• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.396-396
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• 2007

Highly ordered pore structures as a template for formation of seeds have been prepared by the self-organization process of aluminum oxidation. The a-Si films were deposited on the anodic alumina films and crystallized by laser irradiation. It was found that un-melted part of fine poly-Si grain formed by explosive crystallization (EX) lead super lateral growth(SLG) and occluded with neighbor grains. The crystallized grains along the distribution of seeds were obtained. This results show a great potential for use in novel crystallization for decently uniform polycrystalline Si thin film transistors (poly-Si TFTs).

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1781-1784
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• 2007

The increase of repetition rate, the dithering of laser optics, and the extension of pulse duration time are major approaches in improving the picture quality of AMOLEDs fabricated by excimer laser crystallization (ELC). Advanced solid phase crystallization (ASPC) has been developed to improve the uniformity and the process cost. Even though the mobility of ASPC-TFT is lower than that of ELC-TFT, it is high enough to drive AMOLED pixels.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.2052-2054
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• 2005

TFT-LCD requires to use poly silicon for High resolution and High integration. Thin film make of Poly silicon on the excimer laser-induced crystallization of PECVD(plasma-enhanced chemical vapor deposition)-grown amorphous silicon. In the thin film hydrogen affects to a device performance from bad elements like eruption, void and etc. So dehydrogenation prior to laser exposure was necessary. In this study, use RTP(Rapid Thermal Process) at various temperature from $670^{\circ}C$ to $750^{\circ}C$ and fabricate poly-silicon. it propose optimized RTP window to compare grain size to use poly silicon's SEM pictures and crystallization to analyze Raman curved lines.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.509-512
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• 2006

In this paper, we proposed the novel device and process design to enhance the uniformity of low-temperature poly-Si TFTs fabricated by sequential lateral solidification (SLS). The proposed design schemes can avert the conventional two-shot SLS process-induced issues. Moreover, different design considerations between conventional excimer laser crystallization and the SLS process were also proposed and discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.375-375
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• 2007

In the conventional crystallization method, thepoly-Si TFTs show poor device-to-device uniformity because of the random location of the grain boundaries. However, our new crystallization method introduced in this paper employed substrate-embedded seeds on the highly ordered anodic alumina template to control both the location of seeds and the number of grain boundaries intentionally. In the process of excimer laser crystallization (ELC), a-Si film deposited on the anodic alumina by low pressure chemical vapor deposition (LPCVD) is transformed into fine poly-Si grains by explosive crystallization (XC) prior to primary melting. At the higher energy density, the film is nearly completely melted and laterally grown by super lateral growth (SLG) from remained small part of the fine poly-Si grains as seeds at the Si/anodic alumina interface. Resultant grain boundaries have almost linear functions of the number of seeds in concavities of anodic alumina which have a constant spacing. It reveals the uniformity of. device can be enhanced prominently by controlling location and size of pores which contains fine poly~Si seeds under artificial anodizing condition.

• 융합정보논문지
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• 제9권3호
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• pp.75-81
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• 2019

본 논문은 유기물로 이루어진 폴리머 기판상에 저온 다결정 실리콘 박막트랜지스터 제조방법에 대해 연구하였다. 먼저, 폴리머 기판에 화학증착방식으로 비결정 실리콘 박막을 증착하였고, 열처리 장치인 퍼니스로 탈수소 및 활성화 공정을 430도에서 2시간동안 진행하였다. 이후 엑시머 레이저를 이용하여 결정화를 진행하여 다결정 실리콘 반도체 막을 제조하였다. 이 박막은 박막트랜지스터 제작을 위한 활성층으로 사용하였다. 제작된 p형 박막트랜지스터는 이동도 $77cm^2/V{\cdot}s$, on/off 전류비는 $10^7$이상의 동작특성을 보였고, 이는 결정화된 박막내부에 결함 농도가 낮음을 의미한다. 이 결과로 유기물 기판상에 엑시머 레이저로 형성된 다결정 실리콘으로 제작된 전자소자는 플렉서블 AMOLED 디스플레이 회로 형성에 최적의 기술임을 알 수 있다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.647-650
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• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1108-1111
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• 2005

We propose an improved laser crystallization method based on a directional lateral growth technique. To assess the feasibility of this technique, we have developed an experimental prototype using a 351 nm XeF excimer laser and special optics to produce a long and extremely sharp, narrow beam without need for a photo type mask pattern. Using this system, we have demonstrated very uniform directional laterally grown poly-Si films without any grain boundary protrusions. We believe this method can meet the high performance and uniformity requirements needed for future TFTs in System On Panel (SOP) and OLED applications, as well as providing high process throughput for mass production.

• 대한전자공학회논문지SD
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• 제38권12호
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• pp.25-35
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• 2001

복잡한 thin film transistor-liquid crystal display (TFT-LCD) array 회로의 전기적 특성을 분석하기 위해서는 PSPICE나 AIM-SPICE와 같은 회로 시뮬레이터를 사용하는 것이 필수적이다. 본 논문에서는 SPICE 시뮬레이션을 위한 다결정 실리콘 (poly-Si) TFT 소자의 입력 변수 추출을 체계화하는 방법을 도입한다. 이 방법을 excimer laser annealing 및 silicide mediated crystallization 방법으로 각각 제작된 다결정 실리콘 TFT 소자에 적용하여 실험 결과와 잘 일치하는 결과를 얻었다. SPICE 시뮬레이터 중에서 PSPICE는 graphic user interface(GUI) 방식의 편의성을 제공하므로 손쉽게 복잡한 회로를 구성할 수가 있다는 장점이 있으나, poly-Si TFT 소자 모델을 가지고 있지 않다. 이 연구에서는 PSPICE에 다결정 실리콘 TFT 소자 모델을 이식하고, TFT가 이식된 PSPICE를 사용하여 poly-Si TFT-LCD 단위 화소 및 라인 RC 지연을 고려한 화소에 대한 전기적 특성을 분석하였다. 이러한 결과는 TFT-LCD 어레이 특성 분석을 위한 시뮬레이션을 효율적으로 수행하는데 기여할 수 있을 것으로 기대된다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.109-112
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• 2008

The grain size of JIC poly-Si can be varied from few tens of nanometers to the one having the larger grain size exceeding that of excimer laser crystallized (ELC) poly-Si according transmission electron microscopy. JIC poly-Si exhibits an excellent uniformity with regards to the grain size. We report here the blanket crystallization of the large area using the $2^{nd}$ generation glass substrate.