• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the KIEE Conference
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• 2004.07d
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• pp.2568-2570
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• 2004

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new FEM (Finite Element Method) package in CEMTool environment. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way With the introduction of new mesh generation algorithm and NDM (Hosted Dissection Method), our FEM package can guarantee the shorter computational time than MATLAB PDE Toolbox. In addition, using the advanced electromagnetics library of CEMTool FEM package, we can analyze the practical problems such as the motor field analysis. Consequently, with our new FEM package, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1565-1568
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• 2003

The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1349-1353
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• 2003

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present a compiler based approach to the implementation of the command mode generalized PDE solver in CEMTool. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words such as "laplace" and "convect". Also, we can assign the border lines and the boundary conditions in a very easy way. With the introduction of the lexical analyzer and the parser, our FEM toolbox can handle the general boundary condition and the various PDEs represented by the combination of equations. That is why we need not classify PDE as elliptic, hyperbolic, parabolic equations. Consequently, with our new FEM toolbox, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• Proceedings of the KWS Conference
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• v.43
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• pp.58-60
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• 2004

In the field of welding the behavior of a welded structure under consideration may be predicted via heat transfer and residual stress analysis. In order to facilitate the industrial applications of welding, numerical modeling of heat transfer and residual stress in weldment has been carried out applying Finite Element Method (FEM) and the analysis with the external load including this residual stress due to welding has been done. The present work includes the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress redistributed along with the external load in the welded structures. A basic interface, which allows models, built in commercial preprocessing package access to the data necessary to build standard input decks for these specialized FEM codes, which are not supported by commercial package. The results from the FEM codes are imported back into commercial package for visualization. In addition the residual stress values are exported to commercial package (such as ANSYS, PATRAN etc.) for further analysis with the external loads, which make the FEM codes fully applicable to the industrial purpose.

• Journal of Sensor Science and Technology
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• v.22 no.1
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• pp.44-48
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• 2013

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Food Science of Animal Resources
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• v.33 no.1
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• pp.31-38
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• 2013

If the time-temperature indicator (TTI) experienced a different temperature than the accompanied packaged food, influenced by heat transfer between the TTI, package, and ambient air, TTI would incorrectly predict the food quality changes with temperature. Temperature distributions of a finite slab with different sizes, representing beef packaged with TTI, were estimated by the finite element method (FEM). The thermal properties of the beef and TTI, such as heat capacity, density, and heat conductivity, were estimated from the relevant equations using their chemical compositions. The FEM simulations were performed for three cases: different locations of TTIs on the beef, different thicknesses of beef, and non-isothermal conditions of ambient air. The TTIs were mounted in four different locations on the beef. There was little difference in temperature between four locations of the TTI on the package surface. As the thickness of the slab increased, the temperature of the TTI changed faster, followed by the corner surface, as well as middle and bottom parts, indicating the possible error for temperature agreement between the TTI and the slab. Consequently, it was found that any place on the package could be selected for TTI attachment, but the package size should carefully be determined within a tolerable error of temperature.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.