Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy

  • Kim, J.S. (School of Engineering Mechanical and Manufacturing Engineering, University of Birmingham) ;
  • Chang, I.T. (School of Engineering, Metallurgy and Materials School of Engineering, University of Birmingham) ;
  • Falticeanu, C.L. (School of Engineering, Metallurgy and Materials School of Engineering, University of Birmingham) ;
  • Davies, G.J. (School of Engineering, Metallurgy and Materials School of Engineering, University of Birmingham) ;
  • Jiang, K.C. (School of Engineering Mechanical and Manufacturing Engineering, University of Birmingham)
  • Published : 2006.09.24
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Abstract

A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

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