• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.1
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• pp.14-20
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• 2016

This paper describes a green stripping process to effectively strip the remaining DFR layer on a non-alkali-based ITO glass surface after an etching process. A stripper, water-soluble amine compound, is used to investigate the characteristics of stripping ability and to suggest a valid method for the green process. Increasing the composition (5-30% concentration) of the ethanol amine-based stripper was found to greatly reduce the stripping time applied in the dipping method. The composition (30%) achieved an excellent stripping effect and free-residue impurities. Additionally, it was possible to obtain the effect of stripping in a way to sustain the release before generating DFR sludge from the ITO glass surface by using dipping condition (stripping time) in the composition. An Additional stripping process (buffering) out of dipping can realize productivity improvement and cost reduction because of the higher proportion of re-use of the stripping solution used in the DFR removal step.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.24.1-24.1
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• 2010

In practical operation, the exposed surfaces may get dirty thus degrade the performance of devices. So the combination of self cleaning and antireflection is very desirable for use in outdoor photovoltaic and displaying devices, self cleaning windows and car windshields. For the purpose of self cleaning, the surface needs to be either superhydrophobic or superhydrophilic. However, in practice AR in the visible region and self cleaning are a pair of competitive properties. To satisfy the requirements for superhydrophobic or superhydrophilic surfaces, high surface roughness is required. But it usually cause severely light scattering. Photo-responsive coatings (TiO2, ZnO etc.) can lead to superhydrophilic. However, the refractive indices are high. Thus for porous structure, controlling pore size in the underwavelength scale to reduce the light scattering is very crucial for highly transparent and self cleaning antireflection coating. Herein, we demonstrate a simple method to make high performance broadband antireflection layer on the glass surface, by "carving" the surface by hot alkali solution. Etched glass has superhydrophilic surface. By chemical modification, it turns to superhydrophobic. Enhanced transparency (up to 97%) in a broad wavelength range was obtained by short time etching. Also antifogging effect has been demonstrated, which may offer advantage for devices working at high humidity environment or underwater. Compositional dependence of the properties was observed by comparing three different commercially available glasses.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.40-43
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• 2004

Stamps for microcontact processing are fabricated by casting elastomer such as PDMS on a master with a negative of the desired pattern. After curing, the PDMS stamp is peeled away from the master and exposed to a solution of ink and then dried. Transfer of the ink from the PDMS stamp to the substrate occurs during a brief contact between stamp and substrate. Generally, negative-tone masters, which are used for making positive-tone PDMS stamps, are fabricated by using photolithographic technique. The shortcomings of photolithography are a relative high-cost process and require extensive processing time and heavy capital investment to build and maintain the fabrication facilities. The goal of this study is to fabricate a negative-tone master by using Nano-indenter based patterning technique. Various sizes of V-grooves and U-groove were fabricated by using the combination of nanoscratch and HF isotropic etching technique. An achieved negative-tone structure was used as a master in the PDMS replica molding process to fabricate a positive-tone PDMS stamp.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.04a
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• pp.91-94
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• 2007

The fabrication and firing test of the ignition system for a micro solid propellant thruster are described in the present paper. Pt igniter coil was patterned on the glass membrane that was fabricated by the wet etching process. The thickness of Pt layer was $2000{\AA}$ and the width of igniter pattern was $40{\mu}m$. The thickness and diameter of glass membrane were $15{\mu}m$ and 1 mm, respectively. Ignition test was performed. Successful ignition of HTPB/AP propellant was obtained with an ignition delay of 1.6 s at an input voltage of 12 V. The ignition energy was estimated to be 1.4 J.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Restorative Dentistry and Endodontics
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• v.21 no.2
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• pp.635-641
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• 1996

This study was designed to evaluate the anti cariogenic effect of F in primers, bonding agents, composite resins or glass ionomer cements in enamel. Twenty-five extracted teeth were selected and a cavity was prepared on either the buccal or the lingual surface of each tooth. After pumicing and etching, the samples were divided into 5 groups. In group A, the samples were primed, bonded and filled with ART bond and Brilliant Enamel (Coltene, Switzerland). Group B composed of Optibond and Herculited XRV (Kerr, USA), group C composed of Syntac and Tetric(Vivadent, Lichtenstein), and group D composed of Scotch-bond Multipurpose and Z 100 (3M, YSA). In group E, the samples were filled with glass ionomer cement (Fuji II LC, Japan), All surfaces except the 2mm beyond the cavosurface margin of the sample were protected, and samples were then put into an acid buffer for 3 days to develop the initial caries. The samples were then sectioned through the filling body into thin wafers and then examined with a polarizing microscope under water imbibition. The fluoride in primer, bonding agent, or composite filling material did not prevent the initial caries in the enamel area adjacent to the filling body whereas the fluoride in the glass ionomer did prevent the initial stage caries.

• The korean journal of orthodontics
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• v.27 no.5 s.64
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• pp.839-852
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• 1997

It has been submitted that different ion solutions containing sulfate induce crystal growth and might substitute conventional acid etching for pretreatment of enamel in orthodontic bonding(${\AA}rtun$ et al., Am. J. Orthod. 85, 333, 1984). This investigation was designed to evaluate the relevance of crystal growth on the enamel surface as an alternative to conventional acid etching in direct bonding of orthodontic brackets. Annexing Li2SO4, MgSO4, K2SO4 respectively in the solution with $25\%$ polyacrylic md 0.3M sulfuric acids were employed to enhance the crystal growth. Human bicuspids were treated with various parameters as combinations of crystal growth and glass ionomer cement, crystal growth and orthodontic resin, acid etching and orthodontic resin for an investigative purpose. Crystal growth solution containing MgSO4 showed the highest shear bond strength(15.6MPa) within the groups of bonding brackets with glass ionomer cement(p<0.01). Bonding with glass ionomer cement on the surface of crystal growth demonstrated higher shear bond strength than with orthodontic resin(p<0.001). Bonding with glass ionomer cement on the surface treated with crystal growth solution containing MgSO4 or K2SO4 was not different shear bond strength statistically from bonding with orthodontic resin on the acid-etched surface. It suggests that bonding brackets with glass ionomer cement on the surface treated with crystal growth solution containing MgSO4 or K2SO4 is a potential alternative to bonding with resin on the acid etched sufrace.

• Restorative Dentistry and Endodontics
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• v.7 no.1
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• pp.77-83
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• 1981

The purpose of this study was to observe the bonding strength between tooth surface (enamel and dentin) and restorative filling materials which are two composite resins (Clearfil and Concise) and Glass ionomer cement, after etching with 50% phoshoric acid and 37% citric acid. To measure the bonding strength in enamel, the labial surface of upper anterior tooth was cut flatly with using carborundum disk and polished with sand paper disk, and to measure in dentin, the dentin surface was prepared by grinding upper part of posterior tooth horizontally. After washing the tooth surface with water and drying with air blast, the prepared tooth surface was etched. In glass ionomer cement, 50% phosphoric acid and 37% citric acid were used, in Clearfil 40% phosphoric acid was used and in Concise, 50% phosphoric acid and 37% citric acid were used as etchant for 1 minute. After the copper band which is 5 mm in diameter and 5 mm in height was fixed on the prepared surface and each filling material was inserted into the copper band, the hooking loop was inserted into filled material in the copper band before setting to make it easily that the load is applied on the specimen. After all specimens were immersed in water at $37^{\circ}C$ for 1 week, this specimen was placed on the load cell of tensile test apparatus, and specimen was pulled at the cross-head speed of 0.8 mm per minute. The following results were obtained 1) In glass ionomer cement, the bond strength obtained by 37% citric acid was higher than one obtained by 50% phosphoric acid in enamel and dentin surfaces. The bond strength obtained in non-etched surface was much less than one by etchants in enamel and dentin surface. 2) In Clearfil, the bond strength obtained by 40% phosphoric acid was 4 times more than one obtained by non etch ant. 3) In Concise, the bond strength obtained by 50% phosphoric acid was almost same as one obtained by 37% citric acid, and the bond strength obtained by non etch ant was much less than one obtained by etchants.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.513-519
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• 2006

We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.