. Several computer software package to perform such calculations based on electrostatic field and applicable DC are available.

• Proceedings of the Acoustical Society of Korea Conference
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• spring
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• pp.373-376
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• 2000

기존의 Push-Pull 트랜스듀서보다 간단한 구조를 가지며 출력을 한층 더 높이기 위해서 실린더 중앙에 구동부를 둔 새로운 구조의 Push-Pull 트랜스듀서를 설계하고자 한다. 유한 요소 상용 Package인 ANSYS를 이용하여 트랜스듀서의 모델을 구성한 후, 분석 시 고려되어 지는 길이, 반경, Endcap Edge 형상에 대해 변수로 설정, 변수들의 변화에 대한 음압의 변화 경향을 조사하여 최대 음압을 구현하기 위한 최적 길이, 반경, Endcap Edge 형상을 설정하였다. Endcap의 형상이 수직, 삼각형 형태의 트랜스듀서에서 나타난 결과에서 힘의 전달이 Edge형상이 수직일 때보다는 삼각형일 때가 더 좋은 것을 볼 수가 있었다. 또한 기존의 트랜스듀서를 유한 요소로 설계를 하여서 분석을 하였고, 기존의 트랜스듀서와 비교해 본 결과, 최적 설계한 트랜스듀서가 구조적으로 더 단순한 구조임에도 불구하고 더 큰 음압을 구현할 수 있는 고출력 트랜스듀서라는 것을 입증하였다.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.822-823
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• 2011

The authors analyzed harmonic current based loss of a high temperature superconducting (HTS) DC model cable. The loss in HTS DC cable is generated due to the variation of magnetic field caused by harmonic current in a HVDC transmission system. The authors designed and fabricated two meters of HTS DC model cable for verification of real loss characteristic. In this paper, the loss characteristics caused by harmonic current in the HTS DC model cable are analyzed using commercial finite element method software package. The loss of the HTS DC cable is much less than the loss of the HTS AC cable but the loss should be considered to decide a proper capacity of cooling system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.63-66
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• 2003

Forged gears have the obvious advantages with the greater utilisation of raw material and high productivity over the machined gears. The forged bevel gear has been used in differential gear for automotive with a high reliance. On the other hand, the studies have been continued to improve the accuracy and expand the applying areas. In this paper, a whole manufacturing process for forged gear from die design and cold forging to heat-treatment was introduced. The stress and elastic deformation for forging die have been analysed by the 3D-FEM-package. The real elastic deformation of die was measured by the strain-gages. The elastic deformation of die was reached to 1mm, in terms of the present study. The analysed quantitative dimension of die was taken into consideration into the CAD/CAM data for forging die.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.4
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• pp.578-584
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• 2008

In this study, a extrusion process with torsion of the bottom die is investigated to improve the forming performance of conventional extrusion process. In the experiment, plasticine is used as a model material. The results of experiments are compared with the two numerical methods, the Experiment and the Finite Element Method(FEM). An attempt is made to link programs incorporating with the process variables obtained by commercial FEM software, DEFORM-3D a useful package. Numerical result is compared with experimental one. These results show that the torsional extrusion process is very useful process because this process can obtain the homogenous deformations.

• Journal of the Semiconductor & Display Technology
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• v.10 no.3
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• pp.61-65
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• 2011

The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.

• Structural Engineering and Mechanics
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• v.34 no.2
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• pp.159-174
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• 2010

Elastic buckling load of perforated steel plates is typically predicted using the finite element or conjugate load/displacement methods. In this paper an artificial neural network (ANN)-based formula is presented for the prediction of the elastic buckling load of rectangular plates having a circular cutout. By using this formula, the elastic buckling load of perforated plates can be calculated easily without setting up an ANN platform. In this study, the center of a circular cutout was chosen at different locations along the longitudinal x-axis of plates subjected to linearly varying loading. The results of the finite element method (FEM) produced by the commercial software package ANSYS are used to train and test the network. The accuracy of the proposed formula based on the trained ANN model is evaluated by comparing with the results of different researchers. The results show that the presented ANN-based formula is practical in predicting the elastic buckling load of perforated plates without the need of an ANN platform.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• The Journal of the Acoustical Society of Korea
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• v.19 no.4
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• pp.107-114
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• 2000

This work is aimed to develop a new type of the Push-Pull ultrasonic transducer that can provide higher sound pressure level and simpler internal structure than conventional types. The driving part of the newly designed transducer is positioned in the middle of the cylinder, and its optimum geometry is determined by using the FEM package, ANSYS. Through FEM model analysis, the effects of all of its geometrical variables such as transducer length, transducer radius, and the edge shape of the end cap have been examined, and the results have led to the optimum geometry. The newly designed transducer has been found to give better performance than that of traditional ones.