• Proceedings of the Korean Society of Crop Science Conference
• /
• 2020.06a
• /
• pp.142-142
• /
• 2020

• Proceedings of the Korean Society of Crop Science Conference
• /
• 2021.04a
• /
• pp.19-19
• /
• 2021

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.11 no.3
• /
• pp.153-161
• /
• 2011

In this work, we report the physics-based SPICE model of amorphous oxide semiconductor (AOS) thin-film transistors (TFTs) and demonstrate the SPICE simulation of amorphous InGaZnO (a-IGZO) TFT inverter by using Verilog-A. As key physical parameter, subgap density-of-states (DOS) is extracted and used for calculating the electric potential, carrier density, and mobility along the depth direction of active thin-film. It is confirmed that the proposed DOS-based SPICE model can successfully reproduce the voltage transfer characteristic of a-IGZO inverter as well as the measured I-V characteristics of a-IGZO TFTs within the average error of 6% at $V_{DD}$=20 V.

• Proceedings of the Membrane Society of Korea Conference
• /
• 2008.05a
• /
• pp.271-272
• /
• 2008

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.1049-1052
• /
• 2008

We developed novel molecular dynamics and quantum chemical molecular dynamics simulators for the design of MgO protecting layer in plasma display panel. These simulators were applied to the investigations on the destruction processes of the MgO protecting layer as well as the evaluation of its second electron emission ability. From the simulation results, we successfully proposed new guidelines for MgO protecting layer with high durability and high second electron emission ability.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.722-723
• /
• 2006

A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

• Journal of Microbiology and Biotechnology
• /
• v.29 no.2
• /
• pp.179-190
• /
• 2019

Bacillus subtilis spore surface display (BSSD) technology is considered to be one of the most promising approaches for expressing heterologous proteins with high activity and stability. Currently, this technology is used for various purposes, such as the production of enzymes, oral vaccines, drugs and multimeric proteins, and the control of environmental pollution. This paper presents an overview of the latest developments in BSSD technology and its application in protein engineering. Finally, the major limitations of this technology and future directions for its research are discussed.

• Proceedings of the Membrane Society of Korea Conference
• /
• 2008.05a
• /
• pp.151-153
• /
• 2008

• Proceedings of the Korean Magnestics Society Conference
• /
• 2007.05a
• /
• pp.138.1-138.1
• /
• 2007

• Proceedings of the Korean Magnestics Society Conference
• /
• 2007.05a
• /
• pp.105.2-105.2
• /
• 2007