• 제목/요약/키워드: Epoxy Coating

검색결과 257건 처리시간 0.028초

CS/MTMS/ES 졸겔코팅제 경화박막의 특성 (Characteristics on Cured Thin Film of Sol-Gel Materials Synthesized from CS/MTMS/ES)

  • 명인혜;강동필;안명상;나문경;강영택
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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    • pp.1930-1932
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    • 2005
  • Colloidal Silica(CS)/methyltrimethoxy silane(MTMS) and CS/MTMS/epoxy silane(Es) sol solutions were prepared in variation with synthesizing parameters such as kinds of CS, kinds of silane and reaction time. In order to understand its physical and chemical properties, sol-gel coating films on glass were fabricated. In the case of CS/MTMS sol, the coating films had high contact angle and more enhanced flat surface than those in the case of CS/MTMS/ES sol. Also, the coating films obtained from single CS had a better flat surface than those obtained from mixed CS. In the case of thermal stability, thermal dissociation of CS/MTMS and CS/MTMS/ES sol-gel coating films did not occur up to $550^{\circ}C$ and $440^{\circ}C$ respectively. The thickness of coating films obtained from CS/MTMS sol increased than those of CS/MTMS/ES sol. In addition, the coating films obtained from single CS were more thicker than those obtained from mixed CS.

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철계 연자성 분말용 하이브리드 절연 코팅막 개발 (Development of Hybrid Insulating Coating for Fe-based Soft Magnetic Powder)

  • 김정준;김선겸;김영균;장태석;김휘준;김용진;최현주
    • 한국분말재료학회지
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    • 제28권3호
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    • pp.233-238
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    • 2021
  • Iron-based amorphous powder attracts increasing attention because of its excellent soft magnetic properties and low iron loss at high frequencies. The development of an insulating layer on the surface of the amorphous soft magnetic powder is important for minimizing the eddy current loss and enhancing the energy efficiency of high-frequency devices by further increasing the electrical resistivity of the cores. In this study, a hybrid insulating coating layer is investigated to compensate for the limitations of monolithic organic or inorganic coating layers. Fe2O3 nanoparticles are added to the flexible silicon-based epoxy layer to prevent magnetic dilution; in addition TiO2 nanoparticles are added to enhance the mechanical durability of the coating layer. In the hybrid coating layer with optimal composition, the decrease in magnetic permeability and saturation magnetization is suppressed.

실란 및 분산제가 Epoxy와 연자성 금속 파우더 복합체의 Packing에 미치는 영향 (The Effect of Silane and Dispersant on the Packing in the Composite of Epoxy and Soft Magnetic Metal Powder)

  • 이창현;신효순;여동훈;남산
    • 한국전기전자재료학회논문지
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    • 제30권12호
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    • pp.751-756
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    • 2017
  • A molding-type power inductor is an inductor that uses a hybrid material that is prepared by mixing a ferrite metal powder coated with an insulating layer and an epoxy resin, which is injected into a coil-embedded mold and heated and cured. The fabrication of molding-type inductors requires various techniques such as for coil formation and insertion, improving the magnetic properties of soft magnetic metal powder, coating an insulating film on the magnetic powder surface, and increasing the packing density by well dispersing the powder in the epoxy resin. Among these aspects, researches on additives that can disperse the metal soft magnetic powder having the greatest performance in the epoxy resin with high charge have not been reported yet. In this study, we investigated the effect of silanes, KBM-303 and KBM-403, and a commercial dispersant on the dispersion of metal soft magnetic powders in epoxy resin. The sedimentation height and viscosity were measured, and it was confirmed that the silane KBM-303 was suitable for dispersion. For this silane, the packing density was as high as about 72.49%. Moreover, when 1.2 wt% of dispersant BYK-103 was added, the packing density was about 80.5%.

CS졸을 이용한 Poly(epoxy-imide)-나노 Silica 하이브리드 필름의 합성과 유전특성 (Synthesis of Poly(epoxy-imide)-Nano Silica Hybrid Film via CS Sol-gel Process and Their Dielectric Properties)

  • 한세원;한동희;강동필;강영택
    • 한국전기전자재료학회논문지
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    • 제20권1호
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    • pp.35-40
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    • 2007
  • The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

영구 지반앵커에 대한 부식의 영향 평가 (Evaluation of Corrosion Effects on Permanent Ground Anchors)

  • Park, Hee-Mun;Park, Seong-Wan
    • 한국지반공학회논문집
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    • 제20권2호
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    • pp.27-36
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    • 2004
  • 극성저항 계측법과 전기화학 임피던스 분광학을 이용하여 영구적 지반 앵커의 부식율을 계측하는 절차를 제시하였다. 극성저항 계측법을 이용하여 대표지반의 종류와 철의 부식률에 관한 특성관계를 도출하였고, 전기화학 임피던스 분광학을 이용하여 시간의존 부식 반응과 다양한 종류의 코우팅 시스템의 평가, 그리고 시멘트 그라우팅이 부식에 미치는 영향에 대하여 각각 평가하였다. 실험 결과 점성토와 사질토의 pH 지수가 5이하인 경우 부식발생이 용이한 지반으로서 영구적 지반 앵커의 부식반응에 심각한 영향을 미치리라 판단된다. 또한 중성 또는 알카리성의 지반은 부식진행이 관찰되지 않았으며 부식률은 pH지수에 관계없이 일정한 결과를 보였다. 포설린 점성토의 경우 pH지수의 변화가 철의 부식에 매우 낮은 영향을 미쳤다. 한편 시멘트 그라우팅의 사용은 철의 부식율을 약 0.003-0.0lmm/y 정도로 낮출 수 있었으며 에폭시 혼합 코우팅의 경우도 부식의 영향을 받지않고 원 상태를 유지할 수 있어 매우 효과적으로 부식효과를 감소시킬 수 있었다.

빨간 색소를 함유한 자가치료제 마이크로캡슐 (Microcapsules Containing Self-Healing Agent with Red Dye)

  • 양광;이종근
    • 폴리머
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    • 제37권3호
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    • pp.356-361
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    • 2013
  • 본 연구에서는 5-ethylidene-2-norbornene(ENB)과 가교제가 혼합된 ENB 자가치료제에 melamine-urea-formaldehyde로 둘러싸인 마이크로캡슐을 제조하였다. 이때 자가치료제에는 빨간 색소를 첨가하여 관찰이 용이하도록 하였다. 마이크로캡슐의 열적 저항성과 캡슐의 크기 및 분포 그리고 형상을 관찰한 결과 우수한 캡슐이 제조된 것을 확인하였으며, 자가치료제에 빨간 색소의 첨가가 캡슐의 형성에 영향을 주지 않았다. 또한 마이크로캡슐과 Grubbs 촉매를 에폭시 코팅 층에 분산시킨 다음 이에 손상을 가하여 크랙을 유발하고 그것을 광학현미경으로 관찰한 결과, 크랙에 의해 캡슐이 파손되어 자가치료제가 흘러나와 크랙 면을 채우고 촉매와 반응하는 것을 알 수 있었다.

수동화재보호 재료가 적용된 구조부재의 화재하중에 대한 강도 특성 (Strength Characteristics of Passive Fire Protection Material Applied Structural Members on Fire Load)

  • 조상찬;유승수;서정관
    • 대한조선학회논문집
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    • 제59권1호
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    • pp.29-38
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    • 2022
  • In offshore installations, fires cause the structure to lose its rigidity and it leads to structural integrity and stability problems. The Passive Fire Protection (PFP) system slows the transfer rate of fire heat and helps prevent the collapse of structures and fatality. Especially, intumescent epoxy coating is widely used in the offshore industry, and not only is the material cost expensive, but it also takes a lot of time and cost for construction. Several studies have been conducted on the efficient application and optimal design of the PFP system. However, the mechanical properties and the strength of the PFP material have not been considered. In addition, researches on the correlation between the thickness of PFP and the structural behavior were insufficient. Therefore, this study aims to analyze the thermal and mechanical effects of the PFP on the structure when it is applied to the structural member. In particular, it is intended to resolve the change in strength characteristics of the structural members as the thickness of the PFP increases.

New Approach to Reduce Radiated Emissions from Semiconductor by Using Absorbent Materials

  • Kim, Soo-Hyung;Moon, Kyoung-Sik
    • 한국전자파학회지:전자파기술
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    • 제12권1호
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    • pp.34-41
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    • 2001
  • Semiconductors performing digital clocking are a main source of radiated emission noise. Therefore, the most secure method of reducing emission noise is to reduce emission radiated from semiconductors; an application of an absorber to the surface of semiconductors is one of these methods, too. However, in reality, it is difficult to achieve as much effect of noise reduction as expected by using only absorber. It is confirmed by experiment in this paper that a loop area within chip has no correlation with radiated emission noise and it is clarified why the existing absorber fails to achieve a satisfactory effect of emission noise reduction. Besides, a new type of chip coating absorber has been developed which can cover up to semiconductor out lead by using ferrite coating material of ferrite/epoxy acrylate substance using only permeability loss out of electromagnetic wave reduction characteristics of materials. As a result of evaluating radiated emission noise by applying this coating absorber to semiconductor device, it could be confirmed that emission noise decreased from about 3 ㏈ up to 20㏈ depending on frequency.

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돌리테스트로 고분자 코팅층과 금속 피착재의 접착강도 측정시 영향인자에 대한 연구 (Study on Influencing Factors of Adhesive Strength for Polymer Coating on Metal Adherend by Dolly Test)

  • 백주환;박현;이성인;하윤근;조영래
    • 마이크로전자및패키징학회지
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    • 제26권2호
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    • pp.1-8
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    • 2019
  • 금속, 세라믹스, 플라스틱 등 고체의 표면에 적용되는 접착제와 페인트 도장막의 수요와 중요성은 점점 증가하고 있다. 본 연구에서는 금속 피착재에 고분자 재료인 접착제 혹은 페인트 도장막을 적용할 때, 이들 고분자 코팅층과 금속 피착재 사이의 접착강도 측정시 영향인자에 대한 연구를 돌리테스트로 수행하였다. 접착제로는 2액형 에폭시 접착제가 사용되었으며, 페인트로는 방청용 2액형 에폭시 페인트인 EH2350가 사용되었다. 특히, 영향인자로는 피착재의 종류(Al, Fe, STS, Cu, Zn), 표면거칠기 및 표면오염(수돗물, 소금물) 등을 선택해서 접착강도에 미치는 영향에 대해 연구하였다. 접착제와 피착재의 접착강도는 동일한 접착제를 사용해도 피착재의 종류가 달라지면 다르게 나타났으며, 수돗물 혹은 소금물로 산화 오염된 피착재의 표면은 페인트 도장공정 이전에 수돗물로 스프레이 세척이 필수적임을 알았다. 본 연구의 결과로 돌리테스트는 도장막과 피착재의 접착강도를 측정하는데 향후 널리 사용될 수 있음을 확인하였다.

플라즈마 용사 열차폐 코팅의 열화에 따른 접착강도 평가 (Evaluation of Bond Strength of Isothermally Aged Plasma Sprayed Thermal Barrier Coating)

  • 김대진;이동훈;구재민;송성진;석창성;김문영
    • 대한기계학회논문집A
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    • 제32권7호
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    • pp.569-575
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    • 2008
  • In this study, disk type of thermal barrier coating system for gas turbine blade was isothermally aged in the furnace changing exposure time and temperature. For each aging condition, bond tests for three samples were conducted for evaluating degradation of adhesive or cohesive strength of thermal barrier coating system. For as-sprayed condition, the location of fracture in the bond test was in the middle of epoxy which have bond strength of 57 MPa. As specimens are degraded by thermal aging, bond strength gradually decreased and the location of failure was also changed from within top coat at the earlier stage of thermal aging to the interface between top coat and TGO at the later stage due to the delamination in the coating.