• 제목/요약/키워드: Embedded ring

검색결과 53건 처리시간 0.032초

광인터넷망에서 Cut-Set을 이용한 예비대역폭 비율 분석 (Analysis of Spare Capacity Ratio in Optical Internet using Cut-Set)

  • 김태현;황호영
    • 한국인터넷방송통신학회논문지
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    • 제12권5호
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    • pp.197-203
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    • 2012
  • 본 논문에서는 광파장다중화(WDM) 기반 광인터넷 환경에서 논리적인 다중 링 구조에 의한 통신망 복구 기법의 대역폭 효율성을 연구한다. 이 방법은 링 토폴로지의 특성을 이용해 빠르고 간단한 복구 동작을 제공하며, 지역적인 복구를 수행한다. 동시에 다중 링 구성을 통하여 대체 경로의 분산과 공유 정도를 높이고 단위 링크당 예약되어야 하는 예비 광파장의 수를 줄임으로써 전체 통신망 자원 이용의 효율성을 높일 수 있다. 본 논문에서는 위험공유링크그룹(SRLG) 개념을 이용하여 링크 손실을 복구하는데 필요한 예비대역폭 비율을 토폴로지상의 Cut-Set을 이용해 계산하고 이를 실험을 통해 비교 확인하였다.

Efficient Fault-Recovery Technique for CGRA-based Multi-Core Architecture

  • Kim, Yoonjin;Sohn, Seungyeon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제15권2호
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    • pp.307-311
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    • 2015
  • In this paper, we propose an efficient fault-recovery technique for CGRA (Coarse-Grained Reconfigurable Architecture) based multi-core architecture. The proposed technique is intra/inter-CGRA co-reconfiguration technique based on a ring-based sharing fabric (RSF) and it enables exploiting the inherent redundancy and reconfigurability of the multi-CGRA for fault-recovery. Experimental results show that the proposed approaches achieve up to 73% fault recoverability when compared with completely connected fabric (CCF).

EPICS를 이용한 가속기 진공장치 감시 시스템 개발 (EPICS Based Vacuum Monitoring System for PAL Storage Ring)

  • 윤종철;이진원;황정연;남상훈
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 하계학술대회 논문집 D
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    • pp.2344-2346
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    • 2002
  • A vacuum control system has been developed for using Ethernet Multi Serial Device Severs (EMSDS) for the Pohang Accelerator Laboratory (PAL) storage ring. There are 124 vacuum ion pumps at the storage ring. It was a very important problem to solve the problem how to control such a big number of vacuum pumps distributed around the ring. After discussions, we decided to develop a serial to ethernet interrace device sever that will be mounted in the control system rack. It has a 32-bits microprocessor embedded Linux, 12 ports RS485 (or RS232) slave interface. one channel 10/100BaseTx ethernet host port, one channel UART host port, and 16 Mbytes large memory buffer. These vacuum pumps are connected to Ion-Pump serial controllers, which chop the AC current so as to control the current in the pumps. The EMSDS connect either 100BaseTx or 10BaseT ethernet networks to asynchronous serial ports for communication with serial device. It can simultaneously control up to 12 ion-pump serial controllers. 12 EMSDS are connected to a personal computer (PC) through the network. The PC can automatically control the EMSDS by sending a set of commands through the TCP/IP network. Upon receiving a command from a PC running under Windows2000 through the network, the EMSDS communicate through the stave serial interrace ports to ion-pump controller. We added some software components on the top of EPICS (Experimental Physics and Industrial Control System) toolkit.

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Development of smart transducer with embedded sensor for automatic process control of ultrasonic wire bonding

  • Or, Siu Wing;Chan, Helen Lai Wa;Liu, Peter Chou Kee
    • Smart Structures and Systems
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    • 제1권1호
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    • pp.47-61
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    • 2005
  • A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

CONTACT PRESSURE DISTRIBUTION OF RADIAL TIRE IN MOTION WITH CAMBER ANGLE

  • 김석남
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 추계학술대회논문집A
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    • pp.387-394
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    • 2000
  • Theoretical and experimental study is conducted on the contact pressure distribution of a radial tire in motion under various camber angles. Tire construction is modelled by a spring bedded elastic ring, consisted of sidewall springs and a composite belt ring. The contact area is assumed to be a trapezoidal shape varying with camber angles and weighted load. The basic equation in a quasi-static form is derived for the deformation of a running belt with a constant velocity by the aid of Lagrange-Euler transformation. Galerkin's method and stepwise calculation are applied for solving the basic equation and the mechanical boundary condition along both sides of the contact belt part subjected to shearing forces transmitted from the sidewall spring. Experimental results on the contact pressure, measured by pressure sensors embedded in the surface of the drum tester, correspond well with the calculated ones for the test tire under various camber angles, running velocities and weighted loads. These results indicate that a buckling phenomenon of the contact belt in the widthwise direction occurs due to the effect of camber angle.

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X-ray micro-CT 이미지 내 패임 및 동심원상 화상결함 제거를 위한 이미지 보정 기법 (Image Calibration Techniques for Removing Cupping and Ring Artifacts in X-ray Micro-CT Images)

  • 정연종;윤태섭;김광염;주진현
    • 한국지반공학회논문집
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    • 제27권11호
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    • pp.93-101
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    • 2011
  • X-ray micro-CT를 이용한 지반재료 내부 미세구조 및 공극구조의 정밀한 이미지 처리는 종종 이미지 내에 원천적으로 포함되는 화상결함으로 인해 제약된다. 본 논문에서는 X-ray micro-CT 이미지에 가장 일반적으로 나타나는 화상결함인 패임(영상 외곽과 중심부의 명암 차이) 및 동심원상(영상 중심으로부터 방사방향으로 연속적으로 나타나는 원)을 제거할 수 있는 이미지 보정 기법을 제시한다. 결함 제거는 좌표 변환법, 정규화 및 2차원 푸리에 변환에 의한 저역 통과 필터링 기법의 순차적 적용을 통해 이루어진다. 이미지 처리 기법의 효과를 다공성 현무암의 CT 이미지에서 화상결함들을 제거하고 이진화 후 적층하여 3차원 공극 구조를 추출하는 과정을 통해 설명하였다. 패임 및 동심원상 결함을 제거한 이미지와 원본 이미지의 비교 결과 결함 제거는 대상 재료 공극률의 과대평가를 방지할 수 있으며, 따라서 화상결함의 적절한 보정은 X-ray CT의 지반재료 적용 시 필수적인 과정으로 판단된다.

Energy-Efficient and High Performance CGRA-based Multi-Core Architecture

  • Kim, Yoonjin;Kim, Heesun
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권3호
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    • pp.284-299
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    • 2014
  • Coarse-grained reconfigurable architecture (CGRA)-based multi-core architecture aims at achieving high performance by kernel level parallelism (KLP). However, the existing CGRA-based multi-core architectures suffer from much energy and performance bottleneck when trying to exploit the KLP because of poor resource utilization caused by insufficient flexibility. In this work, we propose a new ring-based sharing fabric (RSF) to boost their flexibility level for the efficient resource utilization focusing on the kernel-stream type of the KLP. In addition, based on the RSF, we introduce a novel inter-CGRA reconfiguration technique for the efficient pipelining of kernel-stream on CGRA-based multi-core architectures. Experimental results show that the proposed approaches improve performance by up to 50.62 times and reduce energy by up to 50.16% when compared with the conventional CGRA-based multi-core architectures.

FPGA기반의 KTX용 실시간 제어네트워크$(Tonard^*)$ 물리계층 개발 (The development of the KTX realtime control network$(Tornad^*)$ physical layer based on FPGA)

  • 황승곤;박재현
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2007년도 춘계학술대회 논문집
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    • pp.1735-1740
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    • 2007
  • Communication network in KTX (Korea Train eXpress), the express train system, has to transmit status variables periodically within tens of seconds and real-time control informations which has short reply like status transition or alarm. KTX uses $Tornad^*$ (TOken Ring Network Alsthom Device) network for this purpose. This network can send and receive messages which enable express train applications embedded in intelligence boards to communicate by itself. Layer 1, 2 of $Tornad^*$ is implemented with differential manchester encoding and IEEE 802.4 standard(token bus standard) respectively. To implement layer 1 and 2, we implemented twisted pair modem using FPGA for layer 1 and used MC68824 from Motorola for layer 2. MC68824 bus arbitration and memory controller is implemented using CPLD.

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Dynamic Redundancy-based Fault-Recovery Scheme for Reliable CGRA-based Multi-Core Architecture

  • Kim, Yoonjin;Sohn, Seungyeon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제15권6호
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    • pp.615-628
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    • 2015
  • CGRA (Coarse-Grained Reconfigurable Architecture) based multi-core architecture can be considered as a suitable solution for the fault-tolerant computing. However, there have been a few research projects based on fault-tolerant CGRA without exploiting the strengths of CGRA as well as their works are limited to single CGRA. Therefore, in this paper, we propose two approaches to enable exploiting the inherent redundancy and reconfigurability of the multi-CGRA for fault-recovery. One is a resilient inter-CGRA fabric that is ring-based sharing fabric (RSF) with minimal interconnection overhead. Another is a novel intra/inter-CGRA reconfiguration technique on RSF for maximizing utilization of the resources when faults occur. Experimental results show that the proposed approaches achieve up to 94% faulty recoverability with reducing area/delay/power by up to 15%/28.6%/31% when compared with completely connected fabric (CCF).

스트레인 게이지를 이용한 후방압출금형의 변형측정에 관한 연구 (A Study on the Deformation Measurement of Backward Extrusion Dies using Strain Gauge)

  • 여홍태;송요선;최영;허관도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.713-716
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    • 2002
  • The dimensional accuracy of the cold forged products is strongly dependent on the elastic behavior of the die. The elastic deformation of the die is continuously changed during the process. Therefore, it is needed to measure the deformation of die. Strain gauges are used to measure the elastic strains in the die during cold backward extrusion process. The strain gauges are attached on the die surface and embedded at the interface between the die insert and the stress ring. In order to compare the results with the FE-analysis, the rigid-plastic FE-analysis of cold backward extrusion process using DEFORM-3D has been performed, and the analysis of elastic deformation of the die has been done by using ANSYS with non-linear contact.

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