Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 2006.09b
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- Pages.722-723
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- 2006
A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy
- Kim, J.S. (School of Engineering Mechanical and Manufacturing Engineering, University of Birmingham) ;
- Chang, I.T. (School of Engineering, Metallurgy and Materials School of Engineering, University of Birmingham) ;
- Falticeanu, C.L. (School of Engineering, Metallurgy and Materials School of Engineering, University of Birmingham) ;
- Davies, G.J. (School of Engineering, Metallurgy and Materials School of Engineering, University of Birmingham) ;
- Jiang, K.C. (School of Engineering Mechanical and Manufacturing Engineering, University of Birmingham)
- Published : 2006.09.24
Abstract
A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.
Keywords
- micron-sized aluminium powder;
- nano-sized alloying powder;
- thermogravimetric analysis (TGA);
- differential scanning calorimetry (DSC);
- X-ray diffractrometry (XRD)