• Electrical & Electronic Materials
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• v.7 no.1
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• pp.64-72
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• 1994

본 고는 현재 전기적 응용을 위한 수지 절연물의 진공/가압 수지-주형처리 분야에서 가장 앞선 기술과 연구개발력을 보유하고 있는 스위스의 Ciba-Geigy사와 최신의 진공성형 시스템을 개발, 생산하고 있는 독일의 Hedrich사 및 진공주형/자동가압 성형장비를 생산하는 스위스의 Vogel사 등을 최근에 방문하여 Epoxy, Polyurethane, Polyester 및 Silicone 수지 등의 수지절연시스템을 가지고 구조적으로 기포가 없으며 전기적, 기계적, 열적특성이 매우 우수하고 매끄러운 표면이 요구되는 수지 mold제품을 생산하는데 적용되고 있는 진공 수지-주형처리기술의 현황과 아울러 경화시간을 크게 단축시켜 생산자동화가 가능한 최신의 자동가압겔화(Automatic pressure gelation)/주입몰드공정(Injection molding process)의 특징 및 기술개발현황에 대해 파악한 내용을 소개하고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.119-122
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• 2005

In this study, the design simulation for optimal wire batch around service line was made to improve the dielectric strength at the primary winding using Finite Element Method. The automatic convergence algorithm for finding of limit object value using loop circulation method was developed to make the optimal design simulator. The modulation method was suggested to make division time faster which was very important for full simulation efficiency. As a result, the simulation time was reduced and the optimal wire batch design was obtained.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.31-34
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• 2002

For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Composites Research
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• v.19 no.1
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• pp.29-35
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• 2006

The avoidance of enemy's radar detection is very important issue in the modem electronic weapon system. Researchers have studied to minimize reflected signals of radar. In this research, two types of radar absorbing structure (RAS), 'C'-type shell and 'U'-type shell, were fabricated using fiber-reinforced composite materials and their radar cross section (RCS) were evaluated. The absorption layer was composed of glass fiber reinforced epoxy and nano size carbon-black, and the reflection layer was fabricated with carbon fiber reinforced epoxy. During their manufacturing process, undesired thermal deformation (so called spring-back) was observed. In order to reduce spring-back, the bending angle of mold was controlled by a series of experiments. The spring-back of parts fabricated by using compensated mold was predicted by finite element analysis (ANSYS). The RCS of RAS shells were measured by compact range and predicted by physical optics method. The measured RCS data was well matched with the predicted data.

• Design & Manufacturing
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• v.14 no.4
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• pp.65-70
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• 2020

Partial reinforcement of sheet metal parts with CFRP patch is a technology that can realize ultra-lightweight body parts while overcoming the high material cost of carbon fiber. Performing these patchworks with highly productive press equipment solves another issue of CFRP: high process costs. The A-pillar is the main body part and has an undercut shape for fastening with other parts such as roof panels and doors. Therefore, it is difficult to bond CFRP patches to the A-pillar with a general press forming tool. In this paper, a flexible system that applies uniform pressure to complex shapes using ceramic particles and silicone rubber is proposed. By benchmarking various A-pillars, a reference model with an undercut shape was designed, and the system was configured to realize a uniform pressure distribution in the model. The ceramic spherical particles failed to realize the uniform distribution of high pressure due to their high hardness and point contact characteristics, which caused damage to the CFRP patch. Compression equipment made of silicone rubber was able to achieve the required pressure level for curing the epoxy. Non-adhesion defects between the metal and the CFRP patch were confirmed in the area where the bending deformation occurred. This defect could be eliminated by optimizing the process conditions suitable for the newly developed flexible system.

• Composites Research
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• v.26 no.1
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• pp.42-47
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• 2013

In this study, an economical and effective processing technique to form multiple dimples on the surface of a composite part, which are known to be useful to improve aerodynamic performance and heat dissipation. Forming dimples on the surface using molds is an expensive processing because forming multiple tiny positive spheres on the surface of the mold requires much time and effort. In this study, plates with multiple round holes are utilized as a core to form dimples on the carbon/epoxy composite skin covering the core. A vacuum bagging process is used to apply pressure on the surface while curing. Composite parts which have multiple dimples on the surface can be utilized in the field which needs high aerodynamic performance and heat dissipation ability such as high speed sports car bodies.

• Polymer(Korea)
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• v.24 no.5
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• pp.690-700
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• 2000

In this study, an elastomer-assistered compression molding process was investigated by experiments as well as modeling for the long-fiber reinforced thermoset composites. The consolidation pressure generated by fixed-volume and variable-volume conditions was thermodynamically derived for both elastomer and curing prepregs, and was compared with the pressure measured during curing of epoxy matrix. Exhibiting non-linear viscoelastic characteristics in the compressive stress-strain tests, the measured stress was well compared with a modifed KWW (Kohlrausch-Williame-Watts) equation, which is based on the Maxwell viscoelastic model. Using the developed model equations, the consolidation pressure generated by the elastomer was successfully predicted for the compression molding process of thermoset composite materials in tile closed mold system.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1590-1592
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• 2000

The time to tracking breakdown of treated filled specimen is longer than untreated filled specimen. And, after the RWDT, the surface of specimen by adding untreated filler appeared heavy erosion. It was found that the addition to surface treated filler. the better tracking resistance. In the RWDT, the breakdown specimen is not affected by the dry flashover voltage. despite the fact that the surface degradation of tracking test has different state on each specimen. This suggests that wet flashover voltage play an important role in evaluating of tracking and erosion on the surface degradation in tracking test. And, the flashover voltage of specimen under wet conditions are greatly affected by the salt concentration and degree of degradation by the RWDT. Because of hydrophobicity and degree of degradation by the RWDT, the flashover voltage of treated filled specimen is higher than that of untreated filled specimen. Different types of specimen may have different hydrophobicity and their surface state under contaminated conditions may not be the same. It is assumed that this phenomenon is related to the decrease in hydrophobicity of the surface of the materials.

• Restorative Dentistry and Endodontics
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• v.6 no.1
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• pp.115-122
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• 1980

The corrosion of silver amalgam is regarded as one of major causes in the failures of dental amalgam restorations. To evaluate the corrosion resistance of dental amalgam alloys, electrochemical tests such as potential and polarization measurement were used widely. But these commonly used methods have not provided the sufficient informations on relative resistance of amalgam to corrosion. In this experiment, the corrosion currents were measured using electronic potentiostat to compare some commercial dental amalgam alloys. All alloys were triturated in a amalgamator and condensed into a mold described in A.D.A. Specification No. 1 to produce cylinder form specimens of 4mm diameter by 5mm long. After specimen kept for 1 week at $37^{\circ}C$, each specimen was embedded in epoxy resin. The surfaces of specimens were then polished with a emery paper, diamond dust, and $Al_2O_3$. These specimens were immersed in artifical saliva kept at $37^{\circ}C$, and currents of each specimen were measured for 24 hours at 0.0volt (SCE). The author obtained conclusions as follows: 1. High copper amalgam showed superior resistance against corrosion to conventional amalgam, but a pellet form of high copper amalgam seemed to be susceptible to corrosion. 2. In lathe-cut alloys, fine-cut had superior resistance against corrosion to regular-cut. 3. Non-zinc conventional amalgam alloys were more resistant to corrosion than that of zinc containing conventional amalgam alloys. 4. In both of high copper and conventional amalgams, predispensed forms tended to have better resisitance to corrosion than that of pellet forms.