• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.25 no.7
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• pp.398-405
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• 2013

Small and medium-size buildings employ a multi-distributed individual air-conditioning system that utilizes package air conditioners instead of centralized cooling systems, which can allow easier building management and maintenance, along with a diversification of facility use. Inverter driven system heat pumps have been developed to achieve not only an easy distribution control, allowing free combination of indoor units with different models and different capacities, but also wide applications to intelligent air conditioning. However, the control algorithms of the system heat pump are limited in the open literature, due to complicated operating conditions. In this paper, an inverter-driven system heat pump having two indoor units with electronic expansion valves (EEV) was simulated in the cooling mode. An integral optimum regulating controller employing the state space control method was also simulated, and applied to the system-heat pump system, to obtain efficient control of the MIMO (multi input multi output) system. The simulation model for the controller yielded satisfactory prediction results. The new control model can be successfully utilized as a basic tool in controller design.

• Journal of the Korea Society for Simulation
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• v.16 no.2
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• pp.9-15
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• 2007

As the Internet grows and the mass multimedia data become popular, the storage system migrates from DAS, where the storage and the server are directly connected, to SAN and NAS. SAN connects the storages with a separate network, and NAS provides only file services, connects the storages with IP network. However, SAN and NAS can not fulfill the needs for companies if used separately, thus are asked to be integrated. In this research, we propose an efficient data sharing method which employees the concept of GMC, Croup Master Cache for the integrated environment of SAN and NAS. GMC is based on MCI, Metadata server and Cluster system Integration, but tries to solve the high expansion cost problem with MCI. We introduce the basic concept of GMC, compare the performance of GMC with that of MCI using computer simulation.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.127-134
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• 2010

Components in thermal power plants are subjected to service conditions under which creep damages take place causing material exhaustion. Comprehensive creep damage investigations have been performed on a 0.5Cr0.5Mo0.25V pipe bend which had been taken out of service after 117,603h and 501 start-ups because of severe cracks. The propagation of creep damage in a long term exposed pipe bend has been analysed by the replication, Indentation and hardness tests. Also, Calculation of creep lifetime has been investigated in order to verify actual lifetime of a damaged pipe bend. By measuring diametrical expansion, Accumulated creep strain and creep strain rate were calculated. Calculated results of creep lifetime on the Larson-Miller Parameter method are good agreement with actual service-exposed hour.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2000.06a
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• pp.340-345
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• 2000

진동하는 구조물의 음향 방사 예측에는 키르히호프-헬름홀쯔 적분 방정식에 근본을 둔 경계 요소 해석이 널리 사용된다. 이 경계 요소 해석은 익히 알고 있듯이 구조물의 동적 거동이 정량적으로 표현될 수 있는 경우는 매우 높은 정확도의 예측 결과를 제공한다. 그러나 실제 현상에서 접할 수 있는 복잡한 구조물의 음향 방사 예측에는 많은 변수들로 인해 예측의 정확도가 감소됨은 확실하다. 다른 방법으로는 실험을 통한 임의의 음장 예측 방법인 근음장 음향 홀로그래피(nearfield acoustical holography) 방법을 들 수 있다. 이 방법은 실제로 발생되는 음향 방사로부터 마이크로폰을 이용하여 홀로그램면의 음압 또는 속도를 측정하고 키르히호프-헬름홀쯔 적분 방정식에 적용하여 임의의 홀로그램면에 투사(mapping)시켜 음장을 예측하는 방법이다. 근음장 음향 홀로그래피는 탁월한 정확성을 갖고 있으나, 측정의 복잡성과 홀로그램면을 형성하기 위한 많은 이산점(절점)의 필요성 등의 단점을 갖고 있다. 본 논문에서는 또 다른 음장 예측 방법인 실험의 장점과 유한 요소 해석의 장정을 복합시킨 모드 확장 방법(modal expansion method)을 사용하여 단순 구조물인 평판의 진동에 의한 음장을 예측해 보았다. 모드 확장 방법은 구조물의 동적 거동은 모드의 선형 조합으로 표현될 수 있다는 것에 그 원리를 둔다. 본 논문은 단순 평판을 대상으로 유한 요소 해석으로 구한 모드 정보와 실험에 의해 얻은 입의 가진 주파수에 대한 진동 표면의 속도 분포를 조합하여 속도 경계 조건을 구성, 경계 요소 해석으로 음장 예측을 수행하였으며 모드 확장 방법을 사용함에 있어 고려해야할 몇 가지 사항에 대해 다루었다.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.06a
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• pp.99-102
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• 2006

In the present study, the blow forming characteristics of AZ31 sheet was investigated to test the feasibility of the practical application of wrought Mg alloys. Mg alloys have drawn a huge attention in the field of transportation and consumer electronics industries since it is the lightest alloy which could be industrially applicable. Most Mg alloy components have been fabricated by casting method. However, there have been a lot of research activities on the wrought alloys and their plastic forming process recently. Shallow cups for the small electronics cases have been stamped with warm die system. However, some technical issues will challenge Mg forming when large parts are considered with warm die system over $200^{\circ}C$. Most of all, thermal expansion of die system will deteriorate a die accuracy. On the other hand, blow forming does not have a problem with inaccuracy with die system. In this study, tensile tests were followed by blow forming at various temperature and pressure. AZ31 sheet showed a superplastic deformation behavior with extensive grain boundary sliding at the temperature above $300^{\circ}C$. However, the deformation behavior was likely to differ depending on stress condition.

• Transactions of Materials Processing
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• v.27 no.3
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• pp.145-153
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• 2018

Magnesium material could be widely used in the automotive industry because of its high strength to weight ratio, but the electric resistance spot welding process of magnesium sheets is difficult because of its low electric resistance and high thermal conduction and thermal expansion. For this reason, an electric resistance surface friction spot welding process using rotating dies is suggested for the spot welding of magnesium metal sheets. This welding method can be characterized by three heating methods: (1) electric resistance heating on contacted surface, (2) surface friction heating by rotating dies, and (3) thermal conduction heating from heated steel electrodes, for the fusion of metal at the interfacial zone between the two magnesium sheets. This welding process also has variables to explore, such as welding currents, diameters of the steel electrode, and rotating dies. It was found that the welding strength could reach industrial requirements by applying a welding current of 11.0kA, with steel electrodes of 12mm diameter, with rotating dies of 4.4 mm diameter, under the condition of a revolution speed of 1200rpm of rotating dies, for the surface friction spot welding process of AZ31 magnesium alloy sheets of 1.4mm thickness.

• Communications for Statistical Applications and Methods
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• v.19 no.5
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• pp.697-704
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• 2012

The maximum likelihood(ML) estimation of the scale parameters of an exponential distribution based on progressive Type II censored samples is given. The sample is multiply censored (some middle observations being censored); however, the ML method does not admit explicit solutions. In this paper, we propose multiply progressive Type II censoring. This paper presents the statistical inference on the scale parameter for the exponential distribution when samples are multiply progressive Type II censoring. The scale parameter is estimated by approximate ML methods that use two different Taylor series expansion types ($AMLE_I$, $AMLE_{II}$). We also obtain the maximum likelihood estimator(MLE) of the scale parameter under the proposed multiply progressive Type II censored samples. We compare the estimators in the sense of the mean square error(MSE). The simulation procedure is repeated 10,000 times for the sample size n = 20 and 40 and various censored schemes. The $AMLE_{II}$ is better than MLE and $AMLE_I$ in the sense of the MSE.

• Journal of the Korean Wood Science and Technology
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• v.23 no.4
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• pp.1-9
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• 1995

This study was carried out to experiment the dimensional stabilization of woods of red pine (Pinus densiflora S. et Z.) and sugi(Cryptomeria japonica D. Don) by vacuum impregnation of polyehtylene glycols(PEG) with mo. wt. 200, 400, 600, 1000; polypropylene glycols (PPG) with mo. wt. 425,725 ; PEG-acryloylates, and PPG-acryloylates synthesized, and then by water soaking. The results obtained are as follows: 1. The density of sapwood and heartwood was different from each other in both species. 2. The PEG and PEG-macromers with lower molecular weight by impregnation has increased the density of wood specimens more higher, thereby caused their higher volume expansion, and those with higher molecular weight than 600 has tended to down their density increment. 3. Before and after water soaking, the density decrease of specimen impregnated was high in woods impregnated with simple PEG and PPG, while lower in specimens impregnated with PEG-macromers and PPG-macromers. 4. So PEG-macromer was expected to hold the original dimension of decayed wood for antiques, but it was necessary to develop another penetration method as well as aqueous solvent.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2007.11a
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• pp.93-102
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• 2007

Biocomposite was organized with biodegradable polymer and natural fiber that has potential to be used as replacement for glass fiber reinforced polymer composite with the benefits of low cost, low density, acceptable specific strength, biodegradability, etc. Until now, non-wood fibers have been used as reinforcements of biocomposite which are all plant-based fibers. The present study focused on investigating the fabrication and characterization of biocomposite reinforced with red algae fiber. The bleached red algae fiber(BRAF) showed very similar crystallinity to the cellulose. It has high stability against thermal degradation (maximum thermal decomposition temperature of 359.3$^{\circ}C$) and thermal expansion. Biocomposites reinforced with BRAF have been fabricated by a compression molding method and their mechanical and thermal properties have been studied. The storage modulus and the thermomechanical stability of PBS matrix are markedly improved with reinforcing the BRAF. These results support that the red algae fiber can be used as an excellent reinforcement of biocomposites as "green-composite" or "eco-composite".